Samtec has expanded its SMPM Magnum RF product family with a new low-profile 3.94 mm (.155″) body height, right-angle option designed for channel density in low- or mid-band systems. The GPPC Series offers a low-profile, right-angle multi-port solution with performance up to 50 GHz. Magnum RF products are designed for space-limited applications requiring high operating frequencies,…
Moxa launches compact, cost-effective ARM-based embedded computer for industrial applications
Moxa introduced its first embedded industrial computers to feature 64-bit ARM architecture to help asset owners address increased processing demands from new technologies. Built around an Arm Cortex-A53 dual-core 1 GHz processor, Moxa’s UC-2200A is an economical, reliable gateway for embedded data acquisition boasting a wide range of interface options, a compact footprint, and compliance with IEC 62443-4-2 cybersecurity…
Rohde & Schwarz and ETS-Lindgren partner on 5G A-GNSS antenna performance testing
ETS-Lindgren and Rohde & Schwarz are continuing their long-term collaboration and have enabled antenna performance measurements with comprehensive assisted global navigation satellite system (A-GNSS) capabilities for 5G NR. The R&S CMX500 OBT wide-band radio communication tester and the R&S SMBV100B GNSS simulator in conjunction with EMQuest software from ETS-Lindgren support current and evolving 5G NR…
Samsung and AMD partner to advance network transformation With vRAN
Samsung Electronics announced a new collaboration with AMD to advance 5G virtualized RAN (vRAN) for network transformation. This collaboration represents Samsung’s ongoing commitment to enriching vRAN and Open RAN ecosystems to help operators build and modernize mobile networks with unmatched flexibility and optimized performance. The two companies have completed several rounds of tests at Samsung’s lab to…
BMW to integrate Snapdragon Digital Chassis
BMW Group and Qualcomm Technologies announced that they have extended their technology collaboration beyond driver assistance and automated driving technologies. The companies are bringing the latest Snapdragon Digital Chassis Solution advancements to power BMW Group’s new vehicles for safer, smarter, and more sophisticated experiences for drivers and passengers. Leveraging both companies’ expertise in innovation, BMW…
JLR vehicles to feature 5G, Wi-Fi, and C-V2X capabilities
Qualcomm Technologies and JLR announced that the companies will work together to bring 5G capabilities to select next-generation JLR vehicles across its brands Range Rover, Defender, Discovery, and Jaguar. As a part of JLR’s efforts in building a sustainability-rich vision of modern luxury by design, the ongoing technology collaboration between Qualcomm Technologies and JLR aims…
Intel and Ericsson partner to advance next-gen optimized 5G infrastructure
Intel announced a strategic collaboration agreement with Ericsson to use Intel’s 18A process and manufacturing technology for Ericsson’s future next-generation optimized 5G infrastructure. As part of the agreement, Intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson to create highly differentiated leadership products for future 5G infrastructure. Additionally, the companies will expand their collaboration to…
Keysight enables Quectel to complete 5G RedCap
Keysight Technologies recently enabled Quectel to verify that its Internet of things (IoT) wireless modules support the latest 5G reduced capability (RedCap) and non-terrestrial networks (NTN) features by establishing end-to-end data call connections using the Keysight S8711A UXM 5G Test Application. This achievement accelerates Quectel’s development of 3GPP 5G Release 17 (Rel-17) compliant designs. Based on the…
Rohde & Schwarz to showcase the future of broadcasting at CABSAT
Rohde & Schwarz, a global provider of broadcast distribution, is once again exhibiting at CABSAT (stand S1-I20, Dubai World Trade Centre, May 16-18, 2023). The company will take the opportunity to showcase its commitment to meeting industry expectations for advanced functionality, high availability, reliability, and support. It will also show how its products and solutions…
Renesas and AMD to demo digital front-end design for 5G active antenna systems
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced plans to showcase a full RF front-end solution for 5G Active Antenna Systems (AAS) radios in collaboration with AMD. Paired with the field-proven AMD Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design, the RF front end includes RF switches, low-noise amplifiers…
MISIC Microelectronics chooses Keysight’s modulation distortion solution
Keysight Technologies, Inc., a technology company that delivers design and validation solutions to help accelerate innovation to connect and secure the world, announced that MISIC Microelectronics has selected the Keysight S930705B Modulation Distortion solution to enable the fast and accurate active-device modulation distortion characterization of the company’s microwave devices and components. Demand for higher data throughput and lower…
Qualcomm offers the world’s first 5G NR-light modem-RF system
Qualcomm Technologies, Inc. announced Snapdragon X35 5G Modem-RF System, the world’s first 5G NR-Light modem-RF system. NR-Light, a new class of 5G, fills the gap in between high-speed mobile broadband devices and extremely low-bandwidth NB-IoT devices. NR-Light devices, powered by Snapdragon X35, can be smaller, more cost-efficient, and provide longer battery life than traditional mobile…
Keysight combines 5G and GNSS technology for advanced location services
Keysight Technologies, Inc., a technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that it is first to gain Global Certification Forum (GCF) validation of a 5G location-based services (LBS) Assisted Galileo (A-Galileo) test case by combining 5G new radio (NR) and global navigation…
Microchip Technology releases AVR-IoT Cellular Mini Development Board
IoT network developers are looking for an easy path to implement a secure cellular connection in their design applications but are faced with design complexities and high deployment costs. To offer a solution for network designers who need the ultimate in location flexibility, low-power consumption, and deployment simplicity, Microchip Technology announced the AVR-IoT Cellular Mini…
Qualcomm acquires Cellwize to accelerate 5G adoption and spur infrastructure innovation
Qualcomm Technologies, Inc. recently announced that it has acquired Cellwize Wireless Technologies Pte., a provider in mobile network automation and management. Cellwize’s 5G network deployment, automation, and management software platform capabilities strengthen Qualcomm Technologies’ 5G Radio Access Networks (RAN) infrastructure solutions to fuel the digital transformation of industries, power the connected intelligent edge, and support the…
MediaTek’s chipset offers high-performance option for 5G smartphones
MediaTek has announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient. The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm…
STMicroelectronics and MACOM announce successful RF GaN-on-Si prototypes
STMicroelectronics, a global semiconductor provider, and MACOM Technology Solutions Holdings, a supplier of semiconductor products for the telecommunications, industrial, defense, and datacenter industries, have announced the successful production of radio-frequency Gallium-Nitride-on Silicon (RF GaN-on-Si) prototypes. With this achievement, ST and MACOM will continue to work together and enhance our relationship. RF GaN-on-Silicon offers high potential for…
STMicroelectronics launches new MDmesh MOSFETs
STMicroelectronics’ STPOWER MDmesh M9 and DM9 N-channel super-junction, multi-drain, silicon-power MOSFETs are ideal for switched-mode power supplies (SMPS) in applications from data-center servers and 5G infrastructure to flat-panel televisions. The first devices to be launched are the 650V STP65N045M9 and the 600V STP60N043DM9. Both have low on-resistance (RDS(on)) per unit area, which maximizes power density and permits compact system dimensions. Each has…
New semiconductor collaboration to advance next-generation FD-SOI roadmap
CEA, Soitec, GlobalFoundries, and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next-generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology. “ST was an early innovator in FD-SOI and has been in production for several years, with both custom and standard advanced products for a broad range of end-markets,”…
MediaTek launches Dimensity 8000 5G chip series for 5G smartphones
MediaTek has launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology — connectivity, displays, gaming, as well as multimedia and imaging features — to premium 5G smartphones. Both chips borrow the advanced technology from MediaTek’s powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which…