TSMC recently announced the opening of its Advanced Backend Fab 6, the company’s first all-in-one automated advanced packaging and testing fab to realize 3DFabric integration of front-end to back-end process and testing services. The fab is prepared for mass production of TSMC-SoIC (System on Integrated Chips) process technology. Advanced Backend Fab 6 enables TSMC to…
Texas Instruments to construct 300-mm semiconductor wafer fabrication plants
Texas Instruments (TI) has announced plans to begin construction next year on its new 300-millimeter semiconductor wafer fabrication plants (or “fabs”) in Sherman, Texas. The North Texas site has the potential for up to four fabs to meet demand over time, as semiconductor growth in electronics, particularly in industrial and automotive markets, is expected to continue well…
STMicroelectronics and Tower partner to accelerate ST Agrate R3 300mm fab production
STMicroelectronics, a global semiconductor provider, is partnering with Tower Semiconductor, which offers high-value analog semiconductor solutions. ST will welcome Tower to its Agrate R3 300mm fab under construction on its Agrate Brianza site in Italy. Together, ST and Tower will join forces for an accelerated fab ramp-up — a key factor to reach a high-use…