
Key features of the OX01N1B include industry-leading NIR quantum efficiency (QE) at 36% for excellent low-light performance, a high modulation transfer function (MTF) for better image quality and resolution, low power consumption, and an optical format that enables extremely compact camera module design. The OX01N1B uses OmniPixel4-GS technology for simultaneous image detection in all pixels to accurately reproduce rapid motion without any distortions.
The OX01N1B has integrated ASIL-B and cybersecurity that meet the latest industry standards. It comes in an OMNIVISION a-CSP package, allowing for higher-performance image sensors in tighter camera spaces. It is available in a reconstructed wafer option for designers who want to assemble a bare die imager into their camera module.
The OX01N1B is available for sampling now and will be in mass production in Q3 2026.
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