Congatec Announces Extended Roadmap to Bring 10GbE Inter-connectivity to Industrial Fields

Congatec, a leading manufacturer of embedded computer modules, single board computers, and embedded design, has unveiled the extended roadmap so as to bring 10 GbE inter-connectivity to the industrial fields. With the introduction of this service, the company aims to realize the industry vision of entirely closed, fanless infrastructure components.

These low-power x86 nodes for gateway, edge, and fog computing has various IoT applications ranging from vision system infrastructure for public safety to real-time smart data servers in industry 4.0 applications to rugged telecom and network equipment.

The platform has been developed to enable the embedded system engineers to design small form factor edge nodes with a low power envelope of less than 20 watts. The details of the roadmap will be featured at the UK’s Engineering Design Show in Conventry and attendees will be able to make an early request for the platforms through Congatec’s exclusive early access program.

The new platforms deliver 10 GbE bandwidth in real-time and support virtualization technologies to maximize uptime and resilience, minimize latency, and ensure the most performance from each processing core. Along with Congatec Clod API, these enable data center managers to remotely manage and monitor systems. Besides, these platforms also offer minimum latency for storage devices and fast access lanes to various sensor networks, field buses, etc.

Congatec AG

Headquartered in Deggendorf, Germany, Congatec AG is a leading supplier of industrial computer modules using the standard form factors COM Express, Qseven and SMARC as well as single board computers and EDM services. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical, entertainment, transportation, telecommunication, test & measurement and point-of-sale.

Core knowledge and technical know-how include unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards.