Renesas Electronics Corporation recently introduced a new radiation-hardened 16-channel current driver. It is integrated with 4-bit decoder that helps in size, power, and weight reductions of telemetry system and satellite command.
Renesas Electronics Corporation recently introduced its Cockpit Reference Solution that will offer an out-of-the-box development experience for designing cost-effective digital cockpit applications. It will also reduce the design to market time to quite an extent.
Arm recently announced the release of its brand new portfolio of IPs that is designed to blend the best of IoT, 5G, autonomous driving, and AI (Artificial Intelligence) to breed most viable solutions. It is one firm that seems totally dedicated to new age solutions ranging from networks to clouds.
Mouser Electronics is now stocking up DS28E84 and DS28E39 DeepCover authenticators from Maxim Integrated. These secure authenticators will allow engineers to bring-in an additional layer of security to applications like medical sensors, secure peripherals, device management, and IoT (Internet of Things) nodes.
Digi-key Electronics, one of the most renowned electronic components distributor, along with BQR Reliability Engineering Ltd. recently presented a collaboration to give our a powerful yet simple MTBF (Mean Time Between Failure) calculator that would assist Digi-Key’s customers all across the globe.
The leading supplier of highly developed semiconductor solutions recently spoke of its plans to shortly introduce security solution based on Renesas RZ/C Linux Platform. It will play a key role in shrinking the time range needed for users to gain certification under the new international standard named as IEC 62443-4-2. Certification for this new standard ensures that the security technology released under this tag will keep the industrial control system safe from cyberattacks.
Digi-Key Electronics recently released a completely new secondary KiCad library named as Digi-Key Partner Library on GitHub. This new library will be an add-on to the already functions Digi-Key KiCad library that was introduced last year. The earlier version of this library was created and curated by Digi-Key’s Applications Engineering team. It was developed to help manufacturers submit their own footprints and symbols that can be compiled into Digi-Key format.
IBASE Technology INc. recently introduced new UPC series Panel PCs for smart retail applications. These panel PCs measure 21.5-inch and are completely fanless. Featuring a full flat bezel design along with a 192 x 1080 IPS LCD and capacitive touch screen, these PCs work on gesture touch and multi-touch functionalities.
32-bit MCU (Microcontroller) applications vary across wide scales of development models and complexities. The team working at Microchip Technology Inc. has worked out a few solutions that will definitely ease up the process for designers and help them scale designs in a more efficient manner.
Littelfuse Inc. recently added two new products to its expanding line of Schottky Diodes. The product line has 650V, AEC-Q101- certified SiC (Silicon Carbide) Schottky Diodes. Both these series will help power electronics system designers with lots of performance benefits over the customary silicon-based devices.
ON Semiconductor recently released two advanced SiC (Silicon Carbide) MOSFET devices. These two new products are the AEC-Q101 automotive grade NVHL080N120SC1 and industrial grade NVHL080N120SC1. The two additions promise plethora of performance wide band gap technology benefits to some of the most crucial high growth end application areas like server power supplies, solar power supplies, uninterruptible power supplies, electric vehicles, Automotive DCDC, as well as onboard charger applications.
Portable Li-ion battery-powered electronics designers can now take a sigh of relief with the most flexible and simplified USB Type-C charging system. Adding these chargers to their systems now gets more simplified with Maxim’s MAX77860 3A switch-mode charger.
AOI (Automated Optical Inspection) refers to automated visual inspection of PCB (Printed Circuit Board) manufacture. Here, a camera scans a given device autonomously for quality defects as well as catastrophic failures. Such inspections are usually used in manufacturing processes since these are non-contact test methods. During manufacturing processes, quality defects can enter at any point of time and impact the overall quality of a given product.
Renesas Electronics Corporation recently introduced a new pair of encapsulated hybrid digital DC/DC PMBus™ power modules, the 15-amp ISL8282M and the 10-amp ISL8280M. These hybrid digital power modules promise best-in-class power density amounting to 115mA/mm2 just inside 12mm x 11mm packaging. What makes the deal even better is the efficiency threshold that now stands at 95 percent.
Fujitsu Limited and Fujitsu Advanced Engineering Limited recently announced that they have successfully completed the field trial that was being performed using image processing technology to recognize the stone blocks positions prior collapsing of walls in an earthquake.
The leading vendors of customized and standardized embedded computer modules and boards, Congatec, recently introduced the SMARC 2.0 Quick Starter Kit for the new family of NXP i.MX 8 QuadMax processors. It is a complete kit that caters all developers requirements related to evaluation of latest NXP i.MX 8 processor generation.
Littelfuse Inc. launched the first PxxxxS4xLRP Series SIDAC Protection Thyristor two days back. The thyristor promises a robust protection against CVBS (Composite Video Blanking Sync) signal ports from disastrous overvoltage transients. It represents a unique fusion of 6V operational voltage along with 100A 5/310 µs surge peak current ability and a very low junction capacitance rating. All these make the P0080S4BLRP perfect for securing a comprehensive portfolio of devices requiring data line protection.
Intel recently declared that it has released the Intel Thunderbolt protocol specification t the USB Promoter Group. This new allow the firm to make Thunderbolt™ available universally. Release of this new protocol will allow chip makers across the world to create silicon compatible with Thunderbolt without any royalty. Adding to this, the USB Promoter Group also released the much awaited USB4 specifications supporting Thunderbolt protocol.
World’s leading seller of customized and standardized embedded computer boards and modules, Congatec, recently introduced embedded form factors with brand new 8th Generation Intel Core™ Mobile processors. One of the first in world, this new launch includes COM Express Type 6 Compact modules, Thin Mini-ITX motherboards, and 3.5-inch SBCs.
Qorvo recently announced addition of an innovative RF portfolio of LNA and FEM modules, amplifiers, and filters in its range of products. All these new add-ons will cater an extended range of systems like CATV broadband, base stations, and 5G systems. It eases lot many mammoth tasks for designers across the globe. Here is a breakdown of all new products.