Intel has officially launched the new Intel Core 14th Generation desktop processor family, led by the Intel Core i9-14900K. This latest-generation desktop processor family includes six new unlocked desktop processors, delivering up to 24 cores and 32 threads and up to 6 GHz of frequency right out of the box. Additionally, the Intel Core i7-14700K…

Infineon Technologies has opened a new laboratory for the development of quantum electronics in Oberhaching near Munich. The objective is to develop and test microelectronic circuits for quantum computers, which will be stable and small, will operate reliably and can be produced on an industrial scale. Approximately 20 researchers will work at the lab. In…

Building on the AI PC use cases shared at Innovation 2023, Intel has launched the AI PC Acceleration program, a global innovation initiative designed to accelerate the pace of AI development across the PC industry. The program aims to connect independent hardware vendors (IHVs) and independent software vendors (ISVs) with Intel resources that include AI…

Harwin announces that its high-reliability Gecko connectors, which have been integrated into a research nanosatellite, have been successfully launched and ejected into low Earth orbit (LEO), and, after the deployment of its subsystems, remain fully operational. Momentus, the U.S. commercial space company, recently announced that all customer payloads had been deployed from its Vigoride-6 Orbital Service…

Nexperia, an expert in essential semiconductors, announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data lines in interfaces such as USB, HDMI, high-speed video links, and ethernet in automotive infotainment applications. These latest additions include PESD18VF1BLS-Q, PESD24VF1BLS-Q, PESD30VF1BLS-Q, and PESD32VF1BLS-Q in DFN1006BD-2 package, enabling optical inspection in automotive production lines…

Infineon Technologies announced its new TRAVEO T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. The engine features a new smart rendering technology and delivers outstanding performance for automotive graphics applications. With a small footprint, the new MCUs simplify OEM integration and reduce BOM costs, making them an ideal solution for advanced…

Industrial and consumer application designers must consider implementing security functionality in their devices during the development process as security threats evolve and become more sophisticated. To allow designers to easily integrate security into their applications, Microchip Technology announced a new family of PIC32CZ CA 32-bit microcontrollers with a 300 MHz Arm Cortex-M7 processor, an integrated Hardware Security…

STMicroelectronics’ TSB182 dual-operational amplifier is featured for high-accuracy signal conditioning with sensors, including maximum 20µV input offset voltage, 100nV/° C drift over temperature, and 4V-36V operating range for medium-voltage applications. In addition to its high accuracy, stability, and wide supply-voltage range, the TSB182 is specified from -40° to 125° C. With a maximum offset voltage of…

In response to the consumer demand for improved wireless charging user experience, the Wireless Power Consortium announced the release of a new standard to redefine the inductive wireless power transfer: Qi2. Infineon Technologies is addressing this demand by introducing its first Qi2 Magnetic Power Profile (MPP) charging transmitter solution, the reference design kit REF_WLC_TX15W_M1. The…

KYOCERA AVX, a global manufacturer of advanced electronic components, released the new SCM Series double-layer, series-connected electrochemical supercapacitor modules. The new SCM Series series-connected supercapacitor modules can be used by themselves or in conjunction with primary or secondary batteries to extend battery life and backup time or provide instantaneous power pulses in hold-up, energy harvesting,…

NVIDIA announced an extensive collaboration with Tata Group to deliver AI computing infrastructure and platforms for developing AI solutions. The collaboration will bring state-of-the-art AI capabilities within reach to thousands of organizations, businesses, AI researchers, and hundreds of startups in India. The companies will work together to build an AI supercomputer powered by the next-generation NVIDIA GH200…

Samsung Electronics, with Vodafone and Orange, two of the largest operators in Europe, announced the companies completed the first 4G calls over-shared commercial networks in rural areas of Romania based on Open RAN in a pilot project. By leveraging Samsung’s virtualized Radio Access Network (vRAN), the two operators can take advantage of the greater flexibility…

KYOCERA AVX, a global manufacturer of advanced electronic components, has released the new 9296-11X Series STRIPT vertical poke-home through-board contacts for 12–18AWG wire. The new 9296-11X Series vertical through-board contacts further expand the company’s portfolio of user-friendly poke-home contacts and connectors. This addition brings the portfolio total to 10 series, two of which — this series and 9296-000 Series contacts —…

Nexperia, a semiconductor provider, has released a new series of 500 mA dual resistor-equipped transistors (RET) in ultra-compact DFN2020(D)-6 packaging. These devices have been designed for load switching in wearables and smartphones. They’re also ideal for use in digital circuits with higher power requirements, such as space-constrained computing, communications, industrial, and automotive applications. Notably, the…

Nexperia, a semiconductor provider, announced it has entered into a partnership with KYOCERA AVX Components, an international supplier of advanced electronic components, to jointly produce a new 650 V, 20 A silicon-carbide (SiC) rectifier module. The new rectifier module will be for high-frequency power applications ranging from 3 to 11 kW power stack designs —…

AMD recently announced the AMD Kria K24 System-on-Module (SOM) and its new KD240 Drives Starter Kit, which are the latest additions to the Kria portfolio of adaptive SOMs and developer kits. AMD Kria K24 SOM offers power-efficient computing in a small form factor and targets cost-sensitive industrial and commercial edge applications. Advanced InFO (Integrated Fan-Out)…

Products that have Qualified Manufacturers List (QML) designations are often the most trusted and readily accepted in space program designs. As designated by the Defense Logistics Agency (DLA), the RT PolarFire FPGA from Microchip Technology is now QML Class Q qualified. This certification is considered the gold standard in entry-level qualification, enabling designers to begin…

AMD announced the AMD Alveo UL3524 accelerator card, a new fintech accelerator designed for ultra-low latency electronic trading applications. Already deployed by leading trading firms and enabling multiple solution partner offerings, the Alveo UL3524 provides proprietary traders, market makers, hedge funds, brokerages, and exchanges with a state-of-the-art FPGA platform for electronic trading at nanosecond (ns) speed.…

Broadcom Inc. announced the availability of its 5nm 200G/lane optical PAM-4 DSP PHY, the Sian BCM85822, at the 49th European Conference on Optical Communication (ECOC 2023). The new BCM85822 features 200G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost-effectively deliver 800G and 1.6T pluggable modules and meet the growing bandwidth needs and low power consumption…

Designing systems for the intelligent edge has never been more difficult. Market windows are shrinking, the costs and risks of new designs are rising, thermal constraints and reliability are twin priorities, and the need for cradle-to-grave security continues to grow. Satisfying these simultaneous demands requires immediate knowledge of special technology and vertical-market expertise. There’s no…