NVIDIA announced an extensive collaboration with Tata Group to deliver AI computing infrastructure and platforms for developing AI solutions. The collaboration will bring state-of-the-art AI capabilities within reach to thousands of organizations, businesses, AI researchers, and hundreds of startups in India. The companies will work together to build an AI supercomputer powered by the next-generation NVIDIA GH200…
Rohde & Schwarz and ETS-Lindgren partner on 5G A-GNSS antenna performance testing
ETS-Lindgren and Rohde & Schwarz are continuing their long-term collaboration and have enabled antenna performance measurements with comprehensive assisted global navigation satellite system (A-GNSS) capabilities for 5G NR. The R&S CMX500 OBT wide-band radio communication tester and the R&S SMBV100B GNSS simulator in conjunction with EMQuest software from ETS-Lindgren support current and evolving 5G NR…
Samsung and AMD partner to advance network transformation With vRAN
Samsung Electronics announced a new collaboration with AMD to advance 5G virtualized RAN (vRAN) for network transformation. This collaboration represents Samsung’s ongoing commitment to enriching vRAN and Open RAN ecosystems to help operators build and modernize mobile networks with unmatched flexibility and optimized performance. The two companies have completed several rounds of tests at Samsung’s lab to…
Infineon and Infypower partner to advance EV charger market
Power semiconductors based on silicon carbide (SiC) offer several advantages like high efficiency, power density, voltage resistance, and reliability. This creates opportunities for new applications and improved charging station technology innovations. Infineon Technologies announced a collaboration with Infypower, a Chinese provider of new energy vehicle charging. Infineon will provide INFY with the industry-leading 1200 V…
Mahindra becomes first global automaker to use Snapdragon Data Insights
Qualcomm Technologies and Mahindra & Mahindra, a pioneer in the SUV segment in India, announced the companies’ strategic collaboration to use the Snapdragon Digital Chassis Solution cloud-connected services platform — an integrated, flexible services suite for connected cars — for upcoming Mahindra’s range of authentic SUVs. As a key component of the cloud-connected services platform,…
BMW to integrate Snapdragon Digital Chassis
BMW Group and Qualcomm Technologies announced that they have extended their technology collaboration beyond driver assistance and automated driving technologies. The companies are bringing the latest Snapdragon Digital Chassis Solution advancements to power BMW Group’s new vehicles for safer, smarter, and more sophisticated experiences for drivers and passengers. Leveraging both companies’ expertise in innovation, BMW…
Sindcon adding LoRaWAN wireless microcontrollers to its smart meteres
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, announced its collaboration with Sindcon (Singapore) IoT Technology Pte, a smart meter provider based in Singapore. The project is adding STM32WLE5 LoRaWAN wireless microcontrollers from ST into Sindcon’s network of more than 50,000 water, gas, and energy meters in Jakarta, Indonesia. “The STM32WLE5…
JLR vehicles to feature 5G, Wi-Fi, and C-V2X capabilities
Qualcomm Technologies and JLR announced that the companies will work together to bring 5G capabilities to select next-generation JLR vehicles across its brands Range Rover, Defender, Discovery, and Jaguar. As a part of JLR’s efforts in building a sustainability-rich vision of modern luxury by design, the ongoing technology collaboration between Qualcomm Technologies and JLR aims…
Intel and Ericsson partner to advance next-gen optimized 5G infrastructure
Intel announced a strategic collaboration agreement with Ericsson to use Intel’s 18A process and manufacturing technology for Ericsson’s future next-generation optimized 5G infrastructure. As part of the agreement, Intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson to create highly differentiated leadership products for future 5G infrastructure. Additionally, the companies will expand their collaboration to…
Infineon and Semikron Danfoss sign supply agreement for electromobility chips
Vehicles with fully or partially electrified drivetrains will account for two-thirds of cars produced by 2028, as per analyst forecasts. This rapid growth of electromobility is driving the demand for power semiconductors. Against this background, Infineon Technologies and Semikron Danfoss have signed a multi-year volume agreement for the supply of silicon-based electromobility chips. Infineon will…
