Semiconductors

Littelfuse has introduced the QS series of high-speed semiconductor fuses designed for protecting power semiconductor devices. The cylindrical 10 mm x 38 mm fuses feature higher current ratings and rapid response times to limit fault currents. These fast-acting fuses offer short-circuit protection while reducing heat energy transfer to protected devices. The QS series handles repeated on/off switching…

Power Integrations has unveiled the 1700 V InnoMux-2, a gallium nitride (GaN) switch designed for high-voltage power semiconductors. The technology integrates into the company’s InnoMux-2 power supply IC family, engineered for multi-output power supplies operating from high-voltage DC sources. Andy Smith, Director of Training at Power Integrations, explained, “The new device is fabricated using our…

onsemi has introduced its latest generation silicon carbide technology platform, EliteSiC M3e MOSFETs, to address the growing demand for electrification and renewable energy resources. The company plans to release multiple additional generations through 2030 to support global climate goals and the transition to electrification. The EliteSiC M3e MOSFETs are designed to improve performance and reliability…

The paradigm shift towards offloading complexity to suppliers and adopting smaller IGBT modules is evident in various applications. In response to the global push for downsizing and integration, Infineon Technologies AG introduces the 4.5 kV XHP 3 IGBT modules that will fundamentally change the landscape for medium voltage drives (MVD) and transportation applications operating at…

Twelve companies, automotive, electrical component, and semiconductor companies established the " Advanced SoC Research for Automotive; (ASRA) on December 1st to conduct research and develop high-performance digital semiconductors (System on Chip, SoC) for use in automobiles. ASRA will research and develop SoCs for automobiles using chipset technology to install SoCs in mass-production vehicles from 2030…

In response to the consumer demand for improved wireless charging user experience, the Wireless Power Consortium announced the release of a new standard to redefine the inductive wireless power transfer: Qi2. Infineon Technologies is addressing this demand by introducing its first Qi2 Magnetic Power Profile (MPP) charging transmitter solution, the reference design kit REF_WLC_TX15W_M1. The…

MediaTek announced that it has successfully developed its first chip using TSMC’s 3nm technology — taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC. Both companies are taking advantage of their chip design and manufacturing strengths to…

STMicroelectronics‘ new SPSB081 automotive power-management IC is a Swiss Army Knife of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers, a CAN FD transceiver, and an optional LIN transceiver. The ICs provide multiple standby modes with very low quiescent current and programmable local or remote wake-up to help…

Texas Instruments (TI) has introduced its new opto-emulator portfolio of signal isolation semiconductors, designed to improve signal integrity, consume less power, and extend the lifetime of high-voltage industrial and automotive applications. TI’s inaugural opto-emulators are pin-to-pin compatible with the industry’s most common optocouplers, enabling seamless integration into existing designs while leveraging the unique benefits of…

With the step-function increase in data collected and transmitted from cloud-connected edge nodes, Improved Inter Integrated Circuit (I3C) is rapidly becoming a more sustainable solution for interfacing sensors with a high data rate and will help expand capabilities in next-generation devices. Leading the way in I3C integration, Microchip Technology has released its PIC18-Q20 family of microcontrollers…

As digitalization, urbanization, and the rise of electro-mobility continue to shape the rapidly evolving world, the demand for power consumption is reaching unprecedented levels. Acknowledging energy efficiency as an important concern, Infineon Technologies addresses these megatrends with its silicon carbide (SiC) CoolSiC MOSFET 650 V in TO leadless (TOLL) packaging. The new SiC MOSFETs are…

Nexperia, an expert in semiconductors, introduced the NBM7100 and NBM5100,  innovative battery-life boosting ICs designed to extend the life of a typical non-rechargeable lithium coin-cell battery by up to 10x (compared to competing solutions). They also increase peak output current capability by up to 25x compared to what a typical coin cell can deliver without…

Würth Elektronik and STMicroelectronics have jointly developed a demo using a Würth power tool. The design, which efficiently drives a low-voltage brushless DC motor, is ideal for handheld power-tool applications. Moreover, the design includes all the necessary user interfaces required to control the motor’s trigger, speed, and direction. At the leading international tradeshow PCIM Europe,…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced a new development board for automotive gateway systems. The R-Car S4 Starter Kit is a low-cost, readily available development board for building software using the Renesas R-Car S4 system-on-chip (SoC). The SoC delivers high computing performance and an array of communication features for both cloud communication…

Qualcomm Technologies has announced the new Snapdragon 4 Gen 2 mobile platform, which has been creatively engineered to make incredible mobile experiences accessible to more consumers globally. Snapdragon 4 Gen 2 provides effortless, all-day use with fast CPU speeds, sharp photography, videography, and speedy 5G and Wi-Fi for reliable connections. “Snapdragon – at its core…

Nexperia, a semiconductor expert, is extending its package options for its NextPower 80/100 V MOSFETs portfolio, previously only available in LFPAK56E. The options now include LFPAK56 and LFPAK88 packaging. These devices have been designed to combine high efficiency with reduced spiking behavior in telecommunications, server computing, industrial, power supply, fast charging, USB-PD, and motor control…

Infineon presents its new generation of 1200 V CoolSiC MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC) MOSFET generation offers high-power density and efficiency, enables bi-directional charging, and significantly reduces system cost in onboard charging (OBC) and DC-DC applications. The 1200 V CoolSiC family member offers best-in-class switching performance through 25% lower…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has debuted three new MCU groups targeting motor-control applications. Additionally, Renesas is introducing more than 35 new products, including devices from both the RX and RA families. The new MCUs add to the industry’s top motor-control portfolio, including multiple MCU and MPU families, analog and power…

To meet global climate targets, transportation must shift to more environmentally friendly vehicles such as energy-efficient electrified trains. Trains, however, have demanding operating profiles with frequent acceleration and braking, while being expected to operate reliably over a long service life. Consequently, energy-efficient traction applications with high-power density, reliability, and quality are required for implementation. Infineon…

Infineon Technologies has launched the OptiMOS 7 40V MOSFET family, its latest generation of power MOSFETs for automotive applications in a variety of lead-free and robust power packages. The new family combines 300 mm thin-wafer technology with innovative packaging to deliver significant performance benefits in tiny packages. This makes the MOSFETs ideal for all standard and…