United Electronic Industries (UEI) announces the launch of its latest innovation, the DNR-MIL-4 4-slot military-grade I/O system designed to meet the rigorous demands of the aerospace and defense industries. This advanced system delivers unmatched reliability and performance in the most challenging environments. Engineered to comply with MIL-STD-810G, MIL-STD-1275/708, and MIL-STD-461F standards, the compact and rugged…
High-performance SMARC modules from Congatec expand edge AI capabilities
Congatec has introduced new high-performance computer-on-modules (COMs) featuring i.MX 95 processors from NXP. This addition expands Congatec’s module portfolio, which includes low-power NXP i.MX Arm processors. The new modules offer straightforward scalability and reliable upgrade paths for energy-efficient edge AI applications with high security requirements. These modules provide up to three times the GFLOPS computing…
Radiation- and fault-tolerant MPUs released by Microchip Technology
Microchip Technology has launched the first devices in its planned family of PIC64 High-Performance Spaceflight Computing (PIC64-HPSC) microprocessors (MPUs) to support the diverse and growing global space market’s expanding computational needs, including more autonomous applications. The radiation- and fault-tolerant PIC64-HPSC MPUs, delivered to NASA and the broader defense and commercial aerospace industry, integrate widely adopted…
Mobix Labs introduces EMI filtered connectors for aerospace and defense
Mobix Labs Inc. has launched new EMI filtered ARINC 404 and ARINC 600 connectors for defense and aerospace applications. These connectors can be customized with planar arrays, ceramic Pi Tubes, or chip capacitors to meet military specifications, balancing cost, quality, and performance. The connectors are designed to provide reliable performance with EMI filtering options to…
Samtec expands RF product line for high-density applications
Samtec has expanded its SMPM Magnum RF product family with a new low-profile 3.94 mm (.155″) body height, right-angle option designed for channel density in low- or mid-band systems. The GPPC Series offers a low-profile, right-angle multi-port solution with performance up to 50 GHz. Magnum RF products are designed for space-limited applications requiring high operating frequencies,…
Infineon Technologies introduces rad-hard 1 and 2 Mb parallel interface F-RAM devices
Infineon Technologies AG has announced the availability of the industry’s first radiation-hardened (rad hard) 1 and 2 Mb parallel interface ferroelectric-RAM (F-RAM) nonvolatile memory devices. These new additions to Infineon’s memory portfolio offer up to 120 years of data retention at 85 degrees Celsius, along with random access and full memory write at bus speeds.…
Qorvo launches versatile MMIC power amplifiers for satellite uplink systems
Qorvo has announced three new MMIC power amplifiers specifically designed for Ku-Band satellite communications (SATCOM) terminals. These amplifiers are part of a family of devices aimed at enhancing performance and efficiency in satellite uplink systems, supporting the increasing demand for high-speed data communications in defense and aerospace applications. The amplifier family offers output power ranging…
Acromag introduces SBC for military and aerospace applications
Acromag has released the VPX7600 single-board computer. This 3U OpenVPX SBC is equipped with Intel’s 11th Generation Tiger Lake-H Xeon W-11000E processor and adheres to the SOSA I/O intensive profile. It features an XMC mezzanine site and a range of I/O peripherals for enhanced flexibility. The Intel E810 Ethernet controller supports 100GbE on the data…
Cable assemblies by Samtec offer low crosstalk and high data rates
Samtec, Inc. has announced the release of its NovaRay cable assemblies. These assemblies use 40% less space compared to traditional arrays, supporting 112 Gbps PAM4 per channel. They are suitable for applications in datacom, AI/ML, HPC, computer and semiconductor, medical, test and measurement, military/aerospace, and mobile networks. Samtec’s NovaRay cable assemblies provide low crosstalk (<30…
Cinch Connectivity expands offerings with terminations for aerospace
Cinch Connectivity Solutions announced it’s now stocking Qualified Parts for Space (QPS) Terminations by Midwest Microwave Solutions. Midwest Microwave offers space-qualified SMA terminations designed to meet space and military industry standards and are suitable for high-grade satellites, deep space explorations, and thermo-vacuum chamber testing. With three standard screening levels and male and female versions available,…
