MediaTek has announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient. The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm…
New automotive radar sensor enables reliable in-cabin monitoring system
With spring, temperatures are rising again to reach highs in summer. But rising temperatures also mean that it quickly becomes up to 70° C inside parked vehicles, which is a danger for animals and children left behind in the car. Equipped with the XENSIV 60 GHz automotive radar sensor (BGT60ATR24C) from Infineon Technologies, in-cabin monitoring…
Infineon launches TRENCHSTOP 1700 V IGBT7 chip technology
Infineon Technologies has launched the new TRENCHSTOP 1700 V IGBT7 chip in the standard industrial package EconoDUAL 3. With this new chip technology, the EconoDUAL 3 provides currents of 900 A and 750 A, enabling an improved power range for inverters. The modules target a wide range of applications including wind, drive, and static VAR generators…
Renesas incorporates solutions from Celeno for 10 new winning combinations
Renesas Electronics Corporation announced 10 new winning combinations that combine Wi-Fi 6 and 6E chipsets from recently acquired Celeno Communications — with a broad range of solutions from Renesas including embedded processing, analog, power, timing and connectivity. The new winning combos include solutions for IoT, Industrial, Infrastructure, and other applications. Renesas’ combinations are engineering-vetted designs…
Infineon launches complete MOTIX 12 V motor-control kit with sensors
With the MOTIX motor-control kit, Infineon Technologies presents a complete system solution for motor control. The pre-assembled kit provides everything needed to get the motor spinning in a matter of seconds: a market-proven chipset combined with pre-flashed sample software and a BLDC motor. Only a power supply needs to be connected. Therefore, the motor-control kit…
Infineon and Deeyook develop precise location tracking with low-power Wi-Fi chipset
Infineon Technologies and Deeyook have announced their collaboration on location solutions. The location-as-a-service (LaaS) company has invented and patented an award-winning tracking solution to determine indoor and outdoor locations of items, assets, and employees. Both companies fuse Deeyook’s ultra-precise, innovative algorithms into Infineon’s best-in-class, low-power AIROC Wi-Fi portfolio to enable an accurate, passive, ubiquitous, and efficient…
Micron and MediaTek first to validate LPDDR5X 5G chipset for smartphone
MediaTek recently validated Micron Technology’s low-power, double data rate 5X (LPDDR5X) DRAM for MediaTek’s new Dimensity 9000 5G flagship chipset for smartphones. Micron is the first semiconductor company to sample and validate this fastest, most advanced mobile memory in the industry and has shipped the first batch of samples of LPDDR5X built on its first-to-market…
STMicroelectronics expands connectivity for smart-metering applications
STMicroelectronics has extended the certification of its ST8500 G3-PLC (Power-Line Communication) Hybrid communication chipset, now covering the U.S. Federal Communications Commission (FCC) band plan from 10 to 490kHz. This is in addition to the CENELEC-A 9kHz-95kHz European band. The move enables higher data rates, enhances design flexibility, and eases end-product approval in accordance with specific national regulations.…
STMicroelectronics adds Teseo-VIC3DA to its automotive-qualified navigation module
To support the positioning market with state-of-the-art GNSS chipset and modules, STMicroelectronics has introduced the Teseo-VIC3DA, the latest member of the Teseo module family. Teseo-VIC3DA combines ST’s high-performing Automotive Teseo III GNSS IC with the automotive, six-axis MEMS inertial measurement unit (IMU) and dead-reckoning software to create a convenient, automotive-qualified navigation module. Leveraging ST’s in-house manufacturing and…
STMicroelectronics’ 70W chipsets boost wireless-charging speed
STMicroelectronics’ STWLC98 integrated and wireless power receiver delivers faster wireless charging and flexible charge sharing for diverse portable and mobile devices for home, office, industry, healthcare, and in-car applications. When combined with the STWBC2-HP transmitter IC, the complete transmitter-receiver system can deliver up to 70W on the receiver end at high system efficiency. The STWLC98…
Maxim’s multi-phase AI power chipset achieves 95+ percent efficiency
Designers of high-performance, high-power artificial intelligence (AI) systems can now achieve highest efficiency (to reduce power cost and heat) and smallest total solution size with the MAX16602 AI cores dual-output voltage regulator and the MAX20790 smart power-stage IC. Both products are from Maxim Integrated Products. Leveraging the current ripple cancellation benefit from Maxim Integrated’s patented…