Renesas Electronics Corporation announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions ― the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity. The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE…
Renesas launches cellular-to-cloud IoT development platforms
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced two new cloud development kits, CK-RA6M5 and CK-RX65N, providing a complete connectivity solution for the RA and RX Families of 32-bit microcontrollers (MCUs). The cloud kits are the first to be equipped with Renesas’ RYZ014A Cat-M1 module, a certified LTE cellular module that offers…
Infineon adds AIROC CYW20820 Bluetooth & Bluetooth LE SoC to its portfolio
Infineon Technologies is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system-on-chip (SoC) to its AIROC Bluetooth Portfolio. The AIROC CYW20820 Bluetooth & Bluetooth LE SoC is a Bluetooth 5.2 core spec-compliant device tailor-made for IoT applications. It is designed to support a wide spectrum of use cases for home automation and sensors…
Infineon to present decarbonization and IoT solutions at EW Nuremberg 2022
Infineon Technologies has announced plans to highlight how the company links the real to the digital world by enabling smart and connected applications at Embedded World 2022 in Nuremberg. This is a prerequisite for unlocking the potential of IoT and decarbonization. The company will showcase a variety of smart IoT applications in sectors including smart…
New meter-level location accuracy available for Android smartphones
Trimble and Qualcomm Technologies have announced the availability of Trimble RTX GNSS technology for the Snapdragon 8 Gen 1 and Snapdragon 888 Mobile Platforms. This technology enables superior location capabilities in premium Android smartphones worldwide. The integration of Trimble RTX GNSS technology, a correction services platform, with Snapdragon contributes to a higher quality, more accurate…
TE launches new series of V0 cable cleats
TE Connectivity (TE), a provider of connectivity and sensors, has launched a new series of V0 cable cleats that improves cable management and protection in a wide range of applications — including wind farms, substations, data centers, rail & metro, and more. As energy demand grows, so does the complexity of cable systems. Absent or unreliable cable-management solutions can…
New Snapdragon X70 Modem-RF offers world’s first 5G AI processor
Qualcomm Technologies has announced the Snapdragon X70 5G Modem-RF System, its 5th generation modem-to-antenna 5G solution. Snapdragon X70 introduces the world’s first 5G AI processor in a modem-RF system, to harness the power of AI for breakthrough 5G performance with 10 Gigabit 5G downloads — offering fast upload speeds, low latency, coverage, and power efficiency.…
NXP advances IoT connectivity with industry’s first secure tri-radio device
NXP Semiconductors has announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2, and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive, and industrial use-cases. It also supports the new groundbreaking Matter connectivity protocol. The IW612…
Digi-Key, Seeed Studio, and Machinechat launch first, private LoRaWAN-in-a-Box solutions
Digi-Key Electronics, which offers one of the world’s largest selection of electronic components, has partnered with Seeed Studio and Machinechat to launch the industry’s first private LoRaWAN-in-a-Box solutions for the Internet of Things (IoT). “Digi-Key is proud to be the exclusive global source for these turn-key, industry-first LoRaWAN solutions,” said Robbie Paul, director of IoT business solutions at Digi-Key. “Wireless…
Renesas introduces the industry’s highest-performance, entry-line MCUs
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced a new Group of 32-bit microcontrollers (MCUs) in its RA Family. The new RA6E1 MCUs, based on the Arm Cortex-M33 core, are the industry’s first Entry-Line MCUs to deliver 200 MHz performance. The new devices also provide exceptional low power consumption specifications, along with…
Microchip unveils industry’s most compact 1.6T Ethernet PHY
Routers, switches, and line cards need higher bandwidth, port density, and up to 800-gigabit Ethernet (GbE) connectivity to handle escalating data-center traffic driven by 5G, cloud services and artificial intelligence (AI) and machine learning (ML) applications. To deliver the higher bandwidth, these designs need to overcome the signal integrity challenges associated with the industry’s transition…
MediaTek offers computing devices 5G connectivity, multimedia & gaming tech
MediaTek announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process technology, the chip is bringing premium performance to tablets with advanced 5G, multimedia, AI and gaming technologies for a premium user experience. Kompanio 1300T allows OEMs to build powerful, lightweight and…
Verizon and Samsung complete virtualized 5G data session on C-band spectrum
Verizon and Samsung Electronics recently completed an end-to-end virtualized 5G data session over C-band spectrum in a live network environment. The new milestone was reached in preparation for its upcoming 5G Ultra Wideband expansion using its newly acquired C Band spectrum. “We have been driving the industry to large scale virtualization using the advanced architecture…
Infineon’s WiFi and Bluetooth chip gives new satnav high-powered connectivity
TomTom GO Discover, developed by TomTom, the location technology company, is one of the quickest and most powerful satnavs on the market today. The satnav with its 5, 6, and 7-inch display leverages Infineon Technologies‘ AIROC CYW43455 Wi-Fi and Bluetooth combo chip. The AIROC wireless solution combines Wi-Fi 5 (802.11 ac) and Bluetooth 5.0 on…