Danisense announces a range of current transducers with voltage output, designed to streamline the workflow for engineers utilizing data acquisition (DAQ) systems. These devices integrate the burden resistor directly into the current transducer, mitigating the risk of miscalculations. With a single datasheet, users can promptly commence precise and reliable current measurements in their specific applications. For…

OMNIVISION has introduced three new back-side illuminated (BSI) global shutter (GS) image sensors. These sensors are designed for machine vision applications such as industrial automation, robotics, logistics barcode scanners, and intelligent transportation systems (ITS). The new GS image sensors feature a 3.45-micron (µm) BSI pixel, which offers high sensitivity, efficient shutter performance, and strong low-light capabilities. This…

Littelfuse, Inc. has introduced the 871 Series Ultra-High Amperage SMD Fuse, complementing the existing 881 Series. The new 871 Series offers 150A and 200A fuse ratings, expanding upon the 881 Series’ 125A maximum rating. This surface-mounted solution aims to eliminate the need for parallel fusing configurations in electronic designs. The 871 Series features a small-sized…

TDK-Lambda expands its GENESYS series with the introduction of new programmable AC power sources. The GAC and GAC-PRO models, rated at 2kVA and 3kVA, enhance the company’s test and measurement capabilities. These 1U chassis units offer compact design and comprehensive functionality for various applications. The GAC-PRO models provide extended capabilities, including AC, DC, and combined…

LEM launches the new SMU family. The Single Monitoring Unit (SMU) brings previously unseen performance levels to all types of EV technologies – Full Hybrid Electric Vehicles (FHEVs), Plug-in Hybrid Electric Vehicles (PHEVs), and Battery Electric Vehicles (BEVs). The new modular SMU family meets the needs of designers of automotive battery management systems (BMS) who…

The MIPI Alliance has released MIPI A-PHY v2.0, an updated version of its automotive high-speed asymmetric serializer-deserializer (SerDes) physical-layer interface. This new version increases the maximum downlink data rate to 32 Gigabits per second (Gbps) on a single channel, doubling the previous capacity. It also introduces an additional uplink gear supporting up to 1.6 Gbps, an eight-fold increase in…

Tecate Group has introduced new additions to its lithium-ion capacitor (LIC) product offerings. The new TPLCE product series features increased volumetric energy densities compared to the current TPLC series. TPLCE cells are rated at 3.8V and are available in capacitances from 3F to 1,400F. The cells are UL recognized, RoHS and REACH compliant, and operate from -25°C…

KYOCERA AVX released the new 9179-000 Series IDC Splice Connectors, which are packed with features designed to make them an attractive alternative to traditional splicing solutions. The new 9179-000 Series IDC Splice Connectors utilize insulation displacement contact (IDC) technology, which is more efficient, economical, robust, reliable, and durable than traditional hand-crimp and hand-solder connection technology.…

Microchip Technology has introduced the 101765 family of Voltage-Controlled SAW Oscillators (VCSOs) for aerospace and defense applications. These oscillators operate at 320 MHz and 400 MHz, providing low-phase noise performance for radar and test and measurement systems. The 101765-320-A VCSO achieves phase noise performance of -166 dBc at 10 kHz offset and a -182 dBc…

Nexperia introduced the NXF6501-Q100, NXF6505A-Q100, and NXF6505B-Q100. These are AEC-Q100 qualified, push-pull transformer drivers that enable the design of small, low-noise, and low-EMI isolated power supplies for a range of automotive applications like traction inverters and motor control, DC-DC converters, battery management systems and on-board chargers in electric vehicles (EV). These transformer drivers are also…

Melexis adds the MLX92253 to its Hall-effect Dual Latch portfolio. This fast sensor offers two independent signal tracks for minimal jitter as well as consistent 90° phase shift regardless of magnet pole pitch. This enables accurate speed & direction ECU calculation as well as easy transfer across multiple platforms. This integrated solution is a cost-effective…

High voltage applications frequently require high resistance value resistors with the ability to handle high working and overload voltages. Engineers may have difficulty finding thick film chip resistors with the required precision for applications requiring tight resistance tolerance and TCR tracking. For precision high-voltage applications, a high-voltage divider chip can be beneficial. Stackpole’s new HVCD…

In order to further drive decarbonization, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions. Innovative solutions are needed to optimize energy consumption while ensuring a healthy indoor environment. Infineon Technologies AG is addressing this need with the introduction of the new XENSIV PAS CO2…

congatec introduces new COM Express Compact Computer-on-Modules with AMD Ryzen Embedded 8000 Series processors. Based on the dedicated computing cores of the new Ryzen processors featuring up to eight ‘Zen 4’ cores, innovative XDNA NPU, and powerful Radeon RDNA 3 graphics, the new modules deliver impressive performance of up to 39 tera operations per second…

NXP Semiconductors has announced the MC33777, a battery junction box integrated circuit (IC) that combines sense, think, and act capabilities for battery management systems. The MC33777 integrates pack-level functions into a single device, which differs from conventional solutions that use multiple discrete components, external actuators, and processing support. The MC33777 IC monitors battery current and…

TeraSignal introduced TSLink, the world’s first intelligent chip-to-module (C2M) interconnect designed to revolutionize data transmission between large ASICs and linear optical modules. Leveraging existing microcontroller resources in optical modules, the TSLink solution automates link training and performance monitoring without the need for additional digital signal processors (DSPs). TSLink dramatically reduces power consumption and latency while simplifying…

Naviq is introducing the MTS160, a state-of-the-art magnetic guide sensor for mobile robots, featuring patented angle measurement capabilities with 1-degree precision and position accuracy within 1mm. This unique dual functionality provides exceptional orientation and positioning precision, significantly improving the navigation capabilities of mobile robotic systems. Unlike traditional magnetic line-following sensors that only detect position along…

Nexperia announced the release of single and dual small-signal MOSFETs in miniature DFN packages. The automotive-qualified devices are available in DFN1110D-3 and DFN1412-6 respectively. Particularly the DFN1110D-3 (1.1mm x 1 mm) package has seen increasingly wide adoption and is quickly becoming the ‘de-facto’ industry standard package for small-signal MOSFETs and bipolar transistors intended for use…

United Electronic Industries (UEI) unveiled its latest innovation, the DNx-MF-102 multifunction analog and digital I/O board with 2 CAN ports compatible with all UEI I/O chassis systems. The board offers a powerful combination of 34 analog and digital I/O channels combined with, two CAN ports and one RS-232/422/485 port. This board is integral to any…

Marktech Optoelectronics has introduced new Series 4 silicon photodiodes with improved response speed. These photodiodes offer a response time of 25ns compared to the 80ns of current Series 4 PDs with the same active area. The new silicon photodiodes feature reduced junction capacitance (Cj), which improves response time, frequency response, and bandwidth. This is achieved…