Congatec, a leading supplier of embedded computer modules and single board computers, has officially released the COM Express 3.0 specification. This specification formally integrates the new Type 7 pinout type, the basis for the brand’s Server-on-Modules. 

 

The official release of the new specification marks the beginning of a race to a new generation of server designs that are based on the standardized Server-on-Modules. The new products offer the most cost-effective designs and upgrades across all the existing as well as forthcoming generations of server class processors and sockets, irrespective of the vendor. 

 

The Server-on-Modules are highly suitable for all the embedded and IoT server designs in harsh industrial environments in situations when there is a restricted space and the high-bandwidth is needed to connect various controls in the industry 4.0 fields. 

 

 

As per a recent report, the embedded design engineers are facing the challenge of managing more projects within a short time period which in turn is creating massive time pressure for the execution of such projects. In these situations, Server-on-Modules can deliver vital design efficiency improvements by rendering an application ready server core rather than a handful of individual components.

 

“Server farms need constant upgrades to improve the performance and energy efficiency per rack. With the new Server-on-Modules, operators can execute these upgrades by simply exchanging standardized modules instead of complete and costly server boards or even rack systems,” explains Christian Eder, Editor of the PICMG COM Express 3.0 specification and Director Marketing at Congatec. 

 

Customers can request for COM Express Type 7 Server-on-Modules, carrier boards, and starter kits for evaluating the new generation modules. The latest Server-on-Modules offer server-grade performance and support Intel Xeon D processors, 2x 10 GbE and 32 PCIe lanes. These can also be used for powerful intrasystem expansions such as GPGUs and NVMe based ultra-fast storage devices as well as multi-module configurations on one single carrier board for High-Performance Computing designs.