AI

Two new tools have been added to the eIQ AI and machine learning development platform, expanding capabilities for edge AI deployment across multiple processor types. The eIQ Time Series Studio offers a streamlined machine learning workflow for time series models, specifically targeting MCU-class devices in the MCX and i.MX RT crossover families. The Time Series…

BrainChip Holdings Ltd has introduced the Akida Pico, a power-efficient acceleration co-processor. This new product enables the creation of compact, energy-efficient, portable, and intelligent devices for wearable and sensor-integrated AI applications in consumer, healthcare, IoT, defense, and wake-up sectors. Akida Pico accelerates specific neural network models to create an energy-efficient, digital architecture. It enables secure…

NXP Semiconductors has introduced the i.MX RT700 crossover MCU family, designed for AI-enabled edge devices. The i.MX RT700 integrates up to five cores, including a primary Arm Cortex-M33 running at 325 MHz, a Cadence Tensilica HiFi 4 DSP for advanced audio processing, and NXP’s eIQ Neutron Neural Processing Unit (NPU). The MCU offers up to…

Renesas Electronics Corporation has launched an all-in-one sensor module designed for indoor air quality monitoring. The RRH62000 integrates multiple sensor parameters in a compact design, allowing it to accurately detect different particle sizes, volatile organic compounds, and harmful gases. The module features a Renesas microcontroller (MCU) that provides an intelligent sensor management solution for a…

Microchip Technology has introduced the Flashtec NVMe 5016 Solid State Drive (SSD) controller to address the increasing demand for powerful, efficient, and reliable data centers driven by the growth of Artificial Intelligence (AI) and cloud-based services. The 16-channel, PCIe Gen 5 NVM Express (NVMe) controller is designed to provide enhanced bandwidth, security, and flexibility. The…

Renesas Electronics Corporation has launched Reality AI Explorer Tier, a complimentary version of Reality AI Tools software tailored for developing AI and TinyML solutions in the industrial, automotive, and commercial sectors. Reality AI Explorer Tier grants users access to a comprehensive, self-guided evaluation sandbox. It includes the full suite of Reality AI Tools features for…

Congatec has introduced new high-performance computer-on-modules (COMs) featuring i.MX 95 processors from NXP. This addition expands Congatec’s module portfolio, which includes low-power NXP i.MX Arm processors. The new modules offer straightforward scalability and reliable upgrade paths for energy-efficient edge AI applications with high security requirements. These modules provide up to three times the GFLOPS computing…

Navitas Semiconductor announces the launch of their new Gen-3 ‘Fast’ (G3F) 650 V and 1,200 V SiC MOSFETs, designed for applications such as AI data center power supplies, on-board chargers (OBCs), fast EV roadside chargers, and solar/energy-storage systems (ESS). This new portfolio covers industry-standard packages from D2PAK-7 to TO-247-4, tailored for high-power, high-reliability applications. The G3F…

With the increasing power requirements of Artificial Intelligence (AI) processors, server power supplies (PSUs) must deliver more and more power without exceeding the defined dimensions of the server racks. This is driven by a surge in energy demand for high-level GPUs, which could consume 2 kW or more per chip by the end of the…

Siemens Digital Industries Software has announced Catapult AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs). Catapult AI NN is a solution that starts with a neural network description from an AI framework, converts it into C++, and synthesizes it into an RTL accelerator in Verilog…

The L99H92 automotive gate driver from STMicroelectronics provides an SPI port for programming and diagnostics, a charge pump, protective features, and two additional current-sense amplifiers for system monitoring. Containing two high-side and two low-side drivers, the L99H92 can control a single H bridge powering one bidirectional DC motor or two half bridges for two unidirectional…

Efinix announced a line of FPGA solutions designed specifically for the automotive industry to drive forward the long-term design and development of the rapidly growing numbers of electronic applications in-and-outside vehicles. The line, now automotive qualified, and Efinix’s Efinity tool suite that has achieved ISO26262 certification extend the company’s capabilities for automotive manufacturers. The FPGA solutions for…

Renesas Electronics Corporation has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications. Offering the highest levels of performance within the family, the RZ/V2H enables both vision AI and real-time control capabilities. The device comes with a new generation of Renesas proprietary AI accelerator, DRP (Dynamically Reconfigurable Processor)-AI3,…

Ceva, Inc. announced the general release of its RivieraWaves ultra-wideband (UWB) IP for FiRa 2.0, the latest technical specification released by the FiRa industry consortium promoting standardization and compliance efforts for the widespread adoption of UWB-driven applications. Leveraging its unique low-power MAC-to-PHY solution, Ceva’s latest generation UWB IP includes a cutting-edge interference cancelation scheme to…

STMicroelectronics announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with market-leading 2.3k resolution. They revealed an early design win for the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.  The VL53L9, announced is a new direct ToF 3D LiDAR device with a resolution of up to 2.3k zones. Integrating a dual…

Renesas Electronics Corporation announced the development of embedded processor technology that enables higher speeds and lower power consumption in microprocessor units (MPUs) that realize advanced vision AI. The newly developed technologies are as follows: (1) A dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models and (2) Heterogeneous architecture technology that enables…

Infineon Technologies has opened a new laboratory for the development of quantum electronics in Oberhaching near Munich. The objective is to develop and test microelectronic circuits for quantum computers, which will be stable and small, will operate reliably and can be produced on an industrial scale. Approximately 20 researchers will work at the lab. In…

Building on the AI PC use cases shared at Innovation 2023, Intel has launched the AI PC Acceleration program, a global innovation initiative designed to accelerate the pace of AI development across the PC industry. The program aims to connect independent hardware vendors (IHVs) and independent software vendors (ISVs) with Intel resources that include AI…

NVIDIA announced an extensive collaboration with Tata Group to deliver AI computing infrastructure and platforms for developing AI solutions. The collaboration will bring state-of-the-art AI capabilities within reach to thousands of organizations, businesses, AI researchers, and hundreds of startups in India. The companies will work together to build an AI supercomputer powered by the next-generation NVIDIA GH200…

Qualcomm Technologies has announced two new spatial computing platforms — Snapdragon XR2 Gen 2 and Snapdragon AR1 Gen 1 — which will enable the next generation of mixed reality (MR), virtual reality (VR) devices, and smart glasses. Snapdragon XR2 Gen 2 Platform: brings premium MR and VR technology into a single-chip architecture to unlock next-level…