Samsung Electronics, a global provider of advanced memory technology, announced the release of its latest lineup of the T-series, the Portable Solid State Drive (SSD) T9. With its stylish and portable design, the T9 is built to keep data safe while on the go, empowering users with fast transfer speeds and ample storage, and providing…

Samsung Electronics, a global provider in advanced memory technology, announced that it has developed the industry’s first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM market for PCs and laptops — and potentially even data centers. Samsung’s groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed…

Samsung Electronics, a global provider in advanced memory technology, announced that it has developed the industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology. This achievement comes after Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023. It solidifies Samsung’s leadership in next-generation DRAM technology and signals…

The evolving market for automotive event data recorders (EDR) is driving demand for specialized data-logging memory devices that instantly capture and reliably store critical data for decades. To this end, Infineon Technologies has introduced two new Ferroelectric RAM (F-RAM) memory devices in 1Mbit and 4Mbit densities to its EXCELON F-RAM family. The 1Mbit devices are…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced the third-generation DDR5 registered clock driver (RCD) and first-generation client clock driver (CKD) for emerging DDR5 DRAM servers and client systems. With these new driver ICs, Renesas continues to be the only provider to offer a complete portfolio of DDR5 memory interfaces for dual…

Infineon Technologies has launched the industry’s first LPDDR Flash memory to enable next-generation automotive E/E architectures. The Infineon SEMPER X1 LPDDR Flash offers safe, reliable, and real-time code execution critical for automotive domain and zone controllers. The new device delivers eight times the performance of current NOR Flash memories and achieves 20 times faster random…

Samsung Electronics announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology. It has also successfully completed the product evaluation for compatibility with AMD. “Our 12nm-range DRAM will be a key enabler in driving market-wide adoption of DDR5 DRAM,” said Jooyoung Lee, executive VP of DRAM Product…

Samsung Electronics, a provider of advanced memory technology, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry’s highest bit density. At 1Tb, the new V-NAND also features the highest storage capacity to date, enabling larger storage space in next-generation enterprise server systems worldwide.…

Infineon Technologies has announced the commercial availability of what’s currently labeled as the industry’s highest-density serial F-RAMs — the company’s new 8- and 16-Mbit EXCELON F-RAM memories. The new EXCELON F-RAM (Ferroelectric RAM) memories address the non-volatile datalogging requirements of next-generation automotive and industrial systems to help prevent data loss in harsh operating environments. The…

Broadcom Inc. has announced the availability of the industry’s first open end-to-end networking solution optimized for Remote Direct Memory Access (RDMA) over Converged Ethernet. Hyperscaler and enterprise data-center operators can now deploy fully optimized systems that are connected by Broadcom, using open-standard RDMA. Jointly integrated by Broadcom and Arista, this end-to-end solution features Broadcom’s Ethernet…

Samsung Electronics, a global provider in advanced memory technology, announced the 990 PRO, the company’s high-performance NVMe SSD based on PCIe 4.0. Delivering lightning-fast speeds and high-power efficiency, the new SSD is optimized for graphically demanding games and other intensive tasks — including 3D rendering, 4K video editing, and data analysis. “With continuing innovations in…

Infineon Technologies has added HYPERRAM 3.0 to its portfolio of high-bandwidth, low-pin count memory solutions. The device features a new,16-bit extended version of the HyperBus interface that doubles throughput to 800 MBps. With HYPERRAM 3.0, Infineon offers a portfolio of high-bandwidth memories with low pin count and low power. It’s an ideal fit for applications…

Samsung Electronics, a provider in advanced memory technology, announced that it has begun sampling the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) DRAM featuring 24-gigabit-per-second (Gbps) processing speeds. Built on Samsung’s third-generation 10-nanometer-class (1z) process, using extreme ultraviolet (EUV) technology, the new memory is designed to significantly advance the graphics performance for…

Samsung Electronics, a global provider of advanced memory technology, announced that it has developed the PM1743 SSD for enterprise servers, integrating the PCIe (Peripheral Component Interconnect Express) 5.0 interface with Samsung’s advanced sixth-generation V-NAND. “For over a decade, Samsung has been delivering SATA, SAS and PCIe-based SSDs that have been recognized for outstanding performance and…

Samsung Electronics, a global provider in advanced memory technology, has unveiled an extensive lineup of cutting-edge automotive memory solutions designed for next-generation autonomous electric vehicles (EVs). The new lineup includes a 256-gigabyte (GB) PCIe Gen3 NVMe ball grid array (BGA) SSD, 2GB GDDR6 DRAM and 2GB DDR4 DRAM for high-performance infotainment systems, as well as…

Samsung Electronics, a provider in advanced memory technology, recently showcased its latest advancements with processing-in-memory (PIM) technology at Hot Chips 33 — a semiconductor conference where the most notable microprocessor and IC innovations are unveiled each year. Samsung’s revelations include the first successful integration of its PIM-enabled high-bandwidth memory (HBM-PIM) into a commercialized accelerator system.…

Space-grade field-programmable gate arrays (FPGAs) require reliable, high-density, non-volatile memories that contain their boot configurations. To address the growing need for high-reliability memories, Infineon Technologies announced the industry’s first high-density, radiation-tolerant (RadTol) NOR Flash memory products, qualified to MIL-PRF-38535’s QML-V flow (QML-V Equivalent). The QML-V flow is the highest quality standard certification for aerospace-grade ICs.…

Samsung Electronics, a global provider in advanced memory technology, has announced that it’s begun mass producing its latest smartphone memory solution — the LPDDR5 UFS-based multichip package (uMCP). Samsung’s uMCP integrates the fastest LPDDR5 DRAM with the latest UFS 3.1 NAND flash, delivering flagship-level performance to a much broader range of smartphone users. “Samsung’s new…

Samsung Electronics, a global expert in advanced memory technology, has unveiled the industry’s first memory module supporting the new Compute Express Link (CXL) interconnect standard. Integrated with Samsung’s Double Data Rate 5 (DDR5) technology, this CXL-based module will enable server systems to significantly scale memory capacity and bandwidth, accelerating artificial intelligence (AI) and high-performance computing…

Infineon Technologies LLC, an Infineon Technologies AG company, has launched its next-generation 144-Mb Quad Data Rate II+ (QDR -II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V). QML-V is the highest quality and reliability standard certification for aerospace-grade ICs. This radiation-hardened (rad hard) 144-Mb QDR-II+ SRAM is a unique high-speed…