Infineon Technologies expands its SECORA Pay solutions portfolio to 28 nm technology. With this, the company further pushes the limits of payment cards with new, innovative product designs. In addition, it also offers the latest technology as a reliable sourcing option to all regional payment ecosystems. The new product family is the first of its…
Infineon teams with Infinitum to drive decarbonization
At APEC 2023, Infineon Technologies announced that the company is joining forces with Infinitum, creator of the sustainable, breakthrough air core motor. In this technology collaboration, Infineon will provide silicon-carbide (SiC) CoolSiC MOSFETs and other key semiconductor components that greatly contribute to the Infinitum motor system’s precise motor control, optimal power, and energy savings. The…
Vishay enhances its infrared receiver modules for remote-control applications
Vishay Intertechnology has announced that the company upgraded its TSOP2xxx, TSOP4xxx, TSOP57xxx, TSOP6xxx, and TSOP77xxx series infrared (IR) receiver modules for IR remote-control applications with a new Cyllene 2 IC. Designed in-house to ensure long-term product availability and reduced lead times, the new IC allows designers to achieve higher performance with drastically reduced current consumption over a wider voltage…
Vishay introduces new series of automotive-grade, surface-mount standard rectifiers
Vishay Intertechnology has introduced three new series of automotive-grade, surface-mount standard rectifiers that are the industry’s first devices in the low-profile DFN3820A package with wettable flanks. Providing space-saving, high-efficiency solutions for power line polarity protection and rail-to-rail protection in commercial, industrial, and automotive applications, the 2 A SE20Nx, 3 A SE30Nx, and 4 A SE40Nx are each…
Vishay launches new 30 V space-saving, symmetric dual MOSFETs
Vishay Intertechnology has introduced two new 30 V symmetric dual n-channel power MOSFETs that combine high and low side TrenchFET Gen V MOSFETs in a single 3.3 x 3.3 mm PowerPAIR 3x3FS package. For power conversion in computing and telecom applications, the Vishay Siliconix SiZF5300DT and SiZF5302DT increase efficiency while reducing component counts and simplifying designs. The dual MOSFETs…
Infineon and Sentry partner on cold-storage crypto wallet platforms
Sentry Enterprises, a technology-based company focused on transforming what identity means across the physical and digital worlds, selected Infineon’s latest generation SLC37x Secure Element chip family to fuel its biometric platforms. Sentry Enterprises is the creator and maker of the SentryCard biometric platform, a privacy-centric, proof-of-identity solution, along with the soon-to-be-released Sentinel biometric cold-storage crypto wallet.…
Infineon releases MERUS multilevel Class D audio amplifiers
Long-lasting music playback performance that comes in compact, cost-effective, and power-efficient designs, is indispensable for battery-powered applications. Infineon Technologies recently introduced its latest generation of MERUS multilevel Class D audio amplifiers. Several ecosystem partners of Infineon are now ready to support interested customers with their design-in efforts. Partnering with the experts, the company aims to…
Renesas launches intelligent power device for vehicles
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced a new automotive Intelligent Power Device (IPD) that will safely and flexibly control power distribution within vehicles — addressing the requirements of next-generation E/E (electrical/electronic) architectures. The new RAJ2810024H12HPD is available in the small TO-252-7 package and reduces the mounting area by about 40%…
Infineon offers MOTIX 3-phase gate driver IC with power management
The MOTIX family for automotive and industrial motor-control applications from Infineon Technologies offers a broad product portfolio with various levels of integration. To further expand its offering, Infineon introduces the MOTIX 3-phase gate driver IC 6ED2742S01Q. The 160 V silicon-on-insulator (SOI) gate driver features an integrated power management unit (PMU) and is available in a…
New gate driver IC supports high-voltage power devices
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced a new gate driver IC, designed to drive high-voltage power devices such as Insulated Gate Bipolar Transistors (IGBTs) and Silicon Carbide (SiC) MOSFETs for electric vehicle (EV) inverters. Gate driver ICs are essential components to EV inverters, providing an interface between the inverter control MCU…
Renesas launches Wi-Fi development kit with support for Matter protocol
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced its first development kit that includes support for the new Matter protocol. Renesas also announced that it will offer Matter support on all future Wi-Fi, Bluetooth Low-Energy (LE) and IEEE 802.15.4 (Thread) products — including products from recently acquired Dialog Semiconductor and Celeno Communications. The…
Infineon to highlight IoT and security solutions at CES 2023
Infineon Technologies announced that it will highlight the company’s contributions to mitigating climate change and enabling digital transformation at CES 2023. Located at the Venetian Titian Ballrooms 2204 & 2205 and LVCC West Hall (Booth #3829), Infineon will present IoT security solutions, smart sensors and dependable semiconductor solutions that help shape a sustainable future. With…
STMicroelectronics boosts EV performance with new SiC power modules
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has released high-power modules for electric vehicles that boost performance and driving range. ST’s new silicon-carbide (SiC) power modules have been selected for Hyundai’s E-GMP electric-vehicle (EV) platform shared by KIA EV6 and several models. Five new SiC-MOSFET-based power modules provide flexible choices…
Renesas’ radiation-hardened ICs onboard Artemis 1
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off on November 16th. Intersil-brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort…
TSMC launches OIP 3DFabric Alliance
TSMC recently announced the Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric Alliance is TSMC’s sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness — with a full…
STMicroelectronics’ managing control and security of the Google Pixel 7
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has revealed that its ST54K IC is handling control and security for contactless NFC communication in the newly launched Google Pixel 7 smartphone. Chosen by Google’s designers, ST’s device combines NFC control and a certified Secure Element in a single chip that saves…
Supermicro collaborates with Infineon on green computing
The new dimension of digitalization is enormous and global data volumes will only multiply exponentially in the future with video streaming, virtual conferences, cloud services, cryptocurrencies, and many other digital applications. Experts estimate a 146-fold increase in data in just 15 years. According to the U.S. International Trade Commission, 175 zettabytes (≙ 175,000,000,000,000,000,000,000 bytes) of…
Nexperia adds to its range of CFP power diodes
Nexperia, an expert in essential semiconductors, announced the latest additions to its rapidly expanding portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include 32 planar Schottky diodes and eight hyperfast recovery rectifiers housed in the CFP15B package. They’re available as standard and Q-types that meet AEC-Q101 automotive qualification…
Vishay launches fourth-generation 600 V EF series diode MOSFET
Vishay Intertechnology has introduced a new fourth-generation 600 V EF Series fast-body diode MOSFET in the low-profile PowerPAK 10 x 12 package. Providing high efficiency and power density for telecom, industrial, and computing applications, the Vishay Siliconix n-channel SiHK045N60EF slashes on-resistance by 29% compared to previous-generation devices. It also delivers a 60% lower gate charge. This…
What is IP geofencing?
Very-large-scale integration or VLSI chips integrate several high-level components, which are highly sophisticated gate-level circuits. Semiconductor Intellectual Property (IP) is the standard source for synthesizing higher-level components in VLSI chips or FPGA boards. Semiconductor IPs typically provide the hardwired, implementable design of one of the following: A transform An encryption or deciphering algorithm The adaptive…