Radiation-tolerant MCU from Microchip targets space exploration
Microchip Technology has announced the SAMD21RT, a radiation-tolerant (RT) Arm Cortex-M0+ based 32-bit microcontroller (MCU) in a 64-pin ceramic and plastic package with 128 KB Flash and 16 KB SRAM. Designed for space-constrained applications where size and weight are important, the SAMD21RT is available in a small 10 mm × 10 mm footprint. Running at…
Microchip launched rad-tolerant, 50 W power converters for space applications
Microchip Technology announces a new family of Radiation-Tolerant (RT) LE50-28 isolated DC-DC 50W power converters available in nine variants with single- and triple-outputs ranging from 3.3V to 28V. The off-the-shelf LE50-28 family of power converters is designed to meet MIL-STD-461. The power converters have a companion EMI filter and offer customers ease of design to scale and…
Microchip’s expands rad-tolerant FPGA portfolio with SoCs for space systems
Microchip Technology has introduced theRT PolarFire system-on-chip (SoC) FPGA. Developed on Microchip’s RT PolarFire FPGA, it is the first real-time Linux-capable, RISC-V-based microprocessor subsystem on a flight-proven RT PolarFire FPGA fabric. With today’s announcement, developers can now start designing using the commercially available PolarFire SoC (MPFS460) device and Libero SoC development tools. Along with Microchip’s…
Q-Tech develops rad-hard OXCO for low-earth orbit satellites
Q-Tech Corporation introduces an advanced oven-controlled crystal oscillator (OCXO) Series for New Space applications. Designed by the company’s German affiliate, AXTAL, the AXIOM75Sx Series features both ultra-low phase noise (close-in and noise floor) and the radiation hardness required for high-performance low-earth orbit (LEO) satellite timing and frequency generation applications. Available for the frequencies of 10MHz (AXIOM75SL)…
Teledyne unveils 650 V power module with integrated GaN transistor and isolated driver
Teledyne e2v HiRel Electronics proudly announces the release of the TDGM650LS60, the first product in its innovative new 650V power module family. This new module utilizes a Teledyne high-voltage Gallium Nitride (GaN) transistor and integrates an isolated driver in one package. Designed to serve as a load switch or solid-state switch, the TDGM650LS60 offers unparalleled…
Moticont releases linear servo motor in compact package
Moticont is introducing their new miniature 16 mm diameter SDLM-016-032-01-01 Direct Drive Linear Motor with integrated position and temperature sensors. This smallest of the fully enclosed SDLM series of linear motors features zero backlash, zero cogging, high acceleration, high speed, high resolution, and long life. Also known as an electric cylinder, this compact direct-drive linear…
Harwin’s 1.25mm pitch Gecko connectors are a success
Harwin announces that its high-reliability Gecko connectors, which have been integrated into a research nanosatellite, have been successfully launched and ejected into low Earth orbit (LEO), and, after the deployment of its subsystems, remain fully operational. Momentus, the U.S. commercial space company, recently announced that all customer payloads had been deployed from its Vigoride-6 Orbital Service…
The Apollo missions — humanity’s giant leap to the moon
Recently, the Indian space agency ISRO successfully soft-landed a spacecraft on the lunar south pole. This makes India the first country to land a spacecraft on the challenging southern region of the moon, where there is a high probability of finding ice and resources for future human spaceflight missions to deep space. India aspires to…
Everything you need to know about Chandrayaan-3
On August 23, 2023, India’s space agency Indian Space Research Organization (ISRO) successfully soft-landed its moon mission Chandrayaan-3 on the south pole of the moon. This makes India the first nation to land a spacecraft on rough terrains near the lunar south pole in human history and the fourth to successfully land a spacecraft on…
‘Bharat Ka Chandra Uday:’ India becomes first nation to land on the lunar south pole
After a 40-day journey starting from Satish Dhawan Space Center in Sriharikota, ISRO’s Chandrayaan-3 successfully made a soft landing on the moon at 6:03 PM IST on August 23. This makes India the first nation to achieve a lunar landing near the moon’s south pole. With the successful landing of Chandrayaan-3, India is now 4th…