As digitalization, urbanization, and the rise of electro-mobility continue to shape the rapidly evolving world, the demand for power consumption is reaching unprecedented levels. Acknowledging energy efficiency as an important concern, Infineon Technologies addresses these megatrends with its silicon carbide (SiC) CoolSiC MOSFET 650 V in TO leadless (TOLL) packaging. The new SiC MOSFETs are…
Infineon’s QDPAK and DDPAK cooling packages registered for JEDEC standard
The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies has announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC…
Samsung sampling the first GDDR6 memory that delivers speeds up to 24Gbps
Samsung Electronics, a provider in advanced memory technology, announced that it has begun sampling the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) DRAM featuring 24-gigabit-per-second (Gbps) processing speeds. Built on Samsung’s third-generation 10-nanometer-class (1z) process, using extreme ultraviolet (EUV) technology, the new memory is designed to significantly advance the graphics performance for…
Microchip earns JEDEC qualification for radiation-tolerant FPGA
Developers of small-satellite constellations and other systems used in New Space missions must deliver high reliability and radiation protection while meeting stringent cost and scheduling requirements. Microchip Technology has now given them a faster, more economical production path with the first radiation-tolerant (RT) FPGA that offers the low cost of a JEDEC-qualified plastic package, plus…