The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies has announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC…
Samsung sampling the first GDDR6 memory that delivers speeds up to 24Gbps
Samsung Electronics, a provider in advanced memory technology, announced that it has begun sampling the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) DRAM featuring 24-gigabit-per-second (Gbps) processing speeds. Built on Samsung’s third-generation 10-nanometer-class (1z) process, using extreme ultraviolet (EUV) technology, the new memory is designed to significantly advance the graphics performance for…
Microchip earns JEDEC qualification for radiation-tolerant FPGA
Developers of small-satellite constellations and other systems used in New Space missions must deliver high reliability and radiation protection while meeting stringent cost and scheduling requirements. Microchip Technology has now given them a faster, more economical production path with the first radiation-tolerant (RT) FPGA that offers the low cost of a JEDEC-qualified plastic package, plus…