Infineon launches TRENCHSTOP 1700 V IGBT7 chip technology

Infineon Technologies has launched the new TRENCHSTOP 1700 V IGBT7 chip in the standard industrial package EconoDUAL 3. With this new chip technology, the EconoDUAL 3 provides currents of 900 A and 750 A, enabling an improved power range for inverters. The modules target a wide range of applications including wind, drive, and static VAR generators (SVG).

Compared to modules with the previous IGBT4 chipset, the FF900R17ME7_B11 with the TRENCHSTOP IGBT7 chip enables up to 40 percent higher inverter output current in the same package size. The new 1700 V IGBT7 modules also feature significantly lower static and dynamic losses while addressing applications with prevailing static losses in diode chips.

Additionally, the new chip technology offers enhanced du/dt controllability and improved diode softness. Induced by cosmic rays, the FIT rate has also been significantly improved — an important parameter when working with high DC link voltage. Furthermore, the new power modules feature a maximum overload junction temperature of 175° C.

Along with the best-in-class 1700 V EconoDUAL 3 with 900 A, a 750 A module with a larger diode has also been introduced to further increase the flexibility of the new portfolio. Overall, the new EconoDUAL 3 1700 V modules with the TRENCHSTOP IGBT 7 chip can increase the power density of the inverter and achieve a new level of performance in a wide range of applications.

The FF900R17ME7_B11, FF750R17ME7D_B11 and FF225R17ME7_B11 can be ordered now. The roll-out of the portfolio, specifically the current classes from 300 A to 750 A, will follow at the end of 2022.