Vishay Intertechnology, Inc. has introduced two new n-channel TrenchFET MOSFETs that increase power density, efficiency, and board-level reliability in telecom and industrial applications. To achieve these design goals, the 60 V SiJH600E and 80 V SiJH800E combine ultra low on-resistance with high-temperature operation to +175° C and high continuous drain-current handling. The space-saving PowerPAK 8x8L package promotes board-level…
Vishay enchances its series of automotive-grade, thin-film chip resistors
Vishay Intertechnology announced that the company has enhanced its MC AT precision series of automotive-grade, thin-film chip resistors with a wider range of resistance values in the 0402, 0603, and 0805 case sizes. The Vishay Beyschlag devices combine their high resistance values with TCR of ± 25 ppm/K, tight tolerances of ± 0.1 %, and…
Vishay offers automotive-grade, silicon PIN photodiode in surface-mount package
The Optoelectronics group of Vishay Intertechnology has introduced a new automotive-grade, 4-quadrant silicon PIN photodiode in a standard surface-mount package. Enabling a variety of sensor and control applications for the automotive, consumer, and industrial markets, the Vishay Semiconductors K857PH combines high photo sensitivity with low 0.1 % crosstalk and virtually no tolerance between its segments. The…
Infineon launches new generation of single half-bridge ICs
Infineon Technologies presents the new MOTIX BTN99xx (NovalithIC+), a unique family of intelligent integrated half-bridges and the direct successor to the BTN89xx. Besides a p-channel high-side and an n-channel low-side MOSFET, BTN99xx also includes smart driver ICs fully integrated in a single package. Its ease-of-use, offering advanced protection and scalability, which makes the family ideal…
New OptiMOS power MOSFET package enables innovative source-down technology
High-power density, optimized performance, and ease-of-use are key requirements when designing modern power systems. To offer practical solutions for design challenges in end applications, Infineon Technologies has launched a new generation of OptiMOS source-down (SD) power MOSFETs. These devices come in a PQFN 3.3 x 3.3 mm2 package and a wide voltage class ranging from…
STMicroelectronics offering new family of GaN power semiconductors
STMicroelectronics, a global semiconductor serving customers across the spectrum of electronics applications, has revealed a new family of GaN power semiconductors in the STPOWER portfolio that can significantly reduce energy use and enable slimmer designs in a variety of electronic products. Target applications include consumer equipment such as chargers, external power adapters for PCs, LED-lighting…
STMicroelectronics and Politecnico di Milano expand semiconductor R&D capabilities at PoliFab
STMicroelectronics and Politecnico di Milano (PoLiMi) have inaugurated the expansion of semiconductor-manufacturing capabilities at PoliFab, the University’s micro and nanotechnology R&D center. Building on the long-standing collaboration between the two organizations, the PoliFab’s clean room — a facility where silicon wafers are made into semiconductor chips — has received state-of-the-art equipment from STMicroelectronics to boost…
Renesas develops write technologies for embedded STT-MRAM
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced the development of two technologies that reduce the energy and voltage application time for the write operation of spin-transfer torquemram magnetic random-access memory (STT-MRAM, hereinafter MRAM). On a 20-megabit (Mbit) test chip with embedded MRAM memory cell array in a 16 nm FinFET logic…
Renesas introduces RA6T2 MCUs for next-generation motor control
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has launched the RA6T2 Group MCUs, which feature a rich set of peripheral functions and hardware accelerator designed specifically for motor control. The new RA6T2 Group MCUs deliver a combination of performance, features, and cost-efficiency for motor control designs in home appliances, smart home, industrial and…
Nexperia offers range of A-selection Zener diodes for precise voltage
Nexperia, the expert in essential semiconductors, has announced the industry’s first range of A-selection Zener diodes. With a tolerance of just ±1%, the BZT52H-A (SOD123F) and BZX384-A (SOD323) series provide a higher precision voltage reference compared to the B (±2%) and C (±5%) variants. Matching the rising demands of mobile, portable/wearable, automotive and industrial applications…
Nexperia launches A-selection Zener diodes with industry’s lowest tolerance of ±1%
