Vishay Intertechnology has introduced 15 new FRED Pt Gen 5 600 V and 1200 V Hyperfast and Ultrafast rectifiers in the compact SOT-227 package. Offering the best conduction and switching loss trade-off for devices in their class, the Vishay Semiconductors rectifiers are designed to increase the efficiency of high-frequency converters and of soft-switched or resonant designs.…
Vishay offers UVC emitting diodes in ceramic and quartz-based packages
Vishay Intertechnology has introduced two new UVC (short wavelength ultraviolet) emitting diodes in a ceramic and quartz-based package for sterilization in medical, industrial, and consumer applications. Compared to previous-generation solutions, the Vishay Semiconductors VLMU35CR40-275-120 and VLMU35CR41-275-120 deliver higher radiant power at a lower cost, while offering higher disinfection efficiency and longer service life. The new…
STMicroelectronics releases advanced VDA-compliant LIN alternator regulator
STMicroelectronics has introduced the L9918 automotive alternator regulator, with enhanced features to ensure the stability of 12V vehicle electrical systems. The regulator contains a MOSFET to deliver an alternator excitation current and a freewheeling diode to handle the rotor current when excitation is turned off. Closed-loop operation with load-response control (LRC) and return LRC maintains a…
STMicroelectronics simplifies SiC inverter designs
STMicroelectronics has released two STPOWER modules that contain 1200V silicon-carbide (SiC) MOSFETs in popular configurations. Each uses ST’s ACEPACK 2 package technology to ensure high power density and simplified assembly. The first of the new modules, the A2F12M12W2-F1, is a four-pack module that provides a convenient and compact full-bridge solution for circuits such as DC/DC converters. Another module,…
Taiwan Semiconductor launches new 40V power MOSFETs
Taiwan Semiconductor introduces the new 40V PerFET (NH Series) power MOSFETs with a PDFN33 package. The new MOSFETs are built on proprietary device structures and processes that enable exceptionally low on-state resistance and switching figure-of-merit (FOM – R*Q). The achievement of 35% FOM reduction, compared to previous technology (NB Series), puts this portfolio at the…
Vishay offer new 600 V Ultrafast rectifiers
Vishay Intertechnology has introduced four new FRED Pt Gen 5 600 V Ultrafast rectifiers in the TO-244 package. Offering the ideal conduction and switching loss trade-off for devices in their class, the 240 A, 300 A, 480 A, and 600 A Vishay Semiconductors rectifiers are designed to increase the efficiency of medium frequency power converters…
Broadcom ships Tomahawk 5, industry’s highest bandwidth switch chip
Broadcom‘s StrataXGS Tomahawk 5 switch series, provides 51.2 Terabits/sec of Ethernet switching capacity in a single, monolithic device, which is double the bandwidth of other available switch silicons. “Delivering the world’s first 51.2 Tbps switch two years after we released Tomahawk 4, the industry’s first 25 Tbps switch, is a testament to the outstanding execution…
Nexperia offers ultra-low capacitance ESD-protection diodes for automotive applications
Nexperia, an expert in essential semiconductors, announced an extension to its portfolio of low-clamping and ultra-low capacitance ESD protection diodes. This portfolio is designed to protect high-speed data lines such as USB 3.2, HDMI 2.0, LVDS, automotive A/V Monitors, displays, and cameras. Additionally, this portfolio also aims to address the upcoming high-speed video links, and…
CARIAD and STMicroelectronics to co-develop chip for software-defined vehicles
New cooperation model for software-defined cars: CARIAD, the software unit of Volkswagen Group, and STMicroelectronics (ST), a global semiconductor provider serving customers across the spectrum of electronics applications, will shortly launch the joint development of an automotive system-on-chip (SoC). Together, CARIAD and ST are developing tailored hardware for connectivity, energy management, and over-the-air updates — making…
Nexperia releases the industry’s smallest DFN MOSFETs
Nexperia, an expert in essential semiconductors, announced the release of a new range of 20 and 30V MOSFETs in the world’s smallest DFN package — the DFN0603. The company already offers ESD protection devices in this package, but has now succeeded in bringing it to their MOSFET portfolio, a feat as yet unmatched in the…
Infineon and Delta collaborate on WBG-based server and gaming solutions
