In 2013 the USB Implementers Forum released two new interfaces: USB 3.1 and USB Type-C. Together they offer many advantages over earlier USB interfaces, but those advantages will require careful design to actualize. Specifically, products enabling USB 3.1 Type-C must take special care to provide ESD protection on the various high speed and high power lines incorporated in these new interfaces. At the same time, designs must ensure bandwidth is not sacrificed. The Silicon Enhanced ESD Diode Array (SESD) product line from Littelfuse offers a range of solutions uniquely suited to the challenges of this high-speed serial interface design. The SESD product line delivers maximum protection with minimal added system cost, complexity and attenuation.
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