The design of future power-electronic systems is continuously pushed to improve state-of-the-art performance and power density. Supporting this trend, Infineon Technologies has launched a new Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants. The new product family provides significant enhancements on the…