To provide comprehensive EMI/RFI protection across horizontal and vertical planes, Harwin has added new additions to its metal backshell shielding options. The company now offers backshells for its horizontal Datamate J-Tek connectors, which address increasingly commonplace right-angle interconnect orientations.
These backshells mate directly with the cabling metal backshells that Harwin already has for its female Datamate cable connectors. This means that a fully EMI/RFI-shielded connection can be established in a horizontal PCB to cable connection.
These newest additions nicely complement the vertical PCB to cable connection shielding products previously available from Harwin, ensuring complete shielding when used in conjunction with a ground plane.
Harwin’s horizontal backshells are not attached to the connector, but placed over them and then independently secured to the board. The inclusion of shielding can, then, be factored into the design at a much later stage — which is advantageous when additional EMI issues appear further into development. They’re also suitable for fitting to through-board or surface mount tails/terminations, and either internal jackscrews or board mount jackscrews can be specified.
As long as there’s sufficient space to accommodate them, the backshells can be added to existing PCB designs or retrofitted into deployed equipment.
There are key opportunities for the new Datamate connector backshells are in satellite, avionics, robotics, and military applications. In such sectors, there are likely to be acute space constraints (such as, with boards tightly packed and potentially close proximity to enclosure housings or sources of interference). Mission-critical or safety-critical aspects also need to be considered, so a high-reliability interconnect solution will be called for.
“We are seeing increased demand for horizontal PCB connections in our customers’ designs, especially in high density situations where boards are being stacked very closely together, such as CubeSats and UAVs,” states Ryan Smart, NPI product manager with Harwin. “Thanks to the addition of these latest backshell options, we can now mitigate the risk of EMI/RFI signal disruption whatever the interconnect orientation.”