Qorvo recently announced addition of an innovative RF portfolio of LNA and FEM modules, amplifiers, and filters in its range of products. All these new add-ons will cater an extended range of systems like CATV broadband, base stations, and 5G systems. It eases lot many mammoth tasks for designers across the globe. Here is a breakdown of all new products.
Fujitsu Limited and Fujitsu Laboratories Ltd. recently made their success in development of miniaturized photodetectors for highly sensitive infrared cameras public knowledge. In coming years, this amazing sensor technology would enable shrinking the size of infrared cameras up to 1/8th of the total size of their predecessors. This new precision and size miniaturization would allow the cameras to capture detailed images from a distance even at night. The world around has high expectations when it comes to usage of highly sensitive infrared cameras for ships navigation under human observation.
NXP’s recently brought-in a 65V LDMOS that allows more efficiently integrated and highly reliable Industry 4.0 systems. The systems carrying 65V LDMOS will be capable of leveraging much better control and energy management. It can be availed from all mainstream channels. With this new addition, NXP is expanding its 65 V LDMOS profile constituted by drivers and others. This is another cherry in the cake that adds to the benefits of already released MRFX1K8H RF power transistor.
Renesas Electronics Corporation recently launched world’s first microcontroller (MCU) loaded with embedded flash. The MCU integrates hardware-based virtualization-assisted function while keeping up the real-time, fast performance of RH85 products. One of its kind, the hardware-based virtualization assist technology is capable of supporting up to ASIL D functional safety level paving way out for higher system integration level. Called as RH850/U2A MCU, it is one of the first members of Renesas’ cross-domain MCUs.
Texas Instruments (TI) recently launched two completely new Ethernet PHY (Physical Layer) transceivers for expansion of connectivity alternatives for designers. The class of designers addressed here includes both time-sensitive networks and space constrained application makers.
IBASE Technology Inc. recently launched a highly integrated IBQ800 low-power consuming CPU module that takes energy either from Intel Atom™ [email protected] or [email protected] processor. A very special module, it is capable of working across a temperature range of -40° C – +85°C, it is perfect for various kinds of vertical market segments and industrial environments such as digital signages, power utility, transportation, ATM, gaming, automation, etc.
STMicroelectronics is now making use of its Arm Cortex excellence for expansion of abilities of STM32 MCU portfolio that is currently leading the industry. The portfolio caters requirements of applications striving for better resources, performance, and large open-source software. The release of STM32MP1 multicore microprocessor series with graphic support, compute support, high feature integration, and power-efficient real-time control paves way for smoother development of high-performance solutions for wellness, health, Smart Home, consumer, and industrial applications.
The leading supplier of highly developed semiconductor solutions recently expanded the highly integrated Renesas Synergy™ S5 MCU (microcontroller) series with S5D3 MCU Group. There are four new additions extending the mid-range S5D5 and high-en S5D9 MCU groups. The S5 features remain a common linking factor among all along with the common features that control the low power IoT, cost-sensitive endpoint devices.
It is imperative to find solutions for enhanced expansion of compute capabilities for higher number of small sized devices located on distant corners of networks. It is one of the foremost conditions for connecting more than a trillion devices all over the world with supreme efficiency. If the tech world is able to accomplish the task of enhancing compute capabilities, it will play a key role in creation of Machine Learning (ML) applications straightaway and help the device in decision making at the source.
IAR Systems, one of the best suppliers of software tools and services for embedded development, along with Secure Thingz recently announced that availability of security environment Embedded Trust™ that can be implemented in designs via embedded development toolchain IAR Embedded Workbench.
ON Semiconductor recently brought forth RSL10 Sensor Development Kit that will be a blessing for engineering teams seeking an extensive platform for IoT applications development with cutting-edge smart sensor technology. And bonus, this one comes loaded with the lowest power consuming Bluetooth Low Energy radio in complete industry.
The leading supplier of highly developed semiconductor solutions recently implemented KNX protocol over its G3-PLC™ PLC (Powerline Communication solution. In order to help everyone understand how to implement KNX networks and benefit from the efficiency and flexibility of advanced G3-PLC technology, Renesas will be demonstrating the proof of embedded world concept in Nuremberg, Germany from 26th – 28th February 2019 in Booth -310.
Fujitsu recently came up with its own Healthcare Solution called “Healthcare Personal Service Platform”. It will work as a PaaS (Platform-as-a-service) solution that will address issues related to consumer-centric offerings management as per medical and health information.
All those automotive and embedded platform designers seeking more power control with Peripheral Component Interconnect Express (PCle) 3.1 Low Power Sub-State (LPSS) L1.1 and L1.2 can now enjoy better alternatives. Microchip Technology Inc. recently introduced LAN7430 and LAN7431 with varied features.
STMicroelectronics recently fused machine-learning technology in its highly advanced motion sensors. These new sensors will play a key role in changing the face of activity tracking in wearables and mobiles. Users and developers can now bid adieu to concerns like shorter battery life or low performance of devices due to motion sensors.
Littelfuse Inc. recently launched two 2nd Generation series of AEC-Q101-certified SiC (Silicon Carbide) Schottky Diodes. Known as the LSIC2SD65AxxA and LSIC2SD65xxA Series, these diodes promise plethora of benefits like maximum operating junction temperature at 175 degrees Centigrade, better surge ability, reverse recovery current, and others.
Industry’s leading NPI (New Product Introduction) distributor is known for the most comprehensive collection of electronic components and semiconductors. Recently, it buzzed the tech world for taking in stocks of MAX59995B PMIC (Power Management IC) from Maxim Integrated.
Fujitsu Laboratories Ltd. and Fujitsu Limited recently reported that they implemented blockchain technology for developing a trading system that deals with excess and dearth of energy among electricity consumers. The target consumer group here includes various retail stores and factories, these business houses need more energy as compared to other places.
Recently, ROHM introduced industry’s smallest contactless current sensor called BM14270MUV-LB capable of achieving minimum power loss in super-compact size. It is perfectly compatible for consumer devices and industrial equipment that identify functional conditions via current. The range of such devices includes data centers servers, solar power systems, battery-driven drones, and so forth.
The leading supplier of highly developed semiconductor solutions recently announced expansion of RX24U and RX24T 32-bit MCU (Microcontroller Units) lineups. It will now include better high-temperature-tolerant models meeting requirements of motor-control applications that work across a wide range of operational temperature.