Passive Components

Global EMC solutions provider EMIS announces the availability of the TMF3333 High Current Three-Phase EMI Filter for high-power applications. The device effectively blocks unwanted electrical noise which can affect the performance of sensitive equipment and lead to component degrading in power systems. The TMF3333 EMI filter is designed to handle the maximum current expected in…

TDK Corporation is presenting in its CES 2025 Booth #15815 how TDK MEMS sensors and solutions enable innovation in accessibility technology, as multi-award-winning company WeWALK announces the global availability of its Smart Cane 2 for visually impaired people. The WeWALK Smart Cane 2 is an intelligent assistive device empowered by TDK motion sensors, MEMS microphones,…

Efficient Power Conversion Corporation (EPC) has introduced the EPC9178 reference design for photovoltaic (PV) optimizers. The design aims to improve reliability while reducing passive components in solar energy systems, advancing GaN technology applications in renewable energy. The EPC9178 features a back-to-back buck-boost converter topology that helps optimize energy harvesting for individual solar panels during conditions…

Nexperia introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. Miniaturized logic ICs are essential for space-constrained applications including sophisticated automotive applications such as chassis safety systems, battery monitoring, infotainment units, and advanced driver assistance systems (ADAS). MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB…

Infineon Technologies AG is further strengthening its AI software portfolio as Edge AI comes to a growing number of consumer and industrial applications. With that in mind, the company introduces DEEPCRAFT, a new software solution category brand for Edge AI and Machine Learning. Infineon recognizes the huge potential of Edge AI for the market, and…

MIPS announced the general availability(GA) launch of the MIPS P8700 Series RISC-V Processor. Designed to meet the low-latency, highly intensive data movement demands of the most advanced automotive applications such as ADAS and Autonomous Vehicles (AVs), the P8700 delivers industry-leading accelerated compute, power efficiency and scalability. Typical solutions for ADAS and autonomous driving rely on…

SICK has partnered with CoreTigo to implement wireless communication technology for harsh industrial environments. The collaboration enables real-time data streaming for analytics, predictive maintenance, and operational monitoring. SICK’s new IO-Link Wireless product range introduces three key components. The IO-Link Wireless Master provides 2-track industrial control capabilities. The Wireless Bridge enables conversion of IO-Link Class A,…

Novotechnik, U.S. introduces the MC-1 2800 44-Turn magnetic encoder with IO-Link output interface. Patented non-volatile technology retains turn count even when power is lost and reports correct count when power is restored. Key specifications for the MC-1 2800 include a measuring range of 15,840° (44 turns), and measured variable information of angle, turns, speed, and…

Innoscience Technology has expanded its portfolio with two 100V automotive-grade GaN devices. The company’s INN100W135A-Q (RDS(on),max  = 13.5 mΩ) and smaller package INN100W800A-Q (RDS(on),max = 80 mΩ) are both certified to AEC-Q101 and optimized for LiDAR as well as for high power density DC-DC converters and Class D audio applications in the automotive sector. The…

Same Sky’s Audio Group announced the addition of two surface mount models to its speakers product portfolio. The CMS-131304-SMT-TR and CMS-151504-SMT-TR are surface-mount miniature speakers, housed in compact 13 x 13 x 4 mm and 15 x 15 x 4 mm square frame packages, respectively. Both models are reflow solder compatible while featuring polyurethane cones and…

EBE sensors + motion’s magnetic panel potentiometer is designed for human-machine interfaces (HMI) delivers unprecedented durability with 1,000,000 operating cycles – 20 times longer than conventional wire and cermet alternatives. The compact MPE19 measures just 19mm in diameter and 20mm in height behind the front panel, making it ideal for space-constrained industrial applications. Its robust…

Navitas Semiconductor has announced GaNSlim, a new generation of highly integrated GaN power ICs that will further simplify and speed the development of small form factor, high-power-density applications by offering the highest level of integration and thermal performance. GaNSlim enables the simplest, fastest, and smallest system design by integrating drive, control, and protection, with integrated…

Q-Tech Corporation announces the industry’s first multiple-output temperature-controlled crystal oscillators (TCXOs) qualified for full space applications. Each QT8220 Series TCXO, available with two (2) to four (4) CMOS outputs, is packaged in a hermetically sealed 32-pin Flatpack. One QT8220 multiple CMOS output TCXO offers significant SWaP (Size, Weight, and Power) advantages compared to the traditional approach…

Renesas Electronics Corporation has introduced two new semiconductor solutions for the IO-Link market: the CCE4511 four-channel IO-Link master IC and the ZSSC3286 IO-Link ready dual-channel resistive sensor signal conditioner IC. IO-Link, a digital communication protocol used in industrial automation, enables communication between sensors, actuators, and other automation system devices. The technology provides real-time data, diagnostics,…

Infineon Technologies AG launches the new automotive-qualified fingerprint sensor ICs CYFP10020A00 and CYFP10020S00. The devices are optimized for attaching to Infineon’s TRAVEO T2G microcontroller family and comply with the AEC-Q100 requirements for the automotive industry. The sensors offer powerful fingerprint identification and authentication capabilities. This makes them ideal for in-vehicle personalization and payment authentication, such…

Infineon Technologies AG introduces the Automotive PSoC Multitouch GEN8XL (IAAT818X), a new generation of touch controllers. Designed for OLED and micro-LED displays up to 24 inches, the touch controller delivers performance and frame rates that meet today’s demands. It ensures a seamless user experience on various touch-based interfaces, such as touchscreens, touchpads, and sliders, while…

The ST87M01 cellular data-communications module integrates NB-IoT certification and an optional ST4SIM embedded SIM. The module features dual communication capabilities through NB-IoT cellular connectivity and wireless Meter-Bus (wM-Bus), providing redundant data transmission channels for applications like utility consumption monitoring. A software-defined radio enables dynamic switching between NB-IoT and sub-GHz wM-Bus modes. The module supports direct…

Driven by the need for higher bandwidth, advanced features, enhanced security, and standardization, automotive OEMs are transitioning to Ethernet solutions. Automotive Ethernet provides the necessary infrastructure to support Software-Defined Networking by centralizing control, enabling flexible configurations and real-time data transfer. To provide OEMs with comprehensive Ethernet solutions, Microchip Technology announces its new family of LAN969x…

SHENMAO America, Inc. announces the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates. This no-clean, halogen-free solder paste offers exceptional anti-thermal fatigue reliability, making it an ideal solution for demanding AI applications. The PF719-P250A solder paste utilizes a newly developed, high-reliability lead-free alloy that provides excellent anti-thermal…

Flex has introduced a range of new products and partnerships aimed at addressing the growing demands of AI and high-performance computing (HPC) applications. The company announced customizable compute reference designs incorporating JetCool’s SmartPlate direct-to-chip liquid cooling solution, capable of cooling over 1,500W per socket. In collaboration with JetCool, Flex is set to deliver liquid-cooled solutions…