IBASE, a world leading provider of industrial motherboards and embedded computing solutions has officially introduced the new MB991 Micro ATX motherboard. Its design is based on Intel® Q170 chipset to support the Intel® Xeon® E3 family, 7th and 6th Generation Intel® Core™, Intel® Pentium® and Celeron® QC/DC processors manufactured on the 14nm process. The MB991 hosts a rich set of I/O and flexible expansion options. These include one PCIe x16, one PCIe x8, one PCIe x4, one Mini PCIe, one M.2 (M-key), as well as five SATA III, eight COM, six USB 3.0, and four USB 2.0. The motherboard has four DDR4 DIMM slots that can be populated with 64GB of system memory. Besides, the series supports dual Gigabit Ethernet, RAID, iAMT (11.6) and iSMART.
CUI’s Power Group has recently introduced a new lineup of low power, encapsulated AC-DC power supplies to their broad portfolio ranging from 1W to 12kW. The new PSK series is housed in a compact, encapsulated board mount package with industry standard pin-outs. Different models in the series are available with 6, 10, 15, and 20W of continuous power. The compact footprints of these modules measure as small as 2 x 1 x 0.659 inches, i.e. 50.8 x 25.4 x 16.74 mm, in dimension. As far as the applications are concerned, these modules are ideal for low power ITE, consumer electronics, and industrial control applications where board space and environmental contaminants are a concern.
Tektronix, a leading provider of measurement solutions, has expanded its PAM4 test solutions lineup to include comprehensive 400G electrical compliance testing for OIF-CEI-56G VSR/MR/LR PAM4 standards. The new software package runs on high-performance Tektronix DPo70000SX Real-Time Oscilloscopes; a lineup of models with up to 70 GHz in bandwidth. The PAM4 encoding doubles the data rate of serial data channels as compared to NRZ (non-return to zero). But as a complex modulation scheme, it also presents a number of major test and measurement challenges. Many of the measurement specs for PAM4 are still in flux which makes it difficult to stay current with the latest measurement techniques being formalized by the standards.
Littelfuse Inc., the global leader in circuit protection, has officially introduced the first encapsulated surface mount fuse. It has been designed for intrinsic safety protection of equipment intended for use in or near hazardous locations and explosive atmospheres and certified to the UL 913 Standard. In the case of overcurrent and short circuit fault conditions, the 1-mm thickness encapsulation around the body of the PICO® 304 Series surface mount fuse minimizes the amount of heat produced and contains sparks or arcs inside the fuse assembly. This prevents their exposure to potentially explosive gases or dust in the environment. It also eliminates the need to pot or coat printed circuit boards or assemblies, saving production time and money to reduce end-product costs.
In order to meet the memory market’s shortage of high-speed CMOS DDR3 and low voltage DDR3 SDRAMs, Alliance Memory has come up with a new die version (B die) for its 2Gb and 4Gb devices in the 96-ball FBGA package. The DDR architecture of these SDRAMs enables in achieving extremely fast transfer rates of 1600Mbps and clock rates of 800MHz. With minimal die shrinks, these devices offer reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions used in newer-generation microprocessors.
Ametherm has announced its latest circuit protection Thermistor packed with the industry’s smallest (UL-approved) diameter of 13 mm. It carries a maximum continuous current rating of 6.0 A and energy rating of 40 J. Earlier designers had to rely on devices with larger diameters ranging from 15 mm to 25 mm to attain high current and energy ratings of the new SL12 10006. However, the new device is being offered in a 13 mm diameter with 5.5 mm of height. The device has benefits like less board space, low cost, faster reset times, limiting the excess of circuit board heat.
