A major challenge in electronic circuit design is selecting suitable components that perform well under all operating conditions. This is particularly essential in regards to the safe operating limits of current, voltage, power, and temperature.  Here, we’ll focus on temperature. Every electronic component generates heat while transferring power. Bear in mind there are no perfect…

Harwin announces that its high-reliability Gecko connectors, which have been integrated into a research nanosatellite, have been successfully launched and ejected into low Earth orbit (LEO), and, after the deployment of its subsystems, remain fully operational. Momentus, the U.S. commercial space company, recently announced that all customer payloads had been deployed from its Vigoride-6 Orbital Service…

Nexperia, an expert in essential semiconductors, announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data lines in interfaces such as USB, HDMI, high-speed video links, and ethernet in automotive infotainment applications. These latest additions include PESD18VF1BLS-Q, PESD24VF1BLS-Q, PESD30VF1BLS-Q, and PESD32VF1BLS-Q in DFN1006BD-2 package, enabling optical inspection in automotive production lines…

Infineon Technologies announced its new TRAVEO T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. The engine features a new smart rendering technology and delivers outstanding performance for automotive graphics applications. With a small footprint, the new MCUs simplify OEM integration and reduce BOM costs, making them an ideal solution for advanced…

Industrial and consumer application designers must consider implementing security functionality in their devices during the development process as security threats evolve and become more sophisticated. To allow designers to easily integrate security into their applications, Microchip Technology announced a new family of PIC32CZ CA 32-bit microcontrollers with a 300 MHz Arm Cortex-M7 processor, an integrated Hardware Security…

STMicroelectronics’ TSB182 dual-operational amplifier is featured for high-accuracy signal conditioning with sensors, including maximum 20µV input offset voltage, 100nV/° C drift over temperature, and 4V-36V operating range for medium-voltage applications. In addition to its high accuracy, stability, and wide supply-voltage range, the TSB182 is specified from -40° to 125° C. With a maximum offset voltage of…

In response to the consumer demand for improved wireless charging user experience, the Wireless Power Consortium announced the release of a new standard to redefine the inductive wireless power transfer: Qi2. Infineon Technologies is addressing this demand by introducing its first Qi2 Magnetic Power Profile (MPP) charging transmitter solution, the reference design kit REF_WLC_TX15W_M1. The…

KYOCERA AVX, a global manufacturer of advanced electronic components, released the new SCM Series double-layer, series-connected electrochemical supercapacitor modules. The new SCM Series series-connected supercapacitor modules can be used by themselves or in conjunction with primary or secondary batteries to extend battery life and backup time or provide instantaneous power pulses in hold-up, energy harvesting,…

KYOCERA AVX, a global manufacturer of advanced electronic components, has released the new 9296-11X Series STRIPT vertical poke-home through-board contacts for 12–18AWG wire. The new 9296-11X Series vertical through-board contacts further expand the company’s portfolio of user-friendly poke-home contacts and connectors. This addition brings the portfolio total to 10 series, two of which — this series and 9296-000 Series contacts —…

Nexperia, a semiconductor provider, has released a new series of 500 mA dual resistor-equipped transistors (RET) in ultra-compact DFN2020(D)-6 packaging. These devices have been designed for load switching in wearables and smartphones. They’re also ideal for use in digital circuits with higher power requirements, such as space-constrained computing, communications, industrial, and automotive applications. Notably, the…

Nexperia, a semiconductor provider, announced it has entered into a partnership with KYOCERA AVX Components, an international supplier of advanced electronic components, to jointly produce a new 650 V, 20 A silicon-carbide (SiC) rectifier module. The new rectifier module will be for high-frequency power applications ranging from 3 to 11 kW power stack designs —…

Broadcom Inc. announced the availability of its 5nm 200G/lane optical PAM-4 DSP PHY, the Sian BCM85822, at the 49th European Conference on Optical Communication (ECOC 2023). The new BCM85822 features 200G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost-effectively deliver 800G and 1.6T pluggable modules and meet the growing bandwidth needs and low power consumption…

MediaTek announced that it has successfully developed its first chip using TSMC’s 3nm technology — taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC. Both companies are taking advantage of their chip design and manufacturing strengths to…

CUI Inc., a Bel group company, announced the release of its PTP15 Series — a 15 W, 5 Pin DIP isolated DC-DC converter, specialized for medical instrumentation and home medical supplies. Offering 4000 Vac isolation or 5600 Vdc isolation with a 2:1 input voltage range, the series is compliant with the IEC/EN 60601-1 and EN…

Samsung Electronics, a global provider of advanced memory technology, announced the release of its latest lineup of the T-series, the Portable Solid State Drive (SSD) T9. With its stylish and portable design, the T9 is built to keep data safe while on the go, empowering users with fast transfer speeds and ample storage, and providing…

STMicroelectronics‘ new SPSB081 automotive power-management IC is a Swiss Army Knife of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers, a CAN FD transceiver, and an optional LIN transceiver. The ICs provide multiple standby modes with very low quiescent current and programmable local or remote wake-up to help…

The rapid industrial adoption of USB-C is owed to its slim design, user-friendly and universal connectors, and versatility in handling multiple data protocols, such as USB4, Thunderbolt, and HDMI. The USB-C can deliver up to 240 W of power making it the power connector of choice for a wide variety of applications. To meet the…

Texas Instruments (TI) has introduced its new opto-emulator portfolio of signal isolation semiconductors, designed to improve signal integrity, consume less power, and extend the lifetime of high-voltage industrial and automotive applications. TI’s inaugural opto-emulators are pin-to-pin compatible with the industry’s most common optocouplers, enabling seamless integration into existing designs while leveraging the unique benefits of…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced a new addition to its popular RL78 microcontroller (MCU) Family that includes 8- and 16-bit devices for power-sensitive applications. The RL78/G24 features the highest performance among all the devices in the RL78 family, boosting its performance with an application-specific Flexible Application Accelerator (FAA) and a…

Samsung Electronics, a global provider in advanced memory technology, announced that it has developed the industry’s first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM market for PCs and laptops — and potentially even data centers. Samsung’s groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed…