Alliance Memory has introduced new 8Mb and 16Mb x 32 devices in the 90-ball 8 mm by 13 mm TFBGA package in order to meet the demand for high-density fast CMOS SRAMs. Dimensionally, 8Mb AS7C325632-10BIN and 16Mb AS7C351232-10BIN are configured as 256K x 32 and 512K x 32, respectively. These feature access times of 10 ns and minimum data retention voltages of 1.5 V. 

 

This SRAMs offer space-savvy alternatives to solutions in larger 119-ball packages. As far as the applications are concerned, the devices have been optimised for networking routers and switches, test and medical equipment, and automotive applications. 

 

The components are RoHS-compliant, free from halogen, and operate over a temperature range of -40°C to +85°C. Besides, these consume low power with an operating current of 125mA typical and standby current of 4mA typical. These SRAMs operate from a single power supply of 3.3V and offer tri-state output.

 

 

The AS7C325632-10BIN and AS7C351232-10BIN are the latest additions to the company’s current range of SRAM lineup including devices with densities from 64K to 16M. These ICs have been fabricated using high-performance and highly reliable CMOS technology to provide drop-in, pin-for-pin-compatible replacements for a number of similar solutions. 

 

 

Alliance Memory is a worldwide provider of critical and hard-to-find DRAM and SRAM memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes DRAMs and SRAMs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kb to 8Gb. Privately held, Alliance Memory maintains headquarters in San Carlos, California, and regional offices in Europe, Asia, and South America.