Engineers Garage

  • Electronic Projects & Tutorials
    • Electronic Projects
      • Arduino Projects
      • AVR
      • Raspberry pi
      • ESP8266
      • BeagleBone
      • 8051 Microcontroller
      • ARM
      • PIC Microcontroller
      • STM32
    • Tutorials
      • Audio Electronics
      • Battery Management
      • Brainwave
      • Electric Vehicles
      • EMI/EMC/RFI
      • Hardware Filters
      • IoT tutorials
      • Power Tutorials
      • Python
      • Sensors
      • USB
      • VHDL
    • Circuit Design
    • Project Videos
    • Components
  • Articles
    • Tech Articles
    • Insight
    • Invention Stories
    • How to
    • What Is
  • News
    • Electronic Product News
    • Business News
    • Company/Start-up News
    • DIY Reviews
    • Guest Post
  • Forums
    • EDABoard.com
    • Electro-Tech-Online
    • EG Forum Archive
  • DigiKey Store
    • Cables, Wires
    • Connectors, Interconnect
    • Discrete
    • Electromechanical
    • Embedded Computers
    • Enclosures, Hardware, Office
    • Integrated Circuits (ICs)
    • Isolators
    • LED/Optoelectronics
    • Passive
    • Power, Circuit Protection
    • Programmers
    • RF, Wireless
    • Semiconductors
    • Sensors, Transducers
    • Test Products
    • Tools
  • Learn
    • eBooks/Tech Tips
    • Design Guides
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • Digital Issues
    • EE Training Days
    • LEAP Awards
    • Podcasts
    • Webinars / Digital Events
    • White Papers
    • Engineering Diversity & Inclusion
    • DesignFast
  • Guest Post Guidelines
  • Advertise
  • Subscribe

Infineon’s QDPAK and DDPAK cooling packages registered for JEDEC standard

By Michelle Froese February 15, 2023

The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility.

To push these boundaries, Infineon Technologies has announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC standard. This registration further solidifies Infineon’s goal to help establish a broad adoption of TSC in new designs with one standard package design and footprint.

Learn more in this pre-recorded livestream.

Additionally, this provides flexibility and comfort to OEM manufacturers to differentiate their products in the market and take power density to the next level to support various applications.

“As a solutions provider, Infineon continues to influence the semiconductor industry through innovative packaging technologies and manufacturing processes,” said Ralf Otremba, lead principal engineer for High Voltage Packaging, Infineon. “Our advanced top-side cooled packages bring significant advantages to the device and system levels to fulfill the challenging demands of cutting-edge high-power designs. Package outline standardization will help ease one of the main design concerns of OEMs for high-voltage applications by securing pin-to-pin compatibility across vendors.”

For more than 50 years, the JEDEC organization has been the global leader in developing open standards and publications for the microelectronics industry for a broad range of technologies, including package outlines. JEDEC has been widely accepting semiconductor packages, such as the TO220 and TO247 through-hole devices (THD) — devices that have been prominently used over the past decades and are still an option in new onboard charger (OBC) designs, high voltage (HV), and low voltage (LV) DC-DC converters.

The registration of QDPAK and DDPAK surface-mounted (SMD) TSC package designs signals a new era for package outlines ushering a wide market adoption of the TSC technology as a replacement for TO247 and TO220, respectively. With the benefits of this technology, this new JEDEC package family registration, according to the MO-354 standard, serves as a key enabler for the transition of high-voltage industrial and automotive applications to top-side cooled designs in next-generation platforms.

To facilitate design transition for customers from the TO220 and TO247 THD devices, Infineon has designed QDPAK and DDPAK SMD devices to deliver equivalent thermal capabilities with improved electrical performance. Based on a standard height of 2.3 mm for QDPAK and DDPAK SMD TSC packages for HV and LV devices, developers are now able to design complete applications, such as OBC and DC-DC conversion with all SMD TSC devices measuring the same height. Compared to existing solutions that require a 3D cooling system, this facilitates designs and reduces system cost for cooling.

Additionally, TSC packaging offers up to 35% lower thermal resistance than standard bottom-side cooling (BSC). By enabling the use of both PCB sides, TSC packages offer better board space use and at least two times more power density. The thermal management of the packages is also improved by thermal decoupling from the substrate since the thermal resistance of the leads is much higher compared to the exposed package top side.

Because of the improved thermal performance, stacking different boards is not necessary. Rather than combining both FR4 and IMS, a single FR4 is enough for all components and also requires fewer connectors. These features deliver an overall bill of materials (BOM), which ultimately reduces overall system cost.

