Texas Instruments (TI) has introduced its new opto-emulator portfolio of signal isolation semiconductors, designed to improve signal integrity, consume less power, and extend the lifetime of high-voltage industrial and automotive applications. TI’s inaugural opto-emulators are pin-to-pin compatible with the industry’s most common optocouplers, enabling seamless integration into existing designs while leveraging the unique benefits of…

With the step-function increase in data collected and transmitted from cloud-connected edge nodes, Improved Inter Integrated Circuit (I3C) is rapidly becoming a more sustainable solution for interfacing sensors with a high data rate and will help expand capabilities in next-generation devices. Leading the way in I3C integration, Microchip Technology has released its PIC18-Q20 family of microcontrollers…

As digitalization, urbanization, and the rise of electro-mobility continue to shape the rapidly evolving world, the demand for power consumption is reaching unprecedented levels. Acknowledging energy efficiency as an important concern, Infineon Technologies addresses these megatrends with its silicon carbide (SiC) CoolSiC MOSFET 650 V in TO leadless (TOLL) packaging. The new SiC MOSFETs are…

Nexperia, an expert in semiconductors, introduced the NBM7100 and NBM5100,  innovative battery-life boosting ICs designed to extend the life of a typical non-rechargeable lithium coin-cell battery by up to 10x (compared to competing solutions). They also increase peak output current capability by up to 25x compared to what a typical coin cell can deliver without…

Würth Elektronik and STMicroelectronics have jointly developed a demo using a Würth power tool. The design, which efficiently drives a low-voltage brushless DC motor, is ideal for handheld power-tool applications. Moreover, the design includes all the necessary user interfaces required to control the motor’s trigger, speed, and direction. At the leading international tradeshow PCIM Europe,…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced a new development board for automotive gateway systems. The R-Car S4 Starter Kit is a low-cost, readily available development board for building software using the Renesas R-Car S4 system-on-chip (SoC). The SoC delivers high computing performance and an array of communication features for both cloud communication…

Qualcomm Technologies has announced the new Snapdragon 4 Gen 2 mobile platform, which has been creatively engineered to make incredible mobile experiences accessible to more consumers globally. Snapdragon 4 Gen 2 provides effortless, all-day use with fast CPU speeds, sharp photography, videography, and speedy 5G and Wi-Fi for reliable connections. “Snapdragon – at its core…

Nexperia, a semiconductor expert, is extending its package options for its NextPower 80/100 V MOSFETs portfolio, previously only available in LFPAK56E. The options now include LFPAK56 and LFPAK88 packaging. These devices have been designed to combine high efficiency with reduced spiking behavior in telecommunications, server computing, industrial, power supply, fast charging, USB-PD, and motor control…

Infineon presents its new generation of 1200 V CoolSiC MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC) MOSFET generation offers high-power density and efficiency, enables bi-directional charging, and significantly reduces system cost in onboard charging (OBC) and DC-DC applications. The 1200 V CoolSiC family member offers best-in-class switching performance through 25% lower…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has debuted three new MCU groups targeting motor-control applications. Additionally, Renesas is introducing more than 35 new products, including devices from both the RX and RA families. The new MCUs add to the industry’s top motor-control portfolio, including multiple MCU and MPU families, analog and power…

To meet global climate targets, transportation must shift to more environmentally friendly vehicles such as energy-efficient electrified trains. Trains, however, have demanding operating profiles with frequent acceleration and braking, while being expected to operate reliably over a long service life. Consequently, energy-efficient traction applications with high-power density, reliability, and quality are required for implementation. Infineon…

Infineon Technologies has launched the OptiMOS 7 40V MOSFET family, its latest generation of power MOSFETs for automotive applications in a variety of lead-free and robust power packages. The new family combines 300 mm thin-wafer technology with innovative packaging to deliver significant performance benefits in tiny packages. This makes the MOSFETs ideal for all standard and…

Infineon Technologies and Hi-Lo Systems, a Taiwan-based IC programming and testing company, announced a partnership to work on Trusted Platform Module (TPM) security chips. Hi-Lo Systems has officially become an Associated Partner of Infineon in the Greater China market and will provide firmware update programming services for Infineon’s OPTIGA TPMs. This will help accelerate time-to-market…

The electrification of everything is driving the growth of SiC semiconductors as large market segments such as E-Mobility, sustainability and industrial turn to SiC power solutions because of its fast-switching capabilities, lower power loss, and higher-temperature performance. To help power design engineers transition to SiC power solutions with ease, speed and confidence, Microchip Technology announces…

The technology group ZF will, from 2025, purchase silicon carbide devices from STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications. Under the terms of the multi-year contract, ST will supply a volume of double-digit millions of silicon carbide devices to be integrated into ZF’s new modular inverter architecture going into series production in…

Infineon Technologies expands its SECORA Pay solutions portfolio to 28 nm technology. With this, the company further pushes the limits of payment cards with new, innovative product designs. In addition, it also offers the latest technology as a reliable sourcing option to all regional payment ecosystems. The new product family is the first of its…

At APEC 2023, Infineon Technologies announced that the company is joining forces with Infinitum, creator of the sustainable, breakthrough air core motor. In this technology collaboration, Infineon will provide silicon-carbide (SiC) CoolSiC MOSFETs and other key semiconductor components that greatly contribute to the Infinitum motor system’s precise motor control, optimal power, and energy savings. The…

Vishay Intertechnology has announced that the company upgraded its TSOP2xxx, TSOP4xxx, TSOP57xxx, TSOP6xxx, and TSOP77xxx series infrared (IR) receiver modules for IR remote-control applications with a new Cyllene 2 IC. Designed in-house to ensure long-term product availability and reduced lead times, the new IC allows designers to achieve higher performance with drastically reduced current consumption over a wider voltage…

Vishay Intertechnology has introduced three new series of automotive-grade, surface-mount standard rectifiers that are the industry’s first devices in the low-profile DFN3820A package with wettable flanks. Providing space-saving, high-efficiency solutions for power line polarity protection and rail-to-rail protection in commercial, industrial, and automotive applications, the 2 A SE20Nx, 3 A SE30Nx, and 4 A SE40Nx are each…

Vishay Intertechnology has introduced two new 30 V symmetric dual n-channel power MOSFETs that combine high and low side TrenchFET Gen V MOSFETs in a single 3.3 x 3.3 mm PowerPAIR 3x3FS package. For power conversion in computing and telecom applications, the Vishay Siliconix SiZF5300DT and SiZF5302DT increase efficiency while reducing component counts and simplifying designs. The dual MOSFETs…