CUI’s Thermal Management Group has unveiled a new line of Peltier Modules that gets superior performance and reliability from its innovative arctic structure. This unique construction skillfully integrates thermally conductive resin between the ceramic and copper on the module’s cold side with high temperature solder, and larger P/N elements made out of premium silicon ingot.
The elasticity of arcTEC’s resin layer facilitates the contraction and expansion during the repeated heating and cooling of normal operation. This reduces the stress on the elements which in turn results in a better thermal connection, superior mechanical bond, and no marked drop-off in performance over time. Besides, the high temperature solder and larger silicon elements allow faster and more uniform cooling.
CUI Introduces New Range of Peltier Modules (Image Courtesy: CUI)
The lineup is comprised of CP20H, CP30H, CP39H, CP60H, and CP85H series; all employing the arctic structure. These modules range from 15 mm to 40 mm in size with profiles as low as 3.1 mm. These thermoelectric modules are available with current ratings ranging from 2.0 A to 8.5 A and a ∆Tmax of 77°C (Th=50°C).
Owing to the presence of a reliable solid state construction, quiet operation, and precise temperature control, these thermoelectric coolers are ideally suitable for high density, high power medical and industrial applications as well as for the refrigerated and sealed environments where forced air cooling is not an option.
Availability and Pricing:
The new lineup of Peltier Modules consisting of the CP20H, CP30H, CP39H, and CP85H series are offered at the price tag of USD 15.53 per unit at 25 pieces through the distribution channels.
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