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Renesas releases its first dual-beam, active beamforming IC lineup

By Michelle Froese

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its portfolio of mmWave LNAs and Tx BFICs with the introduction of three new dual-beam active beamforming ICs:

  • F6121 for Ku-band Satcom
  • F6122 for Ka-band Satcom and
  • F6123 for Ku-band radar and line-of-sight communications

Featuring best-in-class power consumption, noise figure, a compact size, and easy integration, these new ICs are a critical enabler of next-generation, low-latency electronically steered antennas for in-flight connectivity, maritime, satcom-on-the-move, and low earth-orbit (LEO) ground terminals.

The new F61xx Rx devices are the first commercial products to feature dual-beam capability for make-before-break or simultaneous multi-satellite, multi-orbit operation over the full Ku and Ka Satcom bands.

The F61xx offers OEMs the flexibility of LNA selection and placement for improved noise figure and system G/T performance. Taking advantage of these features, the ICs have already been designed-in by major satcom solution providers and OEMs for half and full-duplex systems — with anticipated production ramps starting in 2022.

“Our customers face three main challenges as they migrate from mechanical antennas to electronically steered antennas: Thermal management, physical integration and affordability,” said Naveen Yanduru, VP of RF Communications Product Division at Renesas. “The new dual-beam F61xx devices deliver the cost-effective, power-efficient, low noise and compact size combination the industry needs for next-generation low-latency Satcom, radar and communications systems that will connect more people in more places.”

Satcom beamforming ICs
The second generation of F61xx dual-beam beamforming ICs address the thermal, integration, and cost challenges designers face as they transition from bulky mechanically steered antennas to the lower weight and leaner profile active electronically scanned array antennas (AESAs).

The new devices deliver reduced power consumption, increased on-chip beam-state memory, and dual-beam operation (configurable for single beam with 40 percent power savings), as well as highly improved RF performance. They complement the well-established sub-6 GHz RFIC portfolio and the recent 5G mmWave product lines.


Filed Under: Antenna, Components, News
Tagged With: 5G, beamforming, ic, integratedcircuits, mmwave, semiconductors
 

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