Semiconductors

Vishay Intertechnology has introduced the industry’s first high-voltage chip divider to be offered in a ribbed, molded package with compliant surface-mount leads. Designed to reduce component counts and improve TC tracking performance and ratio stability in automotive and industrial equipment, the Vishay Techno CDMM delivers a maximum working voltage of 1500 V in the 4527 case…

As demand for electric buses and other electrified heavy transport vehicles increases to meet lower emission targets, silicon carbide-based power management solutions are providing greater efficiencies in these transportation systems. To complement its broad portfolio of silicon carbide MOSFET discrete and module products, Microchip Technology has announced a new 1200V production-ready digital gate driver —…

Nexperia, a semiconductor provider, announced that one of its surface-mount device packages — the clip-bond FlatPower package CFP15B — has passed Board-level Reliability (BLR) testing for automotive applications by a top Tier 1 supplier. Initially, the FlatPower package will be used in an engine-control unit. BLR provides a means of evaluating the reliability of semiconductor…

Samsung Electronics, a provider of advanced semiconductor technology, announced that four of its System LSI products received product carbon-footprint label certification from the Carbon Trust — the first of Samsung’s logic chips to do so. Having received the semiconductor industry’s first carbon-footprint accreditation for memory chips from the Carbon Trust in 2019, Samsung has now…

Easing the transition to high-efficiency wide-bandgap technology, STMicroelectronics has released the MasterGaN3* and MasterGaN5 integrated power packages for applications up to 45 and 150W. Joining the MasterGaN1, MasterGaN2, and MasterGaN4 — which target applications from 65 to 400W — the additions give extra flexibility to choose the optimum Gallium Nitride (GaN) device and driver solution when designing switched-mode power…

ROHM developed the BD8758xY series (BD87581YG-C, BD87582YFVM-C) of rail-to-rail input/output, high-speed CMOS op amps that feature improved EMI immunity for automotive and industrial equipment applications. The series is ideal for applications that require high-speed sensing in harsh environments, such as vehicle engine control units and anomaly detection systems for factory automation equipment. In recent years, advancements…

Infineon Technologies and Robert Bosch GmbH are launching a new ultra-low-loss diode: the Active Rectifying Diode for light vehicle generators. It enables an increase in generator efficiency of up to eight percent compared to conventional power conversion methods and facilitates generators to qualify as eco-innovations as defined by the European Union. Deploying the new diode…

Today’s energy-efficient electric charging systems powering commercial vehicle propulsion — as well as auxiliary power systems, solar inverters, solid-state transformers, and other transportation and industrial applications — all rely on high-voltage switching power devices. To best meet these requirements, Microchip Technology announced the expansion of its silicon-carbide portfolio with a family of high-efficiency, high-reliability 1700V…

STMicroelectronics, a global semiconductor provider, announced that it has manufactured the first 200mm (8-inch) silicon-carbide (SiC) bulk wafers for prototyping next-generation power devices from its facility in Norrköping, Sweden. The transition to 200mm SiC wafers marks an important milestone in the capacity build-up for ST’s customer programs in automotive and industrial sectors. It will further…

Space-grade field-programmable gate arrays (FPGAs) require reliable, high-density, non-volatile memories that contain their boot configurations. To address the growing need for high-reliability memories, Infineon Technologies announced the industry’s first high-density, radiation-tolerant (RadTol) NOR Flash memory products, qualified to MIL-PRF-38535’s QML-V flow (QML-V Equivalent). The QML-V flow is the highest quality standard certification for aerospace-grade ICs.…

Nexperia, an expert in essential semiconductors, has completed the transaction to acquire Newport Wafer Fab (NWF), contributing to the company’s growth ambitions and investments to boost global production capacity. With this acquisition, Nexperia obtains 100% ownership of the Welsh semiconductor production facility. Nexperia Newport will continue to have a strong position in the Welsh ecosystem…

Nexperia, an expert in essential semiconductors, announced that the first products to be made in the company’s new eight-inch wafer line in Manchester, UK, will be low RDS(on), low Qrr 80 V and 100 V MOSFETs — using its latest NextPower silicon technology. The new production line expands Nexperia’s capacity. Plus, the new PSMN3R9-100YSF (100…

ROHM is introducing a new, AC/DC converter ICs with a built-in 1700V SiC MOSFET, BM2SC12xFP2-LBZ in the TO 263-7L package. It’s optimized for industrial applications, focusing on auxiliary power supplies for street lamps, commercial air-conditioning systems, general-purpose inverters, and AC servos drives. An auxiliary power supply is an essential and vital part of industrial applications…

STMicroelectronics, a global semiconductor provider, is partnering with Tower Semiconductor, which offers high-value analog semiconductor solutions. ST will welcome Tower to its Agrate R3 300mm fab under construction on its Agrate Brianza site in Italy. Together, ST and Tower will join forces for an accelerated fab ramp-up — a key factor to reach a high-use…

Power supplies in space applications operate in environments that require enhanced radiation technology to withstand extreme particle interactions and solar and electromagnetic events. These events degrade space-based systems and disrupt operations. To meet this requirement, Microchip Technology Inc. announced the qualification of its M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on), metal–oxide–semiconductor field-effect transistor (MOSFET) for commercial…

Applications such as e-scooters, e-forklifts and other light electric vehicles (LEVs), as well as power tools and battery-management systems, demand high-current rating, ruggedness, and extended lifetime. Infineon Technologies AG addresses these requirements by offering more choices to power system designers to meet diverse design needs and achieve maximum performance in the smallest space. With the innovative TO-Leadless (TOLL) package, Infineon now…

Nexperia, an expert in essential semiconductors, has announced the availability of a new 0.55 mΩ RDS(on) 40 V power MOSFETs in the high-reliability LFPAK88 package for automotive (BUK7S0R5-40H) and industrial (PSMNR55-40SSH) applications. These devices are the lowest RDS(on) 40 V parts that Nexperia has ever produced and, most importantly, they deliver power densities more than 50X greater than traditional D2PAK devices.…

Infineon Technologies AG recently supplied Samsung Electronics with power devices to couple the highest energy efficiency with lowest audible noise. They have been integrated in Samsung’s brand new one-door fridge (RR23A2J3XWX, RR23A2G3WDX) and FDR (French Door Fridge: RF18A5101SR) inverterized refrigerator. “Inverterization” is an emerging DC-to-AC conversion trend in contemporary inverter designs. It helps an application run more quietly…

Vishay Intertechnology, Inc. has introduced a versatile new 30 V n-channel TrenchFET Gen V power MOSFET that delivers increased power density and efficiency for isolated and non-isolated topologies. Offered in the 3.3 by 3.3mm thermally enhanced PowerPAK 1212-8S package, the Vishay Siliconix SiSS52DN features best-in-class, on-resistance of 0.95 mΩ at 10 V, a five percent improvement…

The electronics industry has always focused on miniaturization. This miniaturization was driven by the desire to integrate maximum logic in minimum dimensions. Still, in 2021, the industry is not prepared for the end of Moore’s law, despite a gradual rise in the R&D costs to continue along this path. The ability of transistor logic to…