Texas Instruments, a global semiconductor design, and manufacturing company has unwrapped the company’s first robotics solution for middle and high school students rendering an enhanced experience of learning STEM subjects. Students will now be able to write programs on their IT graphing calculators that will get the Rover’s wheels turned. This would help their minds learn things in a fun, interactive way. The Rover connects to the TI-Innovator Hub and either a TI-84 Plus CE or TI-Nspire CX graphing calculator that many students already have. It will also drive their interest and curiosity in Science, Technology, Engineering and Math (STEM) subjects. Those who don’t have any exposure to coding or robotics can get started by writing a simple program to make the Rover draw, dance, or even crash.
Congatec, a leading technology company for embedded computer modules, single board computers and embedded design, has launched the Conga-B7AC. This is a new Intel Atom C3000 processor based COM Express Type 7 Server-on-Module that offers an enhanced embedded edge computing through 10 GbE bandwidth support. With a power consumption starting at just 11 Watt, the new low-power multicore Server-on-Modules with up to 16 cores offer up to 4x 10 GbE real-time capable network performance. The feature set has been designed for modular industrial micro servers as well as rugged telecom and network equipment like small cells, factory gateways and storage systems.
Intersil, a subsidiary of Renesas Electronics, has announced the first 42V single-channel DC/DC step-down power module. The ISL8215M delivers up to 15A of continuous current and operates from a single wide input voltage range including industry standard 12V, 18V, and 24V intermediate bus power rails. The module offers adjustable output voltages from 0.6V to 12V and provides the highest power density of 60mA/mm2 in a 13mm x 19mm package. It’s 96.5% peak efficiency enables point-of-load (POL) conversions for FPGAs, DSPs, and MCUs in industrial, medical, RF communications, after-market automotive, and portable equipment carrying Li-ion batteries.
Littlefuse Inc., the global leader in circuit protection, has unveiled a series of high-voltage Fuse Blocks and Fuse Holders meant for the mechanical installation of fuses. The new series has been developed for applications in the range of 400 to 600 volts. It comprises several fuse mounting alternatives so as to accommodate the mechanical design of the application. These devices have been optimized for field servicing of such equipment which is either costly to move or for which the downtime is unacceptable. The series of fuse blocks and holders prevents electric shocks while replacing fuses in the field, thus ensuring the safety of the maintenance personnel.
Silicon Microstructures Inc. (SMI) has launched the new IntraSense product line at the Minimally Invasive Surgery Week Conference in San Francisco this week. IntraSense features biocompatible sensors that fit into 1-French tubing. The sensors are shipped with pre-attached and pre-encapsulated wiring to simplify integration. SMI also offers custom calibration solutions that can be designed to work with customers’ existing equipment. The company has shipped millions of 1-French sensors for minimally invasive surgery and the IntraSenseTM design has a superior performance and is also easy to implement.
STMicroelectronics, a global semiconductor leader, and Sequans Communications, a leading LTE chip maker, have introduced a new LTE-connected tracker platform based on the integration of Sequans and ST technologies. CLOE, an acronym of Connecting and Locating Objects Everywhere, combines the Internet-of-Things (IoT) technologies of two industry leaders into one comprehensive platform for the simplified development of LTE-based IoT tracker devices for the full range of vertical markets including consumer electronics, logistics, and automotive.
Texas Instruments has introduced the most affordable way for developers to implement high-performing DLP display technology with virtually any low-cost processor. The company has released the new 0.2-inch DLP2000 chipset and $99 DLP LightCrafter Display 2000 evaluation module (EVM). This makes it easy to leverage DLP technology and design on-demand, free-form display applications like mobile smart TVs; pico projectors; digital signage; projection displays for smart homes; smartphones and tablets; control panels and Internet of Things (IoT) display solutions.
Renesas Electronics, a premier supplier of semiconductor solutions has introduced new software packages for the R-Car automotive computing platform to improve security and safety functionalities for the next-generation of connected cars. These packages implement embedded systems to avail security features that protect the car from external threats and also ensure continued safe operation even in case of failures. The new package aims to counter various security and safety concerns like protecting the car from malicious attacks over the network, integration challenges for OEMs, requirement for a system that safely handles the car even during failures, etc. The packages offered by Renesas that can handle all such issues include: Virtualization Package, Security Package, and Functionality Package.