High voltage applications frequently require high resistance value resistors with the ability to handle high working and overload voltages. Engineers may have difficulty finding thick film chip resistors with the required precision for applications requiring tight resistance tolerance and TCR tracking. For precision high-voltage applications, a high-voltage divider chip can be beneficial. Stackpole’s new HVCD…

In order to further drive decarbonization, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions. Innovative solutions are needed to optimize energy consumption while ensuring a healthy indoor environment. Infineon Technologies AG is addressing this need with the introduction of the new XENSIV PAS CO2…

congatec introduces new COM Express Compact Computer-on-Modules with AMD Ryzen Embedded 8000 Series processors. Based on the dedicated computing cores of the new Ryzen processors featuring up to eight ‘Zen 4’ cores, innovative XDNA NPU, and powerful Radeon RDNA 3 graphics, the new modules deliver impressive performance of up to 39 tera operations per second…

NXP Semiconductors has announced the MC33777, a battery junction box integrated circuit (IC) that combines sense, think, and act capabilities for battery management systems. The MC33777 integrates pack-level functions into a single device, which differs from conventional solutions that use multiple discrete components, external actuators, and processing support. The MC33777 IC monitors battery current and…

TeraSignal introduced TSLink, the world’s first intelligent chip-to-module (C2M) interconnect designed to revolutionize data transmission between large ASICs and linear optical modules. Leveraging existing microcontroller resources in optical modules, the TSLink solution automates link training and performance monitoring without the need for additional digital signal processors (DSPs). TSLink dramatically reduces power consumption and latency while simplifying…

Naviq is introducing the MTS160, a state-of-the-art magnetic guide sensor for mobile robots, featuring patented angle measurement capabilities with 1-degree precision and position accuracy within 1mm. This unique dual functionality provides exceptional orientation and positioning precision, significantly improving the navigation capabilities of mobile robotic systems. Unlike traditional magnetic line-following sensors that only detect position along…

Nexperia announced the release of single and dual small-signal MOSFETs in miniature DFN packages. The automotive-qualified devices are available in DFN1110D-3 and DFN1412-6 respectively. Particularly the DFN1110D-3 (1.1mm x 1 mm) package has seen increasingly wide adoption and is quickly becoming the ‘de-facto’ industry standard package for small-signal MOSFETs and bipolar transistors intended for use…

United Electronic Industries (UEI) unveiled its latest innovation, the DNx-MF-102 multifunction analog and digital I/O board with 2 CAN ports compatible with all UEI I/O chassis systems. The board offers a powerful combination of 34 analog and digital I/O channels combined with, two CAN ports and one RS-232/422/485 port. This board is integral to any…

Marktech Optoelectronics has introduced new Series 4 silicon photodiodes with improved response speed. These photodiodes offer a response time of 25ns compared to the 80ns of current Series 4 PDs with the same active area. The new silicon photodiodes feature reduced junction capacitance (Cj), which improves response time, frequency response, and bandwidth. This is achieved…

TDK Corporation has expanded its automotive-grade CA series of MEGACAP MLCCs with a metal frame, commencing mass production in September 2024. The CA series MLCCs measure 6.00 x 5.60 x 6.40 mm and feature a 3-line type structure. The lineup includes 99 nF/1000 V variants with a Class 1 dielectric and 47 μF/100 V variants…

Diodes Incorporated announces the addition of two enhanced high-voltage, Hall effect switch IC families to its automotive-compliant* product portfolio. The AH332xQ (unipolar) and AH352xQ (omnipolar) offer a wide range of operating sensitivity options in SIP-3, SOT23 (Type S), and SC59 packages. The devices can be used in a broad range of contactless position and proximity…

Samtec, Inc., offers a variety of board-level and cable connector systems for JTAG applications that are currently shipping in volume quantities. Samtec JTAG connectors are available on both 2.54 mm and 1.27 mm centerlines. Common sizes are 10-pin (2 x 5), 14-pin (2 x 7), and 20-pin (2 x 10). JTAG connectors are available in…

TDK Corporation introduces the HWS3000 programmable AC-DC power supplies in the TDK-Lambda series. These units deliver up to 3000 watts in a 270 x 150 x 61mm case size. The HWS3000 offers programmable output voltages of 24V, 48V, 60V, or 130V, with the ability to adjust from zero to maximum rating. Engineers can choose between…

Magnachip Semiconductor Corporation announced the release of four new 40V 1)MXT MV MOSFETs designed in Power Dual Flat No-Lead (PDFN) 33 packages for automotive applications. As automotive technologies like autonomous driving and infotainment systems advance, the number and variety of motors installed in vehicles are increasing. Consequently, there is a growing importance for high-performance MOSFETs…

Eggtronic has unveiled an evaluation board (EVB) that allows engineers to speed the development and significantly reduce the size and cost of 240W power delivery (PD) 3.1 applications while supporting ultra-fast charging through industry-leading efficiency. The SmartEgg 240W PD 3.1 EVB has a peak efficiency above 95% and operates at over 90% efficiency from light…

OMNIVISION has introduced the OV50M40, the latest addition to its mobile product portfolio. The OV50M40 is a versatile 50-megapixel (MP) CMOS image sensor with a 0.61-micron (µm) pixel size, designed to enhance front, main, ultra-wide, and telephoto cameras in smartphones. The OV50M40 image sensor supports both staggered HDR and dual analog gain (DAG) HDR technology.…

onsemi has introduced its latest generation of silicon and silicon carbide hybrid Power Integrated Modules (PIMs) in the F5BP package, designed to enhance the power output of utility-scale solar string inverters and energy storage system (ESS) applications. These new modules deliver increased power density and efficiency within the same footprint as their predecessors, allowing a…

TDK Corporation announces additional output voltage models to the 250W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2” x 4” footprint. The full range now covers 12V, 15V, 18V, 24V, 28V, 36V, and 48V and is certified to the IEC 62368-1 and IEC 60601-1 safety standards for industrial and medical…

Nexperia announced the latest extension to its popular portfolio of power bipolar junction transistors (BJTs) with the release of ten standards and ten automotive-qualified products in DFN2020D-3 packaging. These new devices, available in 50 V and 80 V ratings and supporting current ranges from 1 A to 3 A in NPN and PNP polarity, further…

Abracon reveals its newest product introduction, MMIC Low Noise Amplifiers (LNAs). These innovative amplifiers are designed to deliver exceptional performance in critical communication and signal-processing applications. Abracon’s MMIC LNAs are engineered to meet the demanding requirements of modern RF systems, offering superior noise figure performance, high gain, and high linearity. These features make them ideal…