Congatec- the leading company for embedded computer modules, single board computers, and embedded design- recently announced ComXTM Standardization Initiative at the Embedded Systems Expo & Conference (ESEC 2017) in Japan. This ComX™ standardization goes beyond the current specifications for computer-on-modules and targets two pillars, the API, and middleware standardization. 

 

These include APIs for IoT Gateways or embedded features of COM Express Type 7 server-on-modules, as well as, approved circuit diagrams and logic for demanded carrier board implementations like FPGA integration, switching logic for USB-C, or for SMART battery logic.

 

The goal is to establish an additional design-in and API standardization on top of the core standards to further simplify the development of customers’ dedicated applications based on standardized embedded computing building blocks. ComX™ standardization addresses everything beyond the existing module-centric standards.

 

A selection of standardized options is showcased at the Congatec ESEC booth and additional vendors are invited to help further establish the standardization of these features within the PICMG and SGET.

 

Christian Eder, Director Marketing at Congatec and Draft Editor of various PICMG and SGET specifications, explains:

 

 “Significant improvements for design efficiency are highly demanded by embedded and IoT system engineers, who are faced with the design challenge of having to deliver more new product designs in the same or even shorter time frames. They can meet these challenges by switching from full custom, single PCB designs to more flexible designs based on application ready computer-on-modules. We can boost this efficiency even more, by offering an additional standardization on top of the computer-on-module centric specifications”.