Nexperia adds to its portfolio of Trench Schottky rectifiers

Nexperia, a semiconductor provider, has extended its portfolio of Trench Schottky rectifiers with devices rated at up to 100 V and 20 A. The new parts feature excellent switching behavior and top thermal performance. They’re available in Nexperia’s Clip Bond FlatPower (CFP) packages which have a much smaller footprint than SMA/SMB/SMC components.

Trench technology results in low leakage, greatly reducing the charge, Q_rr, stored in the device. Therefore, Trench Schottky rectifiers deliver fast switching, cutting the switching losses of the rectifier and the losses that are induced in the MOSFET in the same commutation cell — a configuration that is commonly used in asynchronous switch-mode power converters.

Nexperia’s PMEGxxxTx devices also provide a wide and safe operating area (SOA), delivering an extra safety margin and reducing the risk of thermal runaway compared to parts currently available.

“Nexperia’s Trench Schottky rectifiers combine low forward voltage and very low Q_rr to enable best efficiency at high switching speeds as needed in switch-mode power converters,” said Jan Fischer, Nexperia’s product manager. “Automotive applications including LED lighting, in particular, will benefit from the wide SOA of our parts.”

Nexperia is investing in its portfolio of Trench Schottky rectifiers, now offering 32 devices from 40 to 100 V and up to 15 A in volume production. A further 17 parts, including the 20 A types, are sampling.

The PMEGxxxTx devices are housed in Clip Bond FlatPower packages CFP3/5/15(B). These size and thermally efficient packages have become the industry standard for power diodes. By featuring a solid copper clip, the packages’ thermal resistance is reduced and transfer of heat into the ambient environment is optimized, allowing small and compact PCB designs.

Designers can learn more about Nexperia’s Trench Schottky rectifiers by visiting Nexperia’s virtual booth at PCIM Digital Days 3-7 May here.