Wireless

After buying a Bluetooth audio adapter at a yard sale, I just needed cables for audio and power. Buy them? No way. How many times have you thought about buying something, then thought “I’m an engineer, I can figure out a workaround” or simply decided not to spend money? It’s happened to me several times.…

Eggtronic has unveiled a new evaluation board that allows engineers to quickly develop and prototype ultra-efficient, low-component count wireless power transfer designs for low-power applications. The WaveEgg Low-Power (LP) EVB is built on Eggtronic’s proprietary, high-frequency WaveEgg architecture, which optimizes performance and efficiency and reduces component count and form factor in high-performance power converter and wireless power transmission…

Samtec has expanded its SMPM Magnum RF product family with a new low-profile 3.94 mm (.155″) body height, right-angle option designed for channel density in low- or mid-band systems. The GPPC Series offers a low-profile, right-angle multi-port solution with performance up to 50 GHz. Magnum RF products are designed for space-limited applications requiring high operating frequencies,…

Trident IoT  announced the upcoming release of its new Zigbee chip and accompanying Software Development Kit (SDK). This offering advances Trident IoT’s strategy to provide comprehensive IoT solutions that streamline IoT development. The chip incorporates current silicon technology, and the SDK is designed by product engineers with experience in developing and shipping numerous IoT products.…

TDK Corporation has launched the IS-BP series of radio wave absorbers, incorporating over 25 wt% of biomass material to offer an environmentally sustainable option that facilitates CO₂ reduction. Mass production of this series began in April 2024. Microwave anechoic chambers, used for evaluating antennas, wireless communication equipment, and millimeter-wave radar for AD and ADAS, have…

Microchip Technology has expanded its Bluetooth Low Energy portfolio with 12 new products. These additions provide designers with a broad range of choices to overcome their unique challenges, effectively reducing barriers for designs ranging from the simplest to the most complex. The new offerings include the RF-ready WBZ350 module and the PIC32CX-BZ3 SoC, which offers…

Microchip Technology has released a Qi 2.0 dual-pad wireless power transmitter reference design. Powered by a single dsPIC33 Digital Signal Controller (DSC), the Qi2 reference design offers efficient control for optimized performance. A key feature of the new Qi2 standard, recently released by the Wireless Power Consortium (WPC), is the introduction of a Magnetic Power Profile (MPP)…

Arctic Semiconductor unveiled SilverWings. Representing a breakthrough in the industry, SilverWings is the first-ever 4×4 low-power transceiver offering multi-stage up and down conversion from digital to RF and RF to digital, empowering programmable and adaptable system designs. Leveraging Arctic’s renowned low-power architecture, SilverWings seamlessly integrates high-performance analog capabilities with high-bandwidth digital features, incorporating unique Digital-IF and High-IF…

STMicroelectronics has revealed the next generation of its short-range wireless microcontrollers. These innovative, all-in-one components enable wearables and smart objects including smart home devices, health monitors, and smart appliances to become ever more miniaturized, easy to use, secure, and affordable. Short-range wireless technologies like Bluetooth LE, Zigbee and Thread (popular in smart meters and smart…

Ceva, Inc. announced the general release of its RivieraWaves ultra-wideband (UWB) IP for FiRa 2.0, the latest technical specification released by the FiRa industry consortium promoting standardization and compliance efforts for the widespread adoption of UWB-driven applications. Leveraging its unique low-power MAC-to-PHY solution, Ceva’s latest generation UWB IP includes a cutting-edge interference cancelation scheme to…

Sony Semiconductor Israel announced that its advanced ALT1350 Wireless System on Chip (SoC) is now commercially available. LPWA cellular modules have been designed by our partners and industry leaders AM Telecom, Fibocom, Murata, Quectel, Semtech, Telit Cinterion, and Wistron NeWeb Corporation (WNC). The modules are now available for sampling, with mass production expected during the…

MikroElektronika and NeoCortec announced three new NeoMesh Click boards that are ideal for wireless mesh networking. The Click boards eliminate the need for engineers to create any development PCB hardware themselves, enabling them to initiate Proof-of-Concept testing of the NeoMesh network protocol stack in a real application quickly and at minimal cost. The Click Boards feature NeoCortec’s compact, low-power NC1000 and NC2400 network…

Samsung Electronics, with Vodafone and Orange, two of the largest operators in Europe, announced the companies completed the first 4G calls over-shared commercial networks in rural areas of Romania based on Open RAN in a pilot project. By leveraging Samsung’s virtualized Radio Access Network (vRAN), the two operators can take advantage of the greater flexibility…

Bluetooth, which offers short-range wireless technology, is now standard on most smart devices, including wireless headphones, smart watches, remote controls, game controllers, and many more. Most of these devices are designed to operate with smartphones or computers.  Audio streaming, file sharing, peripheral devices, the Internet of Things (IoT), and smart home devices are some common…

Typically, a WiFi network has a range that’s above 45 meters. The signals are strongest near the router. The further away you move, the weaker the signal. The same is true of thick walls or additional floors in a home or building. The WiFi signals could be completely lost on other floors of a premise. …

Keysight Technologies, Inc., in collaboration with the National Physical Laboratory (NPL) and the University of Surrey, has made the first 6G connection at speeds greater than 100 gigabits per second (Gbps) over sub-terahertz (THz) frequencies in the U.K. Future 6G use cases, such as augmented reality and autonomous vehicles, will require data throughput speeds from…

Texas Instruments (TI) introduced a new SimpleLink family of Wi-Fi 6 companion integrated circuits (ICs) to help designers implement highly reliable, secure, and efficient Wi-Fi connections at an affordable price for applications that operate in high-density or high-temperature environments up to 105º C. The first products in TI’s new CC33xx family include devices for Wi-Fi…

Infineon Technologies has announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth combo, extending its broad portfolio of existing Wi-Fi and Bluetooth products. The CYW43022 ultra-low power architecture delivers industry-leading performance, with up to a 65% reduction in power usage during “deep sleep,” significantly extending battery life for applications such as smart…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced plans to showcase a full RF front-end solution for 5G Active Antenna Systems (AAS) radios in collaboration with AMD. Paired with the field-proven AMD Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design, the RF front end includes RF switches, low-noise amplifiers…

STMicroelectronics ST87M01 ultra-compact and low-power modules combine highly reliable NB-IoT data communication with accurate and resilient GNSS geo-location capability for IoT devices and assets. The fully programmable, certified LTE Cat NB2 NB-IoT industrial modules cover worldwide cellular frequency bands and integrate advanced security features. As one of the first IoT cellular products worldwide offered in accordance…