Microsemi Corporation, a leading provider of semiconductor solutions, has rolled out a new family of wideband plastic packaged and chip monolithic microwave integrated circuit (MMIC) devices. The addition of these products has led to the growth of high performance wideband MMICs portfolio including 4 plastic packaged low noise amplifiers (LNAs), a wideband power amplifier (PA) chi, and 2 plastic packaged switches. 

 

Two of these LNAs namely MMA040PP5 and MMA041PP5 can outperform their competitive parts with a wider frequency from DC to 27 GHz and a higher gain of 17 decibels (dB) and OIP3 of 35 decibel-milliwatts (dBm). These are packaged in a small 5 mm plastic QFN package ideal for size constrained applications.

 

Moving on, the other two LNAs viz. MMA043PP4 and MMA044PP3 offer exceptionally low noise figure (NF) from 0.5 to 18 GHz with typical NF below 2dB and not more than 2.5 dB at the band edge.

 

Furthermore, the new wideband GaAs switches MMS006PP3 and MMS008PP3 have improved insertion loss and isolation over a wider frequency range from DC to 20 GHz as compared to the competing parts. These are offered in 3 mm plastic QFN packages, ideal for high performance needs in constrained size applications.

 

Lastly, the wideband PA chip MMA053AA has been released with a flat gain of 17 dB and high OIP3 of 35 dBm from DC to 8 GHz , superior to the competing parts. Featuring superior pricing, all these devices’ leading performance capabilities can be leveraged to meet demanding sustem and module line-up needs with minimal DC power consumption.

 

 

 

 

Microsemi’s new family of MMIC devices—including the four wideband LNAs (MMA040PP5, MMA041PP5, MMA043PP4 and MMA044PP3), a distributed wideband PA chip (MMA053AA) and two plastic packaged switches (MMS006PP3 and MMS008PP3)—are sampling now.

 

 

Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.