Samsung Electronics, a global provider of advanced memory technology, announced that it has developed the PM1743 SSD for enterprise servers, integrating the PCIe (Peripheral Component Interconnect Express) 5.0 interface with Samsung’s advanced sixth-generation V-NAND. “For over a decade, Samsung has been delivering SATA, SAS and PCIe-based SSDs that have been recognized for outstanding performance and…
Samsung unveils advanced automotive-memory solutions for EVs
Samsung Electronics, a global provider in advanced memory technology, has unveiled an extensive lineup of cutting-edge automotive memory solutions designed for next-generation autonomous electric vehicles (EVs). The new lineup includes a 256-gigabyte (GB) PCIe Gen3 NVMe ball grid array (BGA) SSD, 2GB GDDR6 DRAM and 2GB DDR4 DRAM for high-performance infotainment systems, as well as…
Samsung offers in-memory processing power to a wider range of applications
Samsung Electronics, a provider in advanced memory technology, recently showcased its latest advancements with processing-in-memory (PIM) technology at Hot Chips 33 — a semiconductor conference where the most notable microprocessor and IC innovations are unveiled each year. Samsung’s revelations include the first successful integration of its PIM-enabled high-bandwidth memory (HBM-PIM) into a commercialized accelerator system.…
Infineon offers first radiation-tolerant, NOR Flash memory for space-grade FPGAs
Space-grade field-programmable gate arrays (FPGAs) require reliable, high-density, non-volatile memories that contain their boot configurations. To address the growing need for high-reliability memories, Infineon Technologies announced the industry’s first high-density, radiation-tolerant (RadTol) NOR Flash memory products, qualified to MIL-PRF-38535’s QML-V flow (QML-V Equivalent). The QML-V flow is the highest quality standard certification for aerospace-grade ICs.…
Samsung begins mass production of industry’s first LPDDR5 smartphone memory solution
Samsung Electronics, a global provider in advanced memory technology, has announced that it’s begun mass producing its latest smartphone memory solution — the LPDDR5 UFS-based multichip package (uMCP). Samsung’s uMCP integrates the fastest LPDDR5 DRAM with the latest UFS 3.1 NAND flash, delivering flagship-level performance to a much broader range of smartphone users. “Samsung’s new…
Samsung unveils industry-first memory module with new CXL interconnect standard
Samsung Electronics, a global expert in advanced memory technology, has unveiled the industry’s first memory module supporting the new Compute Express Link (CXL) interconnect standard. Integrated with Samsung’s Double Data Rate 5 (DDR5) technology, this CXL-based module will enable server systems to significantly scale memory capacity and bandwidth, accelerating artificial intelligence (AI) and high-performance computing…
Infineon launches industry’s highest density QML-V-certified QDR-II+ SRAM
Infineon Technologies LLC, an Infineon Technologies AG company, has launched its next-generation 144-Mb Quad Data Rate II+ (QDR -II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V). QML-V is the highest quality and reliability standard certification for aerospace-grade ICs. This radiation-hardened (rad hard) 144-Mb QDR-II+ SRAM is a unique high-speed…