Texas Instruments (TI) introduced six new power modules aimed at enhancing power density, efficiency, and EMI reduction. These modules utilize TI’s MagPack integrated magnetic packaging technology, reducing size by up to 23% compared to competitors. These power modules leverage TI’s proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% compared to…
TI and Chicony Power partner on GaN technology for laptops
Texas Instruments (TI), a provider of high-voltage semiconductor solutions, announced that Chicony Power designed in TI’s integrated gallium-nitride (GaN) technology to power its latest 65-W laptop power adapter, Le Petit. Leveraging TI’s half-bridge GaN FET with integrated gate driver, LMG2610, Chicony Power and TI collaborated on a design to reduce the size of Chicony’s power adapter…