Infineon Technologies announced its new TRAVEO T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. The engine features a new smart rendering technology and delivers outstanding performance for automotive graphics applications. With a small footprint, the new MCUs simplify OEM integration and reduce BOM costs, making them an ideal solution for advanced…
New 32-bit MCU features embedded hardware security
Industrial and consumer application designers must consider implementing security functionality in their devices during the development process as security threats evolve and become more sophisticated. To allow designers to easily integrate security into their applications, Microchip Technology announced a new family of PIC32CZ CA 32-bit microcontrollers with a 300 MHz Arm Cortex-M7 processor, an integrated Hardware Security…
STMicroelectronics offers op amps for sensor signal conditioning
STMicroelectronics’ TSB182 dual-operational amplifier is featured for high-accuracy signal conditioning with sensors, including maximum 20µV input offset voltage, 100nV/° C drift over temperature, and 4V-36V operating range for medium-voltage applications. In addition to its high accuracy, stability, and wide supply-voltage range, the TSB182 is specified from -40° to 125° C. With a maximum offset voltage of…
Infineon introduces its first Qi2 MPP wireless charging transmitter
In response to the consumer demand for improved wireless charging user experience, the Wireless Power Consortium announced the release of a new standard to redefine the inductive wireless power transfer: Qi2. Infineon Technologies is addressing this demand by introducing its first Qi2 Magnetic Power Profile (MPP) charging transmitter solution, the reference design kit REF_WLC_TX15W_M1. The…
Kyocera launches new series-connected supercapacitor modules
KYOCERA AVX, a global manufacturer of advanced electronic components, released the new SCM Series double-layer, series-connected electrochemical supercapacitor modules. The new SCM Series series-connected supercapacitor modules can be used by themselves or in conjunction with primary or secondary batteries to extend battery life and backup time or provide instantaneous power pulses in hold-up, energy harvesting,…
NVIDIA and Tata Group to build large-scale AI infrastructure
NVIDIA announced an extensive collaboration with Tata Group to deliver AI computing infrastructure and platforms for developing AI solutions. The collaboration will bring state-of-the-art AI capabilities within reach to thousands of organizations, businesses, AI researchers, and hundreds of startups in India. The companies will work together to build an AI supercomputer powered by the next-generation NVIDIA GH200…
Samsung delivers 4G calls over-shared Open RAN in pilot project
Samsung Electronics, with Vodafone and Orange, two of the largest operators in Europe, announced the companies completed the first 4G calls over-shared commercial networks in rural areas of Romania based on Open RAN in a pilot project. By leveraging Samsung’s virtualized Radio Access Network (vRAN), the two operators can take advantage of the greater flexibility…
Kyocera offers new vertical through-board contacts
KYOCERA AVX, a global manufacturer of advanced electronic components, has released the new 9296-11X Series STRIPT vertical poke-home through-board contacts for 12–18AWG wire. The new 9296-11X Series vertical through-board contacts further expand the company’s portfolio of user-friendly poke-home contacts and connectors. This addition brings the portfolio total to 10 series, two of which — this series and 9296-000 Series contacts —…
Nexperia enables high-power load switching in space-constrained applications
Nexperia, a semiconductor provider, has released a new series of 500 mA dual resistor-equipped transistors (RET) in ultra-compact DFN2020(D)-6 packaging. These devices have been designed for load switching in wearables and smartphones. They’re also ideal for use in digital circuits with higher power requirements, such as space-constrained computing, communications, industrial, and automotive applications. Notably, the…
Nexperia and KYOCERA AVX to produce silicon-carbide rectifier module
Nexperia, a semiconductor provider, announced it has entered into a partnership with KYOCERA AVX Components, an international supplier of advanced electronic components, to jointly produce a new 650 V, 20 A silicon-carbide (SiC) rectifier module. The new rectifier module will be for high-frequency power applications ranging from 3 to 11 kW power stack designs —…
AMD launches Kria K24 System-on-Module with starter kit
AMD recently announced the AMD Kria K24 System-on-Module (SOM) and its new KD240 Drives Starter Kit, which are the latest additions to the Kria portfolio of adaptive SOMs and developer kits. AMD Kria K24 SOM offers power-efficient computing in a small form factor and targets cost-sensitive industrial and commercial edge applications. Advanced InFO (Integrated Fan-Out)…
Microchip’s RT PolarFire FPGA achieves QML Class Q qualification
Products that have Qualified Manufacturers List (QML) designations are often the most trusted and readily accepted in space program designs. As designated by the Defense Logistics Agency (DLA), the RT PolarFire FPGA from Microchip Technology is now QML Class Q qualified. This certification is considered the gold standard in entry-level qualification, enabling designers to begin…
AMD unveils new fintech accelerator card
AMD announced the AMD Alveo UL3524 accelerator card, a new fintech accelerator designed for ultra-low latency electronic trading applications. Already deployed by leading trading firms and enabling multiple solution partner offerings, the Alveo UL3524 provides proprietary traders, market makers, hedge funds, brokerages, and exchanges with a state-of-the-art FPGA platform for electronic trading at nanosecond (ns) speed.…
Broadcom launches low-power transceiver technology
Broadcom Inc. announced the availability of its 5nm 200G/lane optical PAM-4 DSP PHY, the Sian BCM85822, at the 49th European Conference on Optical Communication (ECOC 2023). The new BCM85822 features 200G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost-effectively deliver 800G and 1.6T pluggable modules and meet the growing bandwidth needs and low power consumption…
Microchip adds to its mid-range FPGA and SoC support
Designing systems for the intelligent edge has never been more difficult. Market windows are shrinking, the costs and risks of new designs are rising, thermal constraints and reliability are twin priorities, and the need for cradle-to-grave security continues to grow. Satisfying these simultaneous demands requires immediate knowledge of special technology and vertical-market expertise. There’s no…
MediaTek develops first chip using TSMC’s 3nm process
MediaTek announced that it has successfully developed its first chip using TSMC’s 3nm technology — taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC. Both companies are taking advantage of their chip design and manufacturing strengths to…
CUI introduces medical-grade DC-DC converter
CUI Inc., a Bel group company, announced the release of its PTP15 Series — a 15 W, 5 Pin DIP isolated DC-DC converter, specialized for medical instrumentation and home medical supplies. Offering 4000 Vac isolation or 5600 Vdc isolation with a 2:1 input voltage range, the series is compliant with the IEC/EN 60601-1 and EN…
Samsung adds portable SSD to its T-series
Samsung Electronics, a global provider of advanced memory technology, announced the release of its latest lineup of the T-series, the Portable Solid State Drive (SSD) T9. With its stylish and portable design, the T9 is built to keep data safe while on the go, empowering users with fast transfer speeds and ample storage, and providing…
STMicroelectronics introduces all-in-one automotive power-management IC
STMicroelectronics‘ new SPSB081 automotive power-management IC is a Swiss Army Knife of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers, a CAN FD transceiver, and an optional LIN transceiver. The ICs provide multiple standby modes with very low quiescent current and programmable local or remote wake-up to help…
Infineon offers new electronically marked cable assembly controller
The rapid industrial adoption of USB-C is owed to its slim design, user-friendly and universal connectors, and versatility in handling multiple data protocols, such as USB4, Thunderbolt, and HDMI. The USB-C can deliver up to 240 W of power making it the power connector of choice for a wide variety of applications. To meet the…