Wireless

Qualcomm Technologies has announced another milestone in making extended reality (XR) the next computing platform with the Wireless AR Smart Viewer Reference Design, powered by the Snapdragon XR2 Platform. The cord-free reference design helps OEMs and ODMs more seamlessly and cost-efficiently prototype and bring to market lightweight, premium AR glasses to enable immersive experiences that…

Rohde & Schwarz has announced the launch of the R&S UMS400 universal monitoring system for spectrum monitoring and radiolocation of frequencies from 8  to 8 GHz (extendable up to 20 GHz with the R&S CS-MC20 microwave converter). R&S UMS400 meets 8 GHz (optionally 20 GHz) monitoring station needs in the ever-increasing frequency ranges demanded by wireless communications services. Before…

Broadcom Inc. has announced the sample availability of its complete end-to-end chipset solutions for the Wi-Fi 7 ecosystem — spanning Wi-Fi routers, residential gateways, enterprise access points, and client devices. These Wi-Fi 7 chips more than double the speed of Wi-Fi 6 and 6E solutions on the market today while, simultaneously, delivering reliable low-latency communications…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that its wireless power-charging technology is integrated in the Active ES pen solutions from Wacom. Renesas’ single-chip, wireless power-receiver IC delivers a small size and high efficiency when compared to alternative high-frequency charging solutions. The charging technology is small enough to fit into digital…

Brought to you by ESL Gaming and Qualcomm Technologies, the Snapdragon Pro Series welcomes players and fans to the “Era of Everyone.” Both aspiring mobile gamers and veteran esports athletes from around the world are invited to compete in the three tiers of competition: Snapdragon Mobile Open, Snapdragon Mobile Challenge, and Snapdragon Mobile Masters. “The…

Renesas Electronics Corporation announced 10 new winning combinations that combine Wi-Fi 6 and 6E chipsets from recently acquired Celeno Communications — with a broad range of solutions from Renesas including embedded processing, analog, power, timing and connectivity. The new winning combos include solutions for IoT, Industrial, Infrastructure, and other applications. Renesas’ combinations are engineering-vetted designs…

Trimble and Qualcomm Technologies have announced the availability of Trimble RTX GNSS technology for the Snapdragon 8 Gen 1 and Snapdragon 888 Mobile Platforms. This technology enables superior location capabilities in premium Android smartphones worldwide. The integration of Trimble RTX GNSS technology, a correction services platform, with Snapdragon contributes to a higher quality, more accurate…

Broadcom Inc., a global provider in PCIe, SerDes, and switching technology, announced its broad PCIe Gen 5.0 portfolio is setting the foundation for the ecosystem to build high-performance, next-generation servers. Broadcom PCIe Gen 5.0 SerDes, switches, and custom silicon products — which are now available to OEMs, ODMs, and cloud providers — are actively being…

Toshiba America Business Solutions is simplifying the printing process for organizations of all shapes, sizes and sectors. The new cloud-based Encompass Managed Print as a Service (MPaaS) subscription program is accomplishing this objective, enabling today’s distributed workforces to print more securely, sustainably, efficiently, and affordably. Whether working from a corporate or home office, or at…

Qualcomm Technologies, Vodafone, and Thales have joined forces to demonstrate a working smartphone, featuring iSIM (based on the ieUICC GSMA specification), a new technology enabling the functionality of a SIM card to be integrated into a device’s main processor. This milestone paves the way for commercialization of the technology, which could be rolled out in…

Infineon Technologies and Deeyook have announced their collaboration on location solutions. The location-as-a-service (LaaS) company has invented and patented an award-winning tracking solution to determine indoor and outdoor locations of items, assets, and employees. Both companies fuse Deeyook’s ultra-precise, innovative algorithms into Infineon’s best-in-class, low-power AIROC Wi-Fi portfolio to enable an accurate, passive, ubiquitous, and efficient…

Infineon Technologies has announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. The powerful combination of complementary Bluetooth LE and 802.15.4 protocols enhances the performance of smart home products with seamless interoperability, enabling end-to-end encrypted communication between individual devices in a Matter…

MediaTek recently validated Micron Technology’s low-power, double data rate 5X (LPDDR5X) DRAM for MediaTek’s new Dimensity 9000 5G flagship chipset for smartphones. Micron is the first semiconductor company to sample and validate this fastest, most advanced mobile memory in the industry and has shipped the first batch of samples of LPDDR5X built on its first-to-market…

Panthronics AG, a fabless semiconductor company specializing in wireless technology, and Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced a new design that provides manufacturers of secure mobile point-of-sale (mPoS) contactless payment terminals with a new way to reduce the size and the bill-of-materials cost of their products without compromising performance or…

STMicroelectronics has extended the certification of its ST8500 G3-PLC (Power-Line Communication) Hybrid communication chipset, now covering the U.S. Federal Communications Commission (FCC) band plan from 10 to 490kHz. This is in addition to the CENELEC-A 9kHz-95kHz European band. The move enables higher data rates, enhances design flexibility, and eases end-product approval in accordance with specific national regulations.…

Bandwidth growth, driven by the expansion of data centers and 5G network build-outs, is expected to drive the need for faster coherent Dense Wavelength Division Multiplexing (DWDM) pluggable optics. Consequently, Data Center Interconnect (DCI) and metro Optical Transport Network (OTN) platforms are transitioning from 100/200G to 400G pluggable coherent optical modules to support these hyper-connected…

Qualcomm Technologies, together with key ecosystem partners, is set to redefine wireless expectations for latency-sensitive gaming, productivity, and learning applications on Window’s 11 PCs with Qualcomm FastConnect systems. Wi-Fi Dual Station designed using Qualcomm 4-Stream Dual-band Simultaneous, harnesses multiple Wi-Fi bands and antennas concurrently, to outperform traditional single band connections. By simultaneously using the 2.4…

Samsung Electronics recently revealed the revamped Samsung Remote Test Lab program, which allows developers to easily test their applications virtually and remotely on thousands of Samsung Galaxy devices — including the Galaxy S21 series with One UI 4 beta, and the latest Galaxy Z Fold3 5G and Z Flip3 5G. The Remote Test Lab program…

STMicroelectronics, a global semiconductor provider, and Blues Wireless, a telecoms equipment supplier, have disclosed the use of a quintet of ST products in Blues Wireless’ Notecard, a system-on-module (SOM) solution that accelerates development of cellular IoT solutions for connected assets at a low cost. The Blues Wireless Notecard builds on a high-performance, ultra-low-power STM32L4R5 microcontroller, an STSAFE-A…

Routers, switches, and line cards need higher bandwidth, port density, and up to 800-gigabit Ethernet (GbE) connectivity to handle escalating data-center traffic driven by 5G, cloud services and artificial intelligence (AI) and machine learning (ML) applications. To deliver the higher bandwidth, these designs need to overcome the signal integrity challenges associated with the industry’s transition…