Nexperia, an expert in essential semiconductors, has released new, enhanced electrothermal models for its MOSFET devices. Semiconductor manufacturers commonly provide simulation models for their MOSFETs. But these typically only include a limited number of device parameters that have been modeled at typical operating temperatures. Nexperia’s new advanced models capture the thermal interdependency of the complete…
Microchip unveils industry’s lowest on-resistance 3.3 kV silicon-carbide power devices
System designers of traction power units (TPUs), auxiliary power units (APUs), solid-state transformers (SSTs), industrial motor drives, and energy infrastructure solutions require high-voltage switching technology to increase efficiency, reduce system size and weight. Microchip Technology has announced the expansion of its SiC portfolio with the release of the industry’s lowest on-resistance [RDS(on)] 3.3 kV SiC…
Next-generation EiceDRIVER 2EDN gate driver ICs set new benchmark for form factor
Infineon Technologies is releasing a new EiceDRIVER 2EDN product family. Aiming at space-limited designs, the next-generation devices complement the existing 2EDN driver ICs by providing higher system-level efficiencies, excellent power density, and consistent system robustness with fewer external components. Building on this expansion, the 2EDN family can now drive the power-switch device performance in applications…