Rohde & Schwarz, a global provider of broadcast distribution, is once again exhibiting at CABSAT (stand S1-I20, Dubai World Trade Centre, May 16-18, 2023). The company will take the opportunity to showcase its commitment to meeting industry expectations for advanced functionality, high availability, reliability, and support. It will also show how its products and solutions…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced plans to showcase a full RF front-end solution for 5G Active Antenna Systems (AAS) radios in collaboration with AMD. Paired with the field-proven AMD Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design, the RF front end includes RF switches, low-noise amplifiers…

Keysight Technologies, Inc., a technology company that delivers design and validation solutions to help accelerate innovation to connect and secure the world, announced that MISIC Microelectronics has selected the Keysight S930705B Modulation Distortion solution to enable the fast and accurate active-device modulation distortion characterization of the company’s microwave devices and components. Demand for higher data throughput and lower…

Qualcomm Technologies, Inc. announced Snapdragon X35 5G Modem-RF System, the world’s first 5G NR-Light modem-RF system. NR-Light, a new class of 5G, fills the gap in between high-speed mobile broadband devices and extremely low-bandwidth NB-IoT devices. NR-Light devices, powered by Snapdragon X35, can be smaller, more cost-efficient, and provide longer battery life than traditional mobile…

Keysight Technologies, Inc., a technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that it is first to gain Global Certification Forum (GCF) validation of a 5G location-based services (LBS) Assisted Galileo (A-Galileo) test case by combining 5G new radio (NR) and global navigation…

IoT network developers are looking for an easy path to implement a secure cellular connection in their design applications but are faced with design complexities and high deployment costs. To offer a solution for network designers who need the ultimate in location flexibility, low-power consumption, and deployment simplicity, Microchip Technology announced the AVR-IoT Cellular Mini…

Qualcomm Technologies, Inc. recently announced that it has acquired Cellwize Wireless Technologies Pte., a provider in mobile network automation and management. Cellwize’s 5G network deployment, automation, and management software platform capabilities strengthen Qualcomm Technologies’ 5G Radio Access Networks (RAN) infrastructure solutions to fuel the digital transformation of industries, power the connected intelligent edge, and support the…

MediaTek has announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient. The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm…

STMicroelectronics, a global semiconductor provider, and MACOM Technology Solutions Holdings, a supplier of semiconductor products for the telecommunications, industrial, defense, and datacenter industries, have announced the successful production of radio-frequency Gallium-Nitride-on Silicon (RF GaN-on-Si) prototypes. With this achievement, ST and MACOM will continue to work together and enhance our relationship. RF GaN-on-Silicon offers high potential for…

STMicroelectronics’ STPOWER MDmesh M9 and DM9 N-channel super-junction, multi-drain, silicon-power MOSFETs are ideal for switched-mode power supplies (SMPS) in applications from data-center servers and 5G infrastructure to flat-panel televisions. The first devices to be launched are the 650V STP65N045M9 and the 600V STP60N043DM9. Both have low on-resistance (RDS(on)) per unit area, which maximizes power density and permits compact system dimensions. Each has…

CEA, Soitec, GlobalFoundries, and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next-generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology. “ST was an early innovator in FD-SOI and has been in production for several years, with both custom and standard advanced products for a broad range of end-markets,”…

MediaTek has launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology — connectivity, displays, gaming, as well as multimedia and imaging features — to premium 5G smartphones. Both chips borrow the advanced technology from MediaTek’s powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which…

Qualcomm Technologies has announced the Snapdragon X70 5G Modem-RF System, its 5th generation modem-to-antenna 5G solution. Snapdragon X70 introduces the world’s first 5G AI processor in a modem-RF system, to harness the power of AI for breakthrough 5G performance with 10 Gigabit 5G downloads — offering fast upload speeds, low latency, coverage, and power efficiency.…

Qualcomm Technologies is collaborating with Cybertrust Japan Co. and SB Technology Corp. to support the deployment of smart solutions through the Qualcomm IoT Services Suite so as to better help businesses and entities looking to adopt and integrate smart solutions. This will first begin in Japan, with intent to expand globally in the future. Through…

Qualcomm Technologies, Vodafone, and Thales have joined forces to demonstrate a working smartphone, featuring iSIM (based on the ieUICC GSMA specification), a new technology enabling the functionality of a SIM card to be integrated into a device’s main processor. This milestone paves the way for commercialization of the technology, which could be rolled out in…

Analog Devices, Inc. (ADI) has announced a breakthrough RadioVerse System-on-Chip (SoC) series, providing radio-unit (RU) developers with an agile and cost-effective platform to create the most energy efficient 5G RUs in the industry. The new SoC series provides advanced RF signal processing with expanded digital functionality and RF capacity that greatly improves 5G RU performance…

Ericsson, Telstra, and Qualcomm Technologies have achieved the highest uplink peak rate ever recorded on a commercial network during a live demo in Queensland, Australia. Together, they reached an uplink data speed of close to 1Gbps, paving the way for more seamless experiences in use cases, such as live video streaming and social media content…

MediaTek recently validated Micron Technology’s low-power, double data rate 5X (LPDDR5X) DRAM for MediaTek’s new Dimensity 9000 5G flagship chipset for smartphones. Micron is the first semiconductor company to sample and validate this fastest, most advanced mobile memory in the industry and has shipped the first batch of samples of LPDDR5X built on its first-to-market…

Microchip Technology Inc. recently announced a significant expansion of its gallium-nitride (GaN), radio-frequency (RF). power-device portfolio with new MMICs and discrete transistors that cover frequencies up to 20 gigahertz (GHz). The devices combine high power-added efficiency (PAE) and high linearity to deliver new levels of performance in applications — ranging from 5G to electronic warfare, satellite communications, commercial…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its 5G beamformer IC family with two dual-polarization mmWave devices, optimized for 2×2 antenna architecture for 5G and broadband wireless applications — with best-in-class performance at n257, n258, and 261 bands. The highly integrated F5288 and F5268 transmitter/receiver (8T8R) chipsets sit on a small…