Engineers Garage

  • Projects and Tutorials
    • Electronic Projects
      • 8051
      • Arduino
      • ARM
      • AVR
      • PIC
      • Raspberry pi
      • STM32
    • Tutorials
    • Circuit Design
    • Project Videos
    • Components
  • Articles
    • Tech Articles
    • Insight
    • Invention Stories
    • How to
    • What Is
  • News
    • Electronic Products News
    • DIY Reviews
    • Guest Post
  • Forums
    • EDABoard.com
    • Electro-Tech-Online
    • EG Forum Archive
  • Digi-Key Store
    • Cables, Wires
    • Connectors, Interconnect
    • Discrete
    • Electromechanical
    • Embedded Computers
    • Enclosures, Hardware, Office
    • Integrated Circuits (ICs)
    • Isolators
    • LED/Optoelectronics
    • Passive
    • Power, Circuit Protection
    • Programmers
    • RF, Wireless
    • Semiconductors
    • Sensors, Transducers
    • Test Products
    • Tools
  • EE Resources
    • DesignFast
    • LEAP Awards
    • Oscilloscope Product Finder
    • White Papers
    • Webinars
  • EE Learning Center
    • Design Guides
      • WiFi & the IOT Design Guide
      • Microcontrollers Design Guide
      • State of the Art Inductors Design Guide
  • Women in Engineering

New Snapdragon X70 Modem-RF offers world’s first 5G AI processor

By Michelle Froese

Qualcomm Technologies has announced the Snapdragon X70 5G Modem-RF System, its 5th generation modem-to-antenna 5G solution. Snapdragon X70 introduces the world’s first 5G AI processor in a modem-RF system, to harness the power of AI for breakthrough 5G performance with 10 Gigabit 5G downloads — offering fast upload speeds, low latency, coverage, and power efficiency.

The capabilities of Snapdragon X70 offer flexibility to global 5G operators to maximize spectrum resources for the best possible 5G connectivity.

The Qualcomm 5G AI Suite is designed for AI-powered optimizations of sub-6 GHz and mmWave 5G links for improved speeds, coverage, latency, mobility, and power efficiency to fuel the Connected Intelligent Edge.

The Qualcomm 5G AI Suite lays the foundation for next-generation 5G performance enhancements, including:

  • AI-based channel-state feedback and dynamic optimization
  • World’s first AI-based mmWave beam management for superior mobility and coverage robustness
  • AI-based network selection for superior mobility and link robustness
  • AI-based adaptive antenna tuning for up to 30 percent improved context detection for higher average speeds and coverage

Built on the global success of Snapdragon X65, X60, X55, and X50 solutions, Snapdragon X70 offers ultimate flexibility for global operators to maximize spectrum resources for deploying the best possible 5G connectivity for consumers, enterprises, and the Connected Intelligent Edge.

Snapdragon X70 features:

  • World’s only comprehensive 5G modem-RF system family capable of supporting every commercial 5G band from 600 MHz to 41 GHz, offering flexibility to OEMs for designing devices capable of supporting global operator requirements
  • Unmatched global band support and spectrum aggregation capabilities, including world’s first 4X downlink carrier aggregation across TDD and FDD, mmWave-sub-6 aggregation
  • Standalone mmWave support to allow MNOs and service providers to deploy services such as fixed wireless access and enterprise 5G, without needing sub-6 GHz spectrum
  • Unmatched uplink performance and flexibility with uplink carrier aggregation and switched uplink support across TDD and FDD
  • True global 5G multi-SIM including Dual-SIM Dual-Active (DSDA) and mmWave support
  • Upgradeable architecture allowing rapid commercialization of 5G Release 16 features through software updates

Snapdragon X70 inherits the unrivaled 10 Gigabit 5G peak download speed of its predecessor and packs in new, advanced capabilities such as Qualcomm 5G AI Suite, Qualcomm 5G Ultra-Low Latency Suite, and 4X carrier aggregation to achieve unmatched 5G speeds, coverage, signal quality and low latency.

The Qualcomm 5G Ultra-Low Latency Suite in Snapdragon X70 allows OEMs and operators to minimize latency for hyper-responsive 5G user experiences and applications.

“Our 5th generation modem-RF system extends our global 5G leadership and the introduction of native 5G AI processing creates a platform and inflection point for performance-enhancing innovations,” said Durga Malladi, senior VP and GM, 5G, Mobile Broadband and Infrastructure, Qualcomm Technologies. “Snapdragon X70 is an example of how we’re realizing the full potential of 5G and making an intelligently connected world possible.”

Snapdragon X70 introduces new Qualcomm 5G PowerSave Gen 3, coupled with a 4nm baseband process, and advanced modem-RF technologies such as Qualcomm QET7100 Wideband Envelope Tracking and AI-based adaptive antenna tuning that dynamically optimize transmit and receive paths across a comprehensive set of user scenarios and signal conditions to significantly reduce power consumption and extend battery life.

