Components

Infineon Technologies AG is expanding its product offering for battery management systems with a new sensing and balancing IC: the TLE9012AQU. The device is especially designed for batteries in hybrid and electric cars, but it is also suitable for other applications. The TLE9012AQU measures the voltage in up to 12 battery cells with an accuracy of ±…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced a new pair of 100V half-bridge MOSFET drivers: the HIP2211 and HIP2210. The HIP2211 is a next-generation pin-compatible upgrade to Renesas’ popular ISL2111 bridge driver, while the new HIP2210 offers a tri-level PWM input to simplify power supply and motor drive design. The HIP2211…

Melexis announces the MLX90395 Triaxis Magnetometer Node, an automotive-grade (AEC-Q100) monolithic sensor, which uses the Hall effect to provide contactless sensing in three dimensions. The dual-die version of the MLX90395 provides redundancy for demanding scenarios, such as gear lever position sensing in automotive applications. The functionality of the MLX90395 is defined through the system processor, rather than…

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, unveiled four new I3C Basic bus extension products for control plane designs across a variety of applications. These include data center and server applications, as well as enterprise, factory automation, and communications equipment. The new products are: IMX3102 2:1 bus multiplexer IMX3112 1:2 bus expander…

OmniVision Technologies, Inc., a developer of advanced digital imaging solutions, announced the OVM9284 CameraCubeChip module — the world’s first automotive-grade, wafer-level camera. This one megapixel (MP) module has a compact size of 6.5 x 6.5 mm to provide driver monitoring system (DMS) designers with maximum flexibility on placement within the cabin while remaining hidden from…

TDK Corporation has launched the ACT1210G-800-2P, a new type of common-mode choke that conforms to the standards of the OPEN Alliance (One-Pair Ether-Net) for 1000BASE-T1. As a result of the high values of the S-parameters, a high-amplitude ratio is created between differential and common-mode levels – a decisive factor for signal integrity in the automotive…

Mitsubishi Electric Corporation recently announced the launch of its MELFA ASSISTA series of robots, which work collaboratively with humans. The robots include safety features, such as collision detection and strict compliance with the international safety and robotic standards ISO 10218-1 and ISO/TS15066. The series will also introduce the intuitive engineering software — RT VisualBox —…

Infineon Technologies has developed the world’s first fully self-contained Raspberry Pi audio amplifier HAT (Hardware attached on Top) board. It offers high-definition audio at boom box power levels in a small form factor. The Infineon proprietary multi-level technology ensures minimum size and consumption, state of the art power efficiency, and HD audio quality for Raspberry…

Vishay Intertechnology, Inc., one of the world’s largest manufacturers of discrete semiconductors, has enhanced its MC AT precision series of Automotive Grade thin-film chip resistors with a wider range of resistance values — from 47 Ω to 10 MΩ in the 1206 case size. The MCA 1206 AT is the industry’s only such device to…

CUI Inc. recently unveiled nine ac-dc power supplies for a wide range of consumer, industrial, and ITE applications that use pumps or motors. The PSK-S12B, PSK-S25B, PSK-S60B, VOF-S12B, VOF-S25B, VOF-S60B, VOF-S12C, VOF-S25C, and VOF-S60C offer 12 to 60 W of continuous power in chassis and board-mount packages. Features include: The PSK-S12B/S25B/S60B, VOF-S12B/S25B/S60B and VOF-S12C/S25C/S60C comply with UL/EN/IEC 62368-1. The PSK-S12B/S25B, VOF-S12B/S25B and VOF-S12C/S25C…

Harwin, a supplier of reliable and high-performance connectivity solutions, has introduced flexible printed circuits (FPCs) for its Datamate J-Tek and Gecko high-reliability (Hi-Rel) connectors. As a result, printed circuit boards or PCBs (which mechanically supports and electrically connects electrical or electronic components within a system design) can now be stacked much closer together, proving their…

Microchip Technology Inc. recently announced its next-generation AVR DA family of microcontrollers (MCUs) – its first Functional Safety Ready AVR MCU family with Peripheral Touch Controller (PTC). Featuring core independent peripherals, advanced analog and on-chip communications, the MCU family fulfills the requirements of higher-performance microcontrollers for better real-time control, as well as enhanced human machine interface…

Nexperia, a provider of essential semiconductors, has launched the industry’s first family of P-channel MOSFETs in a reliable, space-saving LFPAK56 portfolio. Previously, N-channel devices were only available in LFPAK packaging. However, Nexperia has now extended the options to include the P-channel feature, based on demand. As part of the LFPAK56 (Power-SO8) package, the new devices…

Renesas Electronics Corporation, a provider of advanced semiconductor solutions, has introduced RA4W1 — the first RA microcontroller (MCU) with enhanced security and privacy for Bluetooth 5.0 low energy connections. The single-chip MCU, with an integrated Bluetooth 5.0 radio, is supported with a flexible software package (FSP) that enables engineers to begin development with Arm ecosystem…

ULX35 is an open-source, reliable, and compact FPGA dev board. It features a balanced combination of expansions and components Although it was designed primarily as a teaching tool for mastering the principles of digital circuit design, ULX3S incorporates a wide array of features and interfaces, which lets it serve as a broadly useful module for…

Microchip Technology has unveiled its 53100A Phase Noise Analyzer, a smaller, higher-performance phase noise test instrument. The product is designed to help research and manufacturing engineers who rely on precise and accurate measurement of frequency signals generated for a variety of uses in 5G networks, data centres, commercial and military aircraft systems, space vehicles, communication…

ON Semiconductor recently announced the sampling of its new QCS-AX2 chipset series, which provides flexible configurations for fast 6 GHz adoption with an enhanced Wi-Fi 6E standard. The high-performance, flexible architecture optimally supports Wi-Fi applications, such as access points, gateways, and mesh networking solutions for dense environments and underserved areas. The new series is built on…

Dialog Semiconductor has launched a new DA14531 module that provides an easy-to-configure solution to facilitate and support the next-generation of Internet of Things (IoT) systems. The SmartBond TINY module is specifically designed to significantly reduce the cost of adding Bluetooth low-energy functionality to an IoT device. Its easy- to-use design and software aids in development…

CUI Inc. has launched the ultra-thin VXO78-500-M, its first four-contact, surface-mount, non-isolated converter that offers extreme efficiency at a low cost. It is the latest addition to the company’s dc-dc converter line. Features include: 500mA output current No-load input current (which is as low as 0.2mA) A wide -40 to +85° C temperature range A…

Semiconductor manufacturer, ROHM, recently developed a BD183x7EFV-M, a 4-channel linear LED driver that substantially reduces the circuit board area and design cycle of automotive LED lights. The new product has built-in MOSFETs for the increasingly popular LED rear lights (brake lights, rear tail lights), fog lights, turn signals, etc. The driver IC BD183x7EFV-M adopts two…