In order to address the demands of the educational community for low-cost, professional development tools, SEGGER has introduced the J-Link EDU mini. It offers all advanced features associated with a commercial J-Link solution at the price of USD 18. These include the use of SEGGER’s leading IDE Embedded Studio, Ozone Debugger, and GDB Server, along with some other powerful visualization tools like SystemView and J-Scope. However, it has certain limitations regarding the permitted use for educational purposes; speed of the probe is up to 200 kByte/sec and the usage for Cortex-M targets via the SWD interface. Any tool or IDE that supports J-Link debug probes simply works with J-Link EDU mini, including SEGGER Embedded Studio. It can also be used without limitation for educational purposes.
On Semiconductor, a leading provider of semiconductor-based solutions has rolled out new image sensors for improving the performance of industrial imaging applications that require both high-resolution image capture and maximum image uniformity. The new 29-megapixel KAI-29052 sensor offers up to twice the imaging sensitivity of the existing unit in the wavelength range of 500 nanometers (nm) to 1050 nm. This enhanced performance is particularly beneficial to the applications operating in near-infrared (NIR) wavelengths like 850 nm. The superior pixel design retains isolation of charge from one photodiode to another, enabling an increase in sensitivity without much reduction in image sharpness (Modulation Transfer Function, or MTF). Besides, an improved amplifier design reduces read noise by 15% thus increasing the linear dynamic range to 66 decibels (dB).
Texas Instruments has announced a new family of Sitara AMIC SoCs, making it easy to attain cost-optimised industrial Ethernet communication. The AMIC110 SoC is a multiprotocol industrial communication processor that offers a read-to-use solution supporting over 10 Industrial Ethernet and fieldbus communication standards. The device leverages TI’s unified software platform, Processor SDK, and the programmability of TI’s industrial communications subsystem (PRU-ICSS) for industrial communication support in factory automation and control applications. The new SoC enables developers to convert existing non-networked designs like motor drives to networked systems by adding industrial Ethernet.
Microsemi Corporation, a leading provider of semiconductor solutions, has rolled out a new family of wideband plastic packaged and chip monolithic microwave integrated circuit (MMIC) devices. The addition of these products has led to the growth of high-performance wideband MMICs portfolio including 4 plastic packaged low noise amplifiers (LNAs), a wideband power amplifier (PA) chi, and 2 plastic packaged switches. Two of these LNAs namely MMA040PP5 and MMA041PP5 can outperform their competitive parts with a wider frequency from DC to 27 GHz and a higher gain of 17 decibels (dB) and OIP3 of 35 decibel milliwatts (dBm). These are packaged in a small 5 mm plastic QFN package ideal for size constrained applications.
Microsemi Corporation, a leading provider of semiconductor solutions, and Intrinsic ID, the world’s leading provider of digital authentication technology for IoT and embedded applications, have announced collaboration. The aim of this alliance is to deliver Intrinsic ID’s static random-access memory (SRAM) physical unclonable function (SRAM PUF) as a part of Microsemi’s new PolarFire field programmable gate arrays (FPGAs). QUIDDIKEY®-FLEX is a state-of-the-art high-security key generation and storage mechanism that offers advanced security features based on SRAM PUF. The SRAM PUF acts as a primary element in protecting customers’ intellectual property (IP) by protecting the confidentiality of the IP against cloning and reverse engineering. Besides, it also offers secure supply chain assurance for PolarFire FPGAs and secures applications like secure communications relying on cryptography.
Microchip Technology has introduced the industry’s first MCU with an integrated 2D Graphics Processing Unit (GPU) and up to 32 MB integrated DDR2 memory. This combination enables the customers to increase their application’s color resolution and display size by up to 12 inches with easy-to-use MCU-based resources and tools like the MPLAB Integrated Development Environment (IDE) and MPLAB Harmony software framework. The 32-bit PIC32MZ DA microcontroller family fills the graphics performance gap between MCUs and microprocessor units for customers who wish to continue using the familiar design environment. The devices offer MPU-like graphics capabilities along with seamless integration and programming model of Microchip’s PIC32 and MPLAB IDE and Harmony software framework.
