Components

Nexperia, a semiconductor provider, has released a new series of 500 mA dual resistor-equipped transistors (RET) in ultra-compact DFN2020(D)-6 packaging. These devices have been designed for load switching in wearables and smartphones. They’re also ideal for use in digital circuits with higher power requirements, such as space-constrained computing, communications, industrial, and automotive applications. Notably, the…

Nexperia, a semiconductor provider, announced it has entered into a partnership with KYOCERA AVX Components, an international supplier of advanced electronic components, to jointly produce a new 650 V, 20 A silicon-carbide (SiC) rectifier module. The new rectifier module will be for high-frequency power applications ranging from 3 to 11 kW power stack designs —…

AMD recently announced the AMD Kria K24 System-on-Module (SOM) and its new KD240 Drives Starter Kit, which are the latest additions to the Kria portfolio of adaptive SOMs and developer kits. AMD Kria K24 SOM offers power-efficient computing in a small form factor and targets cost-sensitive industrial and commercial edge applications. Advanced InFO (Integrated Fan-Out)…

Products that have Qualified Manufacturers List (QML) designations are often the most trusted and readily accepted in space program designs. As designated by the Defense Logistics Agency (DLA), the RT PolarFire FPGA from Microchip Technology is now QML Class Q qualified. This certification is considered the gold standard in entry-level qualification, enabling designers to begin…

AMD announced the AMD Alveo UL3524 accelerator card, a new fintech accelerator designed for ultra-low latency electronic trading applications. Already deployed by leading trading firms and enabling multiple solution partner offerings, the Alveo UL3524 provides proprietary traders, market makers, hedge funds, brokerages, and exchanges with a state-of-the-art FPGA platform for electronic trading at nanosecond (ns) speed.…

Broadcom Inc. announced the availability of its 5nm 200G/lane optical PAM-4 DSP PHY, the Sian BCM85822, at the 49th European Conference on Optical Communication (ECOC 2023). The new BCM85822 features 200G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost-effectively deliver 800G and 1.6T pluggable modules and meet the growing bandwidth needs and low power consumption…

Designing systems for the intelligent edge has never been more difficult. Market windows are shrinking, the costs and risks of new designs are rising, thermal constraints and reliability are twin priorities, and the need for cradle-to-grave security continues to grow. Satisfying these simultaneous demands requires immediate knowledge of special technology and vertical-market expertise. There’s no…

MediaTek announced that it has successfully developed its first chip using TSMC’s 3nm technology — taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC. Both companies are taking advantage of their chip design and manufacturing strengths to…

CUI Inc., a Bel group company, announced the release of its PTP15 Series — a 15 W, 5 Pin DIP isolated DC-DC converter, specialized for medical instrumentation and home medical supplies. Offering 4000 Vac isolation or 5600 Vdc isolation with a 2:1 input voltage range, the series is compliant with the IEC/EN 60601-1 and EN…

Samsung Electronics, a global provider of advanced memory technology, announced the release of its latest lineup of the T-series, the Portable Solid State Drive (SSD) T9. With its stylish and portable design, the T9 is built to keep data safe while on the go, empowering users with fast transfer speeds and ample storage, and providing…

STMicroelectronics‘ new SPSB081 automotive power-management IC is a Swiss Army Knife of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers, a CAN FD transceiver, and an optional LIN transceiver. The ICs provide multiple standby modes with very low quiescent current and programmable local or remote wake-up to help…

The rapid industrial adoption of USB-C is owed to its slim design, user-friendly and universal connectors, and versatility in handling multiple data protocols, such as USB4, Thunderbolt, and HDMI. The USB-C can deliver up to 240 W of power making it the power connector of choice for a wide variety of applications. To meet the…

Keysight Technologies has introduced its new Phased Array Antenna Control and Calibration solution, a breakthrough over-the-air (OTA) calibration and characterization solution that enables satellite designers to develop active electronically scanned arrays for satellite communications applications to rapidly test their designs during early validation. Modern satellite networks operate at higher frequencies and use active phased array…

Texas Instruments (TI) has introduced its new opto-emulator portfolio of signal isolation semiconductors, designed to improve signal integrity, consume less power, and extend the lifetime of high-voltage industrial and automotive applications. TI’s inaugural opto-emulators are pin-to-pin compatible with the industry’s most common optocouplers, enabling seamless integration into existing designs while leveraging the unique benefits of…

Qualcomm Technologies has announced two new spatial computing platforms — Snapdragon XR2 Gen 2 and Snapdragon AR1 Gen 1 — which will enable the next generation of mixed reality (MR), virtual reality (VR) devices, and smart glasses. Snapdragon XR2 Gen 2 Platform: brings premium MR and VR technology into a single-chip architecture to unlock next-level…

Keysight Technologies introduces the Keysight EDA 2024, a tightly integrated suite of electronic design automation (EDA) software tools that ensure first-pass success. This new integrated EDA software facilitates a “shift left” approach to increase productivity for engineers developing high-speed, high-frequency products in multiple applications. “Shift left” is an established electrical engineering practice that moves design…

ETS-Lindgren and Rohde & Schwarz are continuing their long-term collaboration and have enabled antenna performance measurements with comprehensive assisted global navigation satellite system (A-GNSS) capabilities for 5G NR. The R&S CMX500 OBT wide-band radio communication tester and the R&S SMBV100B GNSS simulator in conjunction with EMQuest software from ETS-Lindgren support current and evolving 5G NR…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced a new addition to its popular RL78 microcontroller (MCU) Family that includes 8- and 16-bit devices for power-sensitive applications. The RL78/G24 features the highest performance among all the devices in the RL78 family, boosting its performance with an application-specific Flexible Application Accelerator (FAA) and a…

Samsung Electronics, a global provider in advanced memory technology, announced that it has developed the industry’s first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM market for PCs and laptops — and potentially even data centers. Samsung’s groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed…

With the step-function increase in data collected and transmitted from cloud-connected edge nodes, Improved Inter Integrated Circuit (I3C) is rapidly becoming a more sustainable solution for interfacing sensors with a high data rate and will help expand capabilities in next-generation devices. Leading the way in I3C integration, Microchip Technology has released its PIC18-Q20 family of microcontrollers…