Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced a new automotive Intelligent Power Device (IPD) that will safely and flexibly control power distribution within vehicles — addressing the requirements of next-generation E/E (electrical/electronic) architectures. The new RAJ2810024H12HPD is available in the small TO-252-7 package and reduces the mounting area by about 40%…
Renesas debuts automotive ECU virtualization solution platform
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, recently announced an integrated automotive, electronic control unit (ECU), virtualization platform that enables designers to integrate multiple applications into a single ECU that are safely and securely separated from each other to avoid interference. The solution enables customers to adopt new electrical-electronic (E/E) architectures using MCU-based…
Qualcomm and Alps Alpine deliver advanced automotive in-cabin features
Qualcomm Technologies and Alps Alpine Co. have announced a joint partnership to deliver the Digital Cabin — a proposal for future mobility to enrich a space of style and comfort, even behind the cockpit. The Digital Cabin uses high-performance reference architecture (HPRA), Alps Alpine’s original integrated electronic-control unit (ECU) powered by the 3rd Generation Snapdragon…