Maxim Integrated Products Inc. has introduced Himalaya synchronous step-down DC-DC converters that comply with the international electronical commission (IEC) and safety integrated level (SIL) standards to achieve long-term system reliability. MAX17572 and MAX17574 are highly efficient converters that offer a 40% reduction in power dissipation and shrink solution size by 50% as compared to other solutions. The industrial market is witnessing digitization at a rapid race with continual improvement in the safety, performance, and intelligence of systems. In order to deploy processors from sensors to control units, designers are required to reduce power dissipation while managing space constraints.
Alliance Memory has introduced new 8Mb and 16Mb x 32 devices in the 90-ball 8 mm by 13 mm TFBGA package in order to meet the demand for high-density fast CMOS SRAMs. Dimensionally, 8Mb AS7C325632-10BIN and 16Mb AS7C351232-10BIN are configured as 256K x 32 and 512K x 32, respectively. These feature access times of 10 ns and minimum data retention voltages of 1.5 V. This SRAMs offer space-savvy alternatives to solutions in larger 119-ball packages. As far as the applications are concerned, the devices have been optimised for networking routers and switches, test and medical equipment, and automotive applications.
Microchip Technology has officially unveiled a whole new range of PIC32 microcontrollers (MCUs). The latest PIC32MK Family consists of 4 highly integrated MCUs for precision dual Motor Control applications (PIC32MK MC) and 8 MCUs carrying serial communication modules for General Purpose applications (PIC32MK GP). All the MC and GP devices are packed with a 120 MHz 32-bit core supporting Digital Signal Processor (DSP) instructions. In addition, a double-precision floating point unit is integrated into the MCU core allowing customers to utilize floating-point based modeling and simulation tools for code development.
CUI Inc’s Power Group has announced to introduce 4 new low power and open frame ac-dc power supply series to the VOF product range. The added series namely VOF-6B, VOF-10B, VOF-15B, and VOF-20B carry 6, 10, 15, and 20 W of power. This makes the existing general purpose ac-dc power supply portfolio range from 6W to 300W. The new offerings are housed in compact and board mount packages measuring 1.913 x 0.917 x 0.638 inches or 48.6 x 23.3 x 16.2 mm in dimensions. These models feature industry standard pin-outs, 4 kVac isolation, and no-load power consumption less than 100 mW. This makes them ideal for low power ITE, industrial, space-constrained, consumer, and smart home applications.
ON Semiconductor has recently extended its portfolio of Interline Transfer Electron Multiplication CCD (IT-EMCCD) image sensors. The new options in the range target low-industrial applications like medical and scientific imaging, as well as, commercial and military applications for high-end surveillance. Discussing the details of the new 4 mp KAE-04471, it is equipped with larger 7.4-micron pixels than those found in the existing IT-EMCCD devices, implying twice the light gathering capability and improved image quality under light starved conditions. The device is pin and package compatible with the existing 8 mp KAE-08151. This would enable manufacturers to leverage the camera designs to support the new device.
CUI’s Thermal Management Group has unveiled a new lineup of Peltier Modules that gets superior performance and reliability from its innovative arctic structure. This unique construction skillfully integrates thermally conductive resin between the ceramic and copper on the module’s cold side with high temperature solder, and larger P/N elements made out of premium silicon ingot. The elasticity of arcTEC’s resin layer facilitates the contraction and expansion during the repeated heating and cooling of normal operation. This reduces the stress on the elements which in turn results in a better thermal connection, superior mechanical bond, and no marked drop-off in performance over time. Besides, the high temperature solder and larger silicon elements allow faster and more uniform cooling.
B&K Precision, a leading designer, and manufacturer of test & measurement solutions, has expanded its bench LCR Meter family by adding two new models. The newly added 894 and 895 models extend the family’s test frequencies up to 1MHz, offering test frequencies from 20 Hz to 500 kHz, and 20 Hz to 1 MHz, respectively. Besides, these are capable of measuring inductance, capacitance, and resistance with 0.05% basic impedance accuracy.