Nexperia, an expert in essential semiconductors, has announced the expansion of its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include four 650 V, 1 A parts available in CFP3 and CFP5 packages intended for use in onboard chargers (OBC) and inverters for electric vehicles, power converters, PV…

Samsung Electronics announced that Bixby, and its artificial intelligence (AI) voice assistant, supports Latin American Spanish as a language option. Latin American Spanish-speaking Bixby users around the world now have the option to interact with their Samsung Galaxy devices in their local language — as Brazilian Portuguese was previously the only Latin American language supported…

Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing focus on cybersecurity in connected automobiles. This regulation, which came into effect in July 2022, requires vehicle manufacturers to apply a security-by-design approach to their products and processes. To enable new vehicle sales in markets covered by…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is entering the automotive radar market with the introduction of a 4×4-channel, 76-81GHz transceiver designed to meet the demanding requirements of ADAS (advanced driver assistance systems) and Level 3 and higher autonomous driving applications. Leveraging automotive expertise accumulated through years of global customer engagements, Renesas will…

When designing portable and battery-powered audio devices for consumer speaker applications, maximizing battery playback time and maintaining excellent audio performance in a compact form and at a low-system cost is essential. MERUS multilevel switching technology from Infineon Technologies is designed to achieve low switching losses and highly efficient amplification at both low and high output…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its low-power WAN product line as part of its strategy to deliver connectivity devices used for smart cities, smart homes, medical devices, and industrial applications. The new RYZ024A supports Cat-M1 and NB-IoT (Narrowband Internet of Things) internet connectivity without the need for a gateway…

Developers of industrial automation systems are looking to shift away from the reliance on proprietary solutions for process synchronization to standard-based solutions that offer broader compatibility and reduce design costs. To deliver critical process synchronization, Microchip Technology has announced the LAN8840 and LAN8841 Gigabit Ethernet transceiver devices that meet IEEE 1588v2 standards for Precision Timing…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off on November 16th. Intersil-brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort…

At electronica 2022, Infineon Technologies launched the XMC7000 microcontroller (MCU) family for advanced industrial applications, including industrial drives, electrical vehicle (EV) charging, two-wheel electrical vehicles, and robotics. The XMC7000 series offers single and dual-core options of 350-MHz 32-bit Arm Cortex-M7 and a 100-MHz 32-bit Arm Cortex-M0+, up to 8 MB of embedded flash and 1…

TSMC recently announced the Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric Alliance is TSMC’s sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness — with a full…

Enabling smarter connections to the world around us, Texas Instruments (TI) has introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline the adoption of the Matter protocol in the Internet of Things (IoT) applications. The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in…

STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has revealed that its ST54K IC is handling control and security for contactless NFC communication in the newly launched Google Pixel 7 smartphone. Chosen by Google’s designers, ST’s device combines NFC control and a certified Secure Element in a single chip that saves…

Samsung Electronics, a provider of advanced memory technology, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry’s highest bit density. At 1Tb, the new V-NAND also features the highest storage capacity to date, enabling larger storage space in next-generation enterprise server systems worldwide.…

A high-performance and reliable radar module is the key to an improved automated driving-assistance system and autonomous driving in the future. New features, such as advanced emergency braking systems (AEBs) that react to crossing motorcyclists, will demand higher performance and increased modules per car. Key drivers for this growth are NCAP programs and legislation. Infineon…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its Renesas Ready Partner Network to include commercial-grade, performance-optimized building blocks for its RZ Family of microprocessors (MPUs). The MPUs feature 106 new partners and 160 building block solutions. The trusted technology partnership program has grown in the last three years to more than…

Keysight Technologies, Inc., a technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that it is first to gain Global Certification Forum (GCF) validation of a 5G location-based services (LBS) Assisted Galileo (A-Galileo) test case by combining 5G new radio (NR) and global navigation…

The design complexity of smart meters continues to evolve as different communications solutions are integrated into the framework and as regulatory compliance requirements are mandated. To meet the growing demand for a feature-rich yet simple design solution for developing smart meters, Microchip Technology has announced the PIC32CXMT family of 32-bit microprocessors with a new MPL460…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has unveiled an innovative automotive power-management IC (PMIC) for next-generation automotive camera applications. The RAA271082 is a versatile ISO-26262-compliant multi-rail power IC with a primary high-voltage synchronous buck regulator, two secondary low-voltage synchronous buck regulators, and a low-voltage LDO regulator. It offers four over and under-voltage…

STMicroelectronics (ST), a global semiconductor provider serving customers across the spectrum of electronics applications, will host its Industrial Summit 2022 at the Futian Shangri-La Hotel in Shenzhen, China, on November 3rd. ST features a broad, innovative product portfolio with over 20,000 products targeted at about 40 sub-segments. In its fourth year, under the theme of…

Infineon Technologies has announced its new PSoC 4100S Max family. It features expanded Flash memory and general-purpose inputs/outputs (GPIO) for next-generation human-machine interface (HMI) applications to support the fifth-generation CAPSENSE touch sensors. Available in 7×7, 10×10, and 14×14 mm² packages, PSoC 4100S Max with CAPSENSE technology is ideal for industrial control, automotive HMI, home automation,…