Powered by the mobile industry’s most expansive feature set, Snapdragon X70 helps achieve superior 5G performance on more networks globally. Its fiber-like browsing speeds and latency, delivered wirelessly over 5G, pave the way for the next generation of connected applications and experiences.

Devices designed with all key capabilities of the Snapdragon X70 along with best-in-class Qualcomm® FastConnect™ Wi-Fi/Bluetooth systems conform with the new ‘Snapdragon Connect’ badge — which highlights the use of the best connectivity technologies available in Snapdragon Platforms.


Filed Under: 5G, Components, News
Tagged With: 5G, ai, connectivity, modemrf, qualcommtechnologies, snapdragon
 

Questions related to this article?
👉Ask and discuss on Electro-Tech-Online.com and EDAboard.com forums.



Tell Us What You Think!! Cancel reply

You must be logged in to post a comment.

HAVE A QUESTION?

Have a technical question about an article or other engineering questions? Check out our engineering forums EDABoard.com and Electro-Tech-Online.com where you can get those questions asked and answered by your peers!


Featured Tutorials

  • Introduction to Brain Waves & its Types (Part 1/13)
  • Understanding NeuroSky EEG Chip in Detail (Part 2/13)
  • Performing Experiments with Brainwaves (Part 3/13)
  • Amplification of EEG Signal and Interfacing with Arduino (Part 4/13)
  • Controlling Led brightness using Meditation and attention level (Part 5/13)
  • Control Motor’s Speed using Meditation and Attention Level of Brain (Part 6/13)

Stay Up To Date

Newsletter Signup

Sign up and receive our weekly newsletter for latest Tech articles, Electronics Projects, Tutorial series and other insightful tech content.

EE Training Center Classrooms

EE Classrooms

Recent Articles

  • What are the battery-selection criteria for low-power design?
  • Key factors to optimize power consumption in an embedded device
  • EdgeLock A5000 Secure Authenticator
  • How to interface a DS18B20 temperature sensor with MicroPython’s Onewire driver
  • Introduction to Brain Waves & its Types (Part 1/13)

Most Popular

5G 555 timer circuit 8051 ai Arduino atmega16 automotive avr bluetooth dc motor display Electronic Part Electronic Parts Fujitsu ic infineontechnologies integratedcircuit Intel IoT ir lcd led maximintegratedproducts microchip microchiptechnology Microchip Technology microcontroller microcontrollers mosfet motor powermanagement Raspberry Pi remote renesaselectronics renesaselectronicscorporation Research samsung semiconductor sensor software STMicroelectronics switch Technology vishayintertechnology wireless

RSS EDABOARD.com Discussions

  • Very low voltage/power Schmitt trigger?
  • 3D IC Design: Is it possible to stack CPU and FPGA?
  • Advice for my disabled son please
  • 12V 5A needed
  • Vco cadencd

RSS Electro-Tech-Online.com Discussions

  • Disabled son needs advice please
  • Pet Microchip scan
  • Modify a digital clamp ammeter ?
  • Confirming whether this circuit will work
  • How does a blinky/flashing ball work?
Engineers Garage
  • Analog IC TIps
  • Connector Tips
  • DesignFast
  • EDABoard Forums
  • EE World Online
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • 5G Technology World
  • About Us
  • Contact Us
  • Advertise

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Engineers Garage

  • Projects and Tutorials
    • Electronic Projects
      • 8051
      • Arduino
      • ARM
      • AVR
      • PIC
      • Raspberry pi
      • STM32
    • Tutorials
    • Circuit Design
    • Project Videos
    • Components
  • Articles
    • Tech Articles
    • Insight
    • Invention Stories
    • How to
    • What Is
  • News
    • Electronic Products News
    • DIY Reviews
    • Guest Post
  • Forums
    • EDABoard.com
    • Electro-Tech-Online
    • EG Forum Archive
  • Digi-Key Store
    • Cables, Wires
    • Connectors, Interconnect
    • Discrete
    • Electromechanical
    • Embedded Computers
    • Enclosures, Hardware, Office
    • Integrated Circuits (ICs)
    • Isolators
    • LED/Optoelectronics
    • Passive
    • Power, Circuit Protection
    • Programmers
    • RF, Wireless
    • Semiconductors
    • Sensors, Transducers
    • Test Products
    • Tools
  • EE Resources
    • DesignFast
    • LEAP Awards
    • Oscilloscope Product Finder
    • White Papers
    • Webinars
  • EE Learning Center
    • Design Guides
      • WiFi & the IOT Design Guide
      • Microcontrollers Design Guide
      • State of the Art Inductors Design Guide
  • Women in Engineering