Global megatrends such as digitalization, and decarbonization, call for wide bandgap (WBG) devices (SiC/GaN). Due to their unique technological characteristics, they enable the highest performance and energy efficiency. With a commitment to these domains, Infineon Technologies and Delta Electronics, Inc., are deepening their collaboration to deliver superior solutions for the convenience of end customers. The…
STMicroelectronics and GlobalFoundries to develop joint semiconductor manufacturing facility
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, and GlobalFoundries Inc., a feature-rich semiconductor manufacturing, today announced they have signed a Memorandum of Understanding to create a new, jointly operated 300mm semiconductor manufacturing facility adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at…
Renesas partners with Tata to accelerate progress in advanced electronics
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced a strategic partnership with Tata Motors Ltd. (TML) and Tejas Networks Ltd., Tata Group companies, on the design, development, and manufacturing of Renesas’ semiconductor solutions for enhancing innovation across electronics systems for the Indian and emerging markets. “We see great potential in collaborating with…
Renesas and Cyberon to deliver integrated voice-user interface solutions
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Cyberon Corporation, an embedded speech solution provider, announced that they have partnered to deliver voice user interface (VUI) solutions for customers using Renesas’ entire RA MCU line. Renesas RA customers will now have complimentary access to Cyberon’s continuous command-based VUI toolchain, enabling them to add…
STMicroelectronics releases Bluetooth SoC with location tracking
STMicroelectronics has introduced its third-generation Bluetooth System-on-Chip (SoC), enhanced with Bluetooth direction-finding technology for location-tracking and real-time positioning applications. By determining the direction of a Bluetooth Low Energy (BLE) signal, the Bluetooth 5.3 certified BlueNRG-LPS SoC can precisely estimate movement and location with centimetre accuracy. It uses Bluetooth-specified technology including angle-of-arrival (AoA) and angle-of-departure (AoD), as…
MediaTek’s chipset offers high-performance option for 5G smartphones
MediaTek has announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient. The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm…
Nexperia’s new level translators support legacy and future mobile SIM cards
Nexperia, an expert in essential semiconductors, announced the latest addition to its family of voltage level translators, the NXT4557GU and NXT4556UP. These devices enable seamless connectivity of next-generation, low-voltage mobile phone baseband processors with its subscribers’ identity module (SIM) cards. As processor geometries advance to single-digit nanometer nodes, the core voltage of advanced SoCs is…
New NFC readers accelerate payment and consumer application designs
STMicroelectronics’ ST25R3916B-AQWT and ST25R3917B-AQWT NFC Forum Reader devices combine high output power and energy efficiency at a competitive price. Supporting NFC initiator, target, reader, and card-emulation modes, they can be used in contactless-payment, device pairing, wireless charging, brand protection, and other industrial and consumer applications. The new devices introduce improved active wave shaping (AWS) with increased flexibility that…
TI breaks ground on 300-mm semiconductor wafer-fabrication plants in Texas
Texas Instruments (TI) has officially broken ground on its new 300-mm semiconductor wafer-fabrication plants (or “fabs”) in Sherman, Texas. In a groundbreaking ceremony attended by elected officials and community leaders, TI Chairman, President and CEO Rich Templeton celebrated the start of construction on the largest private-sector economic investment in Texas history and reiterated the company’s commitment to expanding…
Infineon offers Press Pack IGBT for transmission and distribution applications
Infineon Technologies Bipolar GmbH & Co. KG has expanded its high-power Prime Switch family with the new Press Pack IGBT (PPI) with internal freewheeling diodes (FWD) in ceramic disc housings. This PPI is specifically designed for transmission and distribution applications and is ideal for high-current Modular Multilevel Converter (MMC), medium-voltage drives, DC breakers, wind-turbine converters,…