The powerful combination of complementary Bluetooth LE and 802.15.4 protocols enhances the performance of smart home products with seamless interoperability, enabling end-to-end encrypted communication between individual devices in a Matter network.
Infineon’s AIROC CYW30739 Bluetooth LE & 802.15.4 SoC features a low-power radio, which is a key component in low-power multi-protocol systems with rock solid connectivity. More importantly, it offers superior RF performance for robust connections and best user-experience without connection drops.
The low-power consumption supports applications that require extended battery life including smart home, smart building, smart lighting and more. These design techniques and process technology are extremely efficient to help reduce active and idle power.
AIROC CYW30739 includes -95.5dBm LE Rx and -103.5dBm 802.15.4 sensitivity for reliable, long-range Bluetooth and multi-protocol connectivity. This smart coexistence creates a seamless interaction between a plethora of connected devices, ultimately providing a better user experience with the smart home.
The integrated 96-MHz Arm Cortex-M4 microcontroller unit with floating point unit delivers high-performance computing as well as a highly optimized memory system across flash, RAM, and ROM.
“With the launch of the AIROC CYW30739 Bluetooth LE & 802.15.4 SoC, Infineon is entering the 802.15.4 market to deliver high-performing, low-power solutions with seamless, secure connectivity to enable more convenient, energy efficient smart homes,” said Sonal Chandrasekharan, VP of the Bluetooth product line at Infineon. “Infineon is excited to enter this market with Matter-ready products across our wireless portfolio.”
To further demonstrate the company’s commitment to Matter, Infineon recently expanded its role with the Connectivity Standards Alliance by joining the Alliance’s Board of Directors as a Promoter Member.
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