STMicroelectronics, has introduced a new bio-sensing chip for the next generations of healthcare wearables like smart watches, sports bands, connected rings, or smart glasses. The ST1VAFE3BX chip combines a high-accuracy biopotential input with ST’s proven inertial sensing and AI core, which performs activity detection in the chip to ensure faster performance with lower power consumption.    Analysts…

SiFive’s P550 development board features a quad-core processor operating at 1.4GHz, with select units now available through electronics distributors. The full release, scheduled for December, will include Ubuntu 24.04 software. The development board specifications include 16-32GB LPDDR5 memory, 128GB eMMC storage, and multiple connectivity options including SATA, PCIe, SD card slot, M.2 interface, and USB…

Navitas Semiconductor has announced GaNSlim, a new generation of highly integrated GaN power ICs that will further simplify and speed the development of small form factor, high-power-density applications by offering the highest level of integration and thermal performance. GaNSlim enables the simplest, fastest, and smallest system design by integrating drive, control, and protection, with integrated…

Q-Tech Corporation announces the industry’s first multiple-output temperature-controlled crystal oscillators (TCXOs) qualified for full space applications. Each QT8220 Series TCXO, available with two (2) to four (4) CMOS outputs, is packaged in a hermetically sealed 32-pin Flatpack. One QT8220 multiple CMOS output TCXO offers significant SWaP (Size, Weight, and Power) advantages compared to the traditional approach…

Renesas Electronics Corporation has introduced two new semiconductor solutions for the IO-Link market: the CCE4511 four-channel IO-Link master IC and the ZSSC3286 IO-Link ready dual-channel resistive sensor signal conditioner IC. IO-Link, a digital communication protocol used in industrial automation, enables communication between sensors, actuators, and other automation system devices. The technology provides real-time data, diagnostics,…

Infineon Technologies AG  is launching the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high-performance AI data centers. These modules enable true vertical power delivery (VPD) and offer the industry’s best current density of 1.6 A/mm 2. They follow the TDM2254xD dual-phase power modules introduced by Infineon earlier this year. The TDM2354xD and TDM2354xT…

Infineon Technologies AG  has now introduced the EiceDRIVER 1EDL8011, a high-side gate driver designed to protect battery-powered applications such as cordless power tools, robotics, e-bikes, and vacuum cleaners in the event of a fault. The device provides fast turn-on and turn-off of high-side N-channel MOSFETs with its high gate current capabilities. It consists of an…

Infineon Technologies AG launches the new automotive-qualified fingerprint sensor ICs CYFP10020A00 and CYFP10020S00. The devices are optimized for attaching to Infineon’s TRAVEO T2G microcontroller family and comply with the AEC-Q100 requirements for the automotive industry. The sensors offer powerful fingerprint identification and authentication capabilities. This makes them ideal for in-vehicle personalization and payment authentication, such…

Infineon Technologies AG introduces the Automotive PSoC Multitouch GEN8XL (IAAT818X), a new generation of touch controllers. Designed for OLED and micro-LED displays up to 24 inches, the touch controller delivers performance and frame rates that meet today’s demands. It ensures a seamless user experience on various touch-based interfaces, such as touchscreens, touchpads, and sliders, while…

Infineon Technologies AG is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector. The HybridPACK Drive G2 Fusion is the first plug’n’play power module that implements a combination of Infineon’s silicon and silicon carbide (SiC) technologies. This cutting-edge solution provides an ideal balance between performance…

The ST87M01 cellular data-communications module integrates NB-IoT certification and an optional ST4SIM embedded SIM. The module features dual communication capabilities through NB-IoT cellular connectivity and wireless Meter-Bus (wM-Bus), providing redundant data transmission channels for applications like utility consumption monitoring. A software-defined radio enables dynamic switching between NB-IoT and sub-GHz wM-Bus modes. The module supports direct…

Microchip Technology has announced the PIC64HX family of microprocessors (MPUs). Unlike traditional MPUs, the PIC64HX is purpose-built to address the unique demands of intelligent edge designs.   The latest in Microchip’s 64-bit portfolio, the PIC64HX is a high-performance, multicore 64-bit RISC-V MPU capable of advanced Artificial Intelligence and Machine Learning (AI/ML) processing and designed with integrated Time-Sensitive…

Nexperia introduced a new series of AC/DC flyback controllers as the latest additions to its continuously expanding portfolio of power ICs. The NEX806/8xx and NEX8180x are designed for GaN-based flyback converters in devices such as power delivery (PD) chargers, adapters, wall sockets, strip sockets, industrial power and auxiliary power supplies, and other AC/DC conversion applications…

Ready for use in forthcoming multi-protocol smart meters that enhance flexibility for handling energy data, STMicroelectronics’ ST85MM programmable powerline communication (PLC) modem natively supports field-proven Meters and More and PRIME 1.4 smart grid standards. The energy transition is happening everywhere and transforming the role of metering, as increasingly intelligent networks and new stakeholders demand extra…

e-con Systems introduces STURDeCAM34, an IP69K-rated 3MP automotive multi-camera designed for automotive and industrial applications. The camera utilizes onsemi’s AR0341AT CMOS image sensor, offering up to 150dB in raw data output. It supports synchronized multi-camera setups, allowing connection of up to 8 cameras to NVIDIA Jetson AGX Orin via GMSL2 interface. STURDeCAM34 features 140 dB…

Innoscience Technology has launched a new generation of battery management system (BMS) solutions based on VGaN technology. Increased demand for convenient eco-friendly travel, mobile energy storage, and small power solutions has driven rapid market developments. Battery protection system (BMS) technology needs further advancement to improve battery safety and efficiency. GaN technology supports this by improving efficiency,…

Driven by the need for higher bandwidth, advanced features, enhanced security, and standardization, automotive OEMs are transitioning to Ethernet solutions. Automotive Ethernet provides the necessary infrastructure to support Software-Defined Networking by centralizing control, enabling flexible configurations and real-time data transfer. To provide OEMs with comprehensive Ethernet solutions, Microchip Technology announces its new family of LAN969x…

SHENMAO America, Inc. announces the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates. This no-clean, halogen-free solder paste offers exceptional anti-thermal fatigue reliability, making it an ideal solution for demanding AI applications. The PF719-P250A solder paste utilizes a newly developed, high-reliability lead-free alloy that provides excellent anti-thermal…

MIKROE has launched Click Shield for FRDM-MCXN947, a versatile expansion device for the NXP development board. The shield provides three mikroBUS sockets, enabling designers to prototype and develop using multiple Click boards. MIKROE releases one new Click board nearly every day: currently, there are over 1700 compact add-on boards to choose from across categories such…

TDK Corporation introduces the xEVCap, a standardized and modular DC link capacitor design for powertrain inverters in passenger cars, commercial and off-highway vehicles, and machinery tools. Typically, such capacitor designs are fully customized, making the development time-consuming and practical only in large production volumes. In addition, if the customer requirements change during the project, this…