Keysight enables Quectel to complete 5G RedCap
Keysight Technologies recently enabled Quectel to verify that its Internet of things (IoT) wireless modules support the latest 5G reduced capability (RedCap) and non-terrestrial networks (NTN) features by establishing end-to-end data call connections using the Keysight S8711A UXM 5G Test Application. This achievement accelerates Quectel’s development of 3GPP 5G Release 17 (Rel-17) compliant designs. Based on the…
Qualcomm to collaborate with Sony on its future smartphones
Qualcomm Technologies announced that it has extended its collaboration with Snapdragon platforms powering Sony’s future smartphones. The companies agreed to work together on the next generations of premium, high, and mid-tier smartphones. Through this collaboration, both companies aim to push the boundaries of what’s possible in mobile technology, delivering unparalleled user experiences and driving progress…
Keysight to acquire ESI Group
Keysight Technologies announced its intention to acquire the entire share capital of ESI Group SA at a price per share of 155 euros in cash. The acquisition values ESI Group’s entire share capital at 913 million euros on a fully diluted basis. Founded in 1973, ESI Group is a leading innovator of virtual prototyping solutions…
Infineon and eleQtron developing three generations of quantum processor units
Infineon Technologies and eleQtron GmbH, a pioneer in quantum computing (QC) from Siegen, North Rhine Westfalia, Germany, announced a partnership to jointly develop trapped ion quantum processor units (QPUs) for scalable quantum computers. This second Infineon partnership with a key player in the ion-trap field is the first commercial activity in the German QC ecosystem.…
Nexperia joins United Nations Global Compact Initiative
Nexperia, an expert in essential semiconductors, announced that it has joined the United Nations Global Compact initiative — a voluntary leadership platform for the development, implementation, and disclosure of responsible business practices. With this announcement, Nexperia says it’s proud to join thousands of other companies globally committed to taking responsible business action to create the…
Airbus and STMicroelectronics collaborate on advancing aircraft electrification
Airbus, a global pioneer in the aerospace industry, and STMicroelectronics, a global semiconductor provider, have signed an agreement to cooperate on power electronics Research & Development to support more efficient and lighter power electronics, essential for future hybrid-powered aircraft and full-electric urban air vehicles. The collaboration builds on evaluations already conducted by both companies to explore…
STMicroelectronics and Sanan Optoelectronics to advance silicon-carbide ecosystem
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, and Sanan Optoelectronics (SHA.600703), a provider of compound semiconductors in China, announced that they have signed an agreement to create a new 200mm silicon-carbide (SiC) device manufacturing JV. The new SiC fab has a target of production in Q4 2025, with a…
Renesas completes acquisition of Panthronics
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, recently announced its successful completion of acquiring Panthronics AG, a fabless semiconductor company specializing in high-performance wireless products. The acquisition was completed this June, following required regulatory approval. Renesas also announced 13 “Winning Combination” solution designs that combine Renesas’ products with Panthronics’ unique Near-Field Communication (NFC)…
Keysight makes UK’s first 100Gbps 6G sub-THz connection
Keysight Technologies, Inc., in collaboration with the National Physical Laboratory (NPL) and the University of Surrey, has made the first 6G connection at speeds greater than 100 gigabits per second (Gbps) over sub-terahertz (THz) frequencies in the U.K. Future 6G use cases, such as augmented reality and autonomous vehicles, will require data throughput speeds from…
ZF relying on STMicroelectronics for silicon carbide devices
The technology group ZF will, from 2025, purchase silicon carbide devices from STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications. Under the terms of the multi-year contract, ST will supply a volume of double-digit millions of silicon carbide devices to be integrated into ZF’s new modular inverter architecture going into series production in…