In addition to improved thermal and power capabilities, TSC technology also offers an optimized power loop design for increased reliability. This is possible by the placement of the drivers, which can be placed very close to the power switch. The low stray inductance of the driver switch loop, reduces the loop parasitics, and leads to less ringing on the gate, higher performance and a smaller risk of failures.


Filed Under: Components, E mobility, News, Power Management
Tagged With: coolingpacakges, ddpak, electromobility, infineontechnologies, jedec, powermangement, qdpak, topsidecooling
 

Next Article

← Previous Article
Next Article →

Questions related to this article?
👉Ask and discuss on Electro-Tech-Online.com and EDAboard.com forums.



Tell Us What You Think!! Cancel reply

You must be logged in to post a comment.

EE TECH TOOLBOX

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE Learning Center

EE Learning Center
“engineers
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

HAVE A QUESTION?

Have a technical question about an article or other engineering questions? Check out our engineering forums EDABoard.com and Electro-Tech-Online.com where you can get those questions asked and answered by your peers!


RSS EDABOARD.com Discussions

  • Thermal modelling of repetitive power pulse
  • Redundant XORs
  • No Output Voltage from Voltage Doubler Circuit in Ansys Nexxim (Harmonic Balance Simulation)
  • Discrete IrDA receiver circuit
  • ISL8117 buck converter blowing up

RSS Electro-Tech-Online.com Discussions

  • Help with finding unique wire lug(s)
  • Simple LED Analog Clock Idea
  • Kawai KDP 80 Electronic Piano Dead
  • Saga 1400sv vinyl cutter motherboard issue
  • using a RTC in SF basic

Featured – LoRa/LoRaWan Series

  • What is the LoRaWAN network and how does it work?
  • Understanding LoRa architecture: nodes, gateways, and servers
  • Revolutionizing RF: LoRa applications and advantages
  • How to build a LoRa gateway using Raspberry Pi
  • How LoRa enables long-range communication
  • How communication works between two LoRa end-node devices

Recent Articles

  • What is the LoRaWAN network and how does it work?
  • Understanding LoRa architecture: nodes, gateways, and servers
  • Revolutionizing RF: LoRa applications and advantages
  • How to build a LoRa gateway using Raspberry Pi
  • How LoRa enables long-range communication

EE ENGINEERING TRAINING DAYS

engineering

Submit a Guest Post

submit a guest post
Engineers Garage
  • Analog IC TIps
  • Connector Tips
  • Battery Power Tips
  • DesignFast
  • EDABoard Forums
  • EE World Online
  • Electro-Tech-Online Forums
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • 5G Technology World
  • Subscribe to our newsletter
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search Engineers Garage

  • Electronic Projects & Tutorials
    • Electronic Projects
      • Arduino Projects
      • AVR
      • Raspberry pi
      • ESP8266
      • BeagleBone
      • 8051 Microcontroller
      • ARM
      • PIC Microcontroller
      • STM32
    • Tutorials
      • Audio Electronics
      • Battery Management
      • Brainwave
      • Electric Vehicles
      • EMI/EMC/RFI
      • Hardware Filters
      • IoT tutorials
      • Power Tutorials
      • Python
      • Sensors
      • USB
      • VHDL
    • Circuit Design
    • Project Videos
    • Components
  • Articles
    • Tech Articles
    • Insight
    • Invention Stories
    • How to
    • What Is
  • News
    • Electronic Product News
    • Business News
    • Company/Start-up News
    • DIY Reviews
    • Guest Post
  • Forums
    • EDABoard.com
    • Electro-Tech-Online
    • EG Forum Archive
  • DigiKey Store
    • Cables, Wires
    • Connectors, Interconnect
    • Discrete
    • Electromechanical
    • Embedded Computers
    • Enclosures, Hardware, Office
    • Integrated Circuits (ICs)
    • Isolators
    • LED/Optoelectronics
    • Passive
    • Power, Circuit Protection
    • Programmers
    • RF, Wireless
    • Semiconductors
    • Sensors, Transducers
    • Test Products
    • Tools
  • Learn
    • eBooks/Tech Tips
    • Design Guides
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • Digital Issues
    • EE Training Days
    • LEAP Awards
    • Podcasts
    • Webinars / Digital Events
    • White Papers
    • Engineering Diversity & Inclusion
    • DesignFast
  • Guest Post Guidelines
  • Advertise
  • Subscribe