STMicroelectronics, a global semiconductor leader, had introduced a new easy-to-use graphical design tool for STM32(TM) microcontrollers. This enabled small electronic products like wearables and IoT devices to offer high-end audio features like advanced aural user interface. And now, ST has joined hands with DSP Concepts, creator of Audio Weaver Design Suite, to introduce a free version of the ST-AudioWeaver.This is being offered to the developers who use the 32-bit ARM® Cortex®-M based STM32 microcontrollers. Audio Weaver allows product designers to build complex digital audio applications without coding. Now developers can simply choose the required audio modules from a library, connect them graphically and then adjust them by live-tuning on the target hardware. 

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the expansion of its STSAFE family of secure elements with the introduction of a powerful plug-and-play solution that provides state-of-the-art security features to devices connected to the Sigfox low-power wide-area network (LPWAN). The new STSAFE-A1SX secure element (SE) is based on a tamper-resistant Common Criteria EAL5+ -certified SE technology that enhances the integrity and confidentiality of transmissions to and from the IoT device over the Sigfox network. The secure element runs an optimized secure application that combines ST’s proven expertise in electronic security for applications in banking, e-commerce, and identity with Sigfox’s expertise in networking and data communications for the emerging IoT world.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and USound GmbH, an innovative and fast-growing audio company, today announced their collaboration on the industrialization and production of the world’s first miniature piezoelectric MEMS (Micro-Electro-Mechanical Systems) actuators for smart audio systems in portable devices.The patented micro-speaker technology from USound aims to replace commonly used balanced-armature and electrodynamic receivers for handsets with a small piezo-MEMS actuator. Manufactured using ST’s industry-leading thin-film piezo-electric (TFP) technology, these actuators will improve scalability and cost while assuring lower power consumption and heat dissipation in hearables and smartphones devices, without compromising audio quality.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Airbiquity, a global leader in connected vehicle services, will demonstrate the integration of Airbiquity’s software update management service into ST’s telematics and connectivity processors (Telemaco) at Mobile World Congress (MWC), the world’s largest gathering for the mobile industry. The MWC demonstration features Airbiquity’s Over-The-Air (OTA) Software & Data Management offering integrated into the ST Telemaco3 Evaluation Board (EVB). Presenting how the technology protects consumers, their automotive investment, and manufacturers, the demo highlights the interoperability between the Airbiquity cloud-based service and the on-board ST Telemaco3 EVB platform in a variety of software-update campaign scenarios and typical Original Equipment Manufacturers’ (OEM) OTA use cases.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has released its third-generation laser-ranging sensor based on its industry-leading FlightSense(TM) technology. The VL53L1 sensor benefits from new patented silicon- and module-level architectures, adding for the first time, optical lenses to the module.This combination boosts core performance while ­introducing many new features including multi-target detection, cover-glass crosstalk immunity at long distance, and programmable multi-zone scanning. These advances deliver new levels of sensor performance to robotics, user detection, drones, IoT, and wearable applications. With a form factor of 4.9 x 2.5 x 1.56mm, the sensor module integrates a new lens system, a 940nm VCSEL invisible-light source, a processing core, and a SPAD photon detector.