Nexperia, an expert in essential semiconductors, announced the industry’s first range of A-selection Zener diodes. With a tolerance of just ±1%, the BZT52H-A (SOD123F) and BZX384-A (SOD323) series provide a higher precision-voltage reference compared to the B (±2%) and C (±5%) variants. Matching the rising demands of mobile, portable/wearable, automotive and industrial applications and meeting…
Vishay offers vPolyTan polymer tantalum chip capacitors for harsh conditions
Vishay Intertechnology, Inc. introduced a new series of vPolyTan surface-mount polymer tantalum molded chip capacitors, designed to deliver reliable performance in high temperature and humidity. Vishay Polytech T50 series capacitors feature a reliable design with improved hermeticity for increased protection in harsh environments. The devices offer high-temperature operation to +125° C and withstand temperature humidity bias…
STMicroelectronics launches NFC Type 2 Tag IC with privacy features
STMicroelectronics’ ST25TN512 and ST25TN01K NFC Forum Type 2 tag ICs deliver a new balance of cost and performance for high-volume use cases like consumer engagement, product information, and brand protection. Also suitable for smart-city applications and access control, the ST25TN512/01K NFC tag ICs support multiple user-protection and privacy mechanisms including a seven-byte unique chip-identifier code, TruST25 digital signature, NFC…
Dialog Semiconductor’s DA16200 secures PSA Certified Level 1 for Wi-Fi SoCs
Dialog Semiconductor Limited — a Renesas company and provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and industrial edge-computing solutions — announced that its DA16200 SoC has achieved PSA Certified Level 1 status. With the broader adoption of IoT devices (such as wearables, door locks, thermostats, and smart home sensors), ensuring chip-level security…
TSMC announces advanced N4P process technology
TSMC recently introduced its N4P process, a performance-focused enhancement of the 5-nanometer (N5) technology platform. N4P joins the industry’s most advanced and extensive portfolio of advanced technology processes. With N5, N4, N3, and the latest addition of N4P, TSMC customers will have multiple and compelling choices for power, performance, area, and cost for its…
Vishay’s new high-voltage chip divider improves TC tracking performance
Vishay Intertechnology has introduced the industry’s first high-voltage chip divider to be offered in a ribbed, molded package with compliant surface-mount leads. Designed to reduce component counts and improve TC tracking performance and ratio stability in automotive and industrial equipment, the Vishay Techno CDMM delivers a maximum working voltage of 1500 V in the 4527 case…
Microchip launches fully configurable, digital gate driver for silicon-carbide MOSFETs
As demand for electric buses and other electrified heavy transport vehicles increases to meet lower emission targets, silicon carbide-based power management solutions are providing greater efficiencies in these transportation systems. To complement its broad portfolio of silicon carbide MOSFET discrete and module products, Microchip Technology has announced a new 1200V production-ready digital gate driver —…
Nexperia surface-mount device passes Board Level Reliability for automotive applications
Nexperia, a semiconductor provider, announced that one of its surface-mount device packages — the clip-bond FlatPower package CFP15B — has passed Board-level Reliability (BLR) testing for automotive applications by a top Tier 1 supplier. Initially, the FlatPower package will be used in an engine-control unit. BLR provides a means of evaluating the reliability of semiconductor…
Samsung earns global carbon-footprint certification for its logic chips
Samsung Electronics, a provider of advanced semiconductor technology, announced that four of its System LSI products received product carbon-footprint label certification from the Carbon Trust — the first of Samsung’s logic chips to do so. Having received the semiconductor industry’s first carbon-footprint accreditation for memory chips from the Carbon Trust in 2019, Samsung has now…
STMicroelectronics launches new MasterGaN integrated power packages
Easing the transition to high-efficiency wide-bandgap technology, STMicroelectronics has released the MasterGaN3* and MasterGaN5 integrated power packages for applications up to 45 and 150W. Joining the MasterGaN1, MasterGaN2, and MasterGaN4 — which target applications from 65 to 400W — the additions give extra flexibility to choose the optimum Gallium Nitride (GaN) device and driver solution when designing switched-mode power…