Since relays and fuses cannot meet the requirements of modern E/E vehicle architectures, partial or complete electrification of the primary and secondary power distribution must be taken into account. To address this issue, Infineon Technologies has launched a new generation of ultra-low ohmic high-side switches in a TO-leadless package, the Power PROFET + 12V switch…

Infineon Technologies has introduced two new XENSIV barometric air pressure (BAP) sensors: the KP464 and KP466 for automotive applications. While the KP464 is primarily designed for engine control management, the KP466 BAP sensor is intended for seat comfort functions. KP464 enables fuel efficiency, reducing power consumption The KP464 BAP sensor measures atmospheric pressure, which depends…

STMicroelectronics, a global semiconductor, is enabling more acoustically comfortable cars, with its new sensor for road-noise cancellation (RNC) through active noise-control (ANC) techniques. Vehicles have traditionally been defined by engine performance, exterior design, and powertrains, but drivers and passengers are increasingly focused on comfort. While electric vehicles (EVs) are intrinsically less noisy than internal combustion…

Nexperia, a semiconductor provider, announced that one of its surface-mount device packages — the clip-bond FlatPower package CFP15B — has passed Board-level Reliability (BLR) testing for automotive applications by a top Tier 1 supplier. Initially, the FlatPower package will be used in an engine-control unit. BLR provides a means of evaluating the reliability of semiconductor…