Congatec- a pioneer in the field of embedded computer modules, single board computers and embedded design and manufacturing- has recently launched the conga-IC175. It’s a thin industrial-grade motherboard family equipped with the new 7th Gen Intel Core U processors.
Developed for IoT connected devices, the new boards are perfectly suitable for space-constrained, high-performance and low-power IoT designs. Apart from all the enhancements, it is also offered with a comprehensive IoT support including a SIM card socket for 3G/4G or Narrow Band Connectivity, and first versions of congatec Cloud-API.
Interested buyers may order their new Thin Mini-ITX board coupled with the following processors:
Owing to the low profile design of the Thin Mini-ITX industrial motherboard lineup, it’s perfectly suitable for slim system designs including industrial GUIs/HMIs, point-of-sale terminals, digital signage systems, and medical tablets. The boards are also compatible with Hyper-Threading which turns the dual-core design into a 4-in-1 system while utilizing the RTS real time hypervisor.
The users can even avail an optional feature in the form of ultra-fast Intel Optane memory via M.2 connector that enables extremely fats system boots, application starts, video recording and processing, and software updates. The new flagship motherboard design is offered with a long-term availability of 7 years alongside a comprehensive set of industrial interfaces and drivers. Lastly, the design-in phase is extremely simple that makes it an easy job for OEM engineers.
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