NXP Semiconductors has announced the MC33777, a battery junction box integrated circuit (IC) that combines sense, think, and act capabilities for battery management systems. The MC33777 integrates pack-level functions into a single device, which differs from conventional solutions that use multiple discrete components, external actuators, and processing support. The MC33777 IC monitors battery current and…
iWave launches SMARC-compliant system on module
iWave has launched the iW-RainboW-G61M System on Module, powered by NXP Semiconductors’ i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity. The System on Modules and evaluation kits from iWave will be available for evaluation starting in April 2024. The SoM leverages the multi-core architecture…
NXP advances IoT connectivity with industry’s first secure tri-radio device
NXP Semiconductors has announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2, and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive, and industrial use-cases. It also supports the new groundbreaking Matter connectivity protocol. The IW612…
NXP releases applications processor for advanced V2X and IIoT
NXP Semiconductors announced that it will showcase new safety scenarios, enabled by vehicle-to-vehicle communication (Vehicle-to-X or V2X), as part of this year’s ITS World Congress in Hamburg. NXP will work together with partners, such as premium manufacturer Riese & Müller, to highlight better protection for vulnerable road users and new V2X application scenarios — designed to…
NXP and MOTER partner to extend connected vehicle insurance
NXP Semiconductors and MOTER Technologies, an insurtech company focused on bridging the gap between the automotive and insurance ecosystems, have announced a secure data exchange platform. It links deep data from connected vehicles to the insurance industry to power data science solutions for risk assessment, cost modeling, and more. The platform combines NXP’s S32G2 vehicle…
NXP combines technologies to drive optimal 5G network performance
NXP Semiconductors N.V. recently announced an industry milestone for 5G energy efficiency with the integration of Gallium Nitride (GaN) technology to its multi-chip module platform. Building on the company’s investment in its GaN fab in Arizona — the most advanced fab dedicated to RF power amplifiers in the U.S. — NXP is the first to…
NXP and Jio partner to expand 5G in India
NXP Semiconductors and Jio Platforms Ltd. (JPL) have announced a collaboration to implement a 5G NR O-RAN, small-cell solution that incorporates NXP’s Layerscape family of multicore processors. The combined solution will power new RAN networks that will deliver high performance, enabling a wide range of 5G use cases for broadband access as well as Industry 4.0…
NXP ramps up automotive processor production with TSMC technology
NXP Semiconductors, a provider in automotive processing, teamed up with TSMC to release NXP’s S32G2 vehicle network processor and the S32R294 radar processor. These products are now in volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology. This marks the migration of NXP’s S32 family of processors to increasingly advanced process nodes as…
NXP offers world’s first QFN solution, enabling Wi-Fi 6/6E in smartphones and devices
OnePlus, a global mobile-technology company, has officially selected NXP’s QFN RF Front-End Solution for Wi-Fi 6 for its latest high-end flagship smartphone: the OnePlus 9 featuring Wi-Fi 6 The QFN solution supports the latest Wi-Fi 6 wireless network standard, as well as the new 6GHz spectrum. The new OnePlus handset is the industry’s first smartphone…
NXP expands its EdgeVerse portfolio with crossover application processors
NXP Semiconductors N.V. announce the expansion of its EdgeVerse portfolio with crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as the next-generation i.MX 9 series of high-performance intelligent applications processors. The expansion includes innovations with EdgeLock secure enclave to enhance edge security and Energy Flex architecture…
Introducing The Fusion Project: An automotive industry collaboration
Airbiquity, Cloudera, NXP Semiconductors, Teraki, and Wind River have joined forces to create The Fusion Project, an automotive industry collaboration to define a streamlined data lifecycle platform to advance intelligent connected vehicles. The pre-integrated hardware and software solution combines innovative technologies from innovative companies for automakers to efficiently collect, analyze, and manage connected vehicle data…
NXP launches new zero-touch, secure cloud platform for edge devices
NXP Semiconductors N.V., a global provider of secure Internet-of-Things (IoT) embedded solutions serving customers across a broad spectrum of applications and markets, today introduced its new EdgeLock 2GO IoT service platform for easy, secure deployment and management of IoT devices and services. The new IoT security platform is integrated with NXP’s Common Criteria (CC) EAL…
iWave offers Qseven SOM based on i.MX 8 QuadMax/QuadPlus processor
iWave Systems has launchee a new Qseven SOM that’s based on the i.MX 8 QuadMax/QuadPlus applications’ processor from NXP Semiconductors. The i.MX 8 QuadMax/QuadPlus SoC integrates heterogeneous multicore 64-bit Arm Cortex-A72, Cortex-A53 and Dual Cortex-M4F Cores with an array of features. These include Dual GPU systems and the 4K H.265-capable VPU that are designed for…
NXP launches new-generation Airfast RF Multi-Chip modules
NXP Semiconductors N.V. announced the availability of its 2nd generation of comprehensive Airfast RF power Multi-Chip Modules (MCMs) designed to support the evolution of 5G mMIMO active antenna system requirements for cellular base stations. Focused on accelerating the coverage of 5G, the new all-in-one power amplifier module family is based on NXP’s latest LDMOS technology that…
NXP optimizes automotive software for security and quality-compliance
NXP Semiconductors N.V. has announced the S32K3 microcontroller (MCU) family — the newest addition to its S32K product line. The S32K1 family, released in 2017, marked an important turning point in addressing software’s central role in automotive development. Designed for automotive body electronics, battery management, and emerging zone controllers, the S32K1 family continues to simplify software…
NXP enhances machine-learning capabilities
NXP Semiconductors N.V. announced that it is enhancing its machine learning development environment and product portfolio. Through an investment, NXP has established an exclusive, strategic partnership with Canada-based Au-Zone Technologies to expand NXP’s eIQ Machine Learning (ML) software development environment with easy-to-use ML tools and expand its offering of silicon-optimized inference engines for Edge ML.…
NEC selects NXP RF Airfast Multi-chip Modules for 5G rollout
NEC Corporation has selected NXP Semiconductors N.V. to supply RF Airfast multi-chip modules, which will be used in a Massive MIMO 5G antenna Radio Unit (RU) for Rakuten Mobile, one of Japan’s leading mobile network operators. NEC’s Massive MIMO 5G antenna RU features a 5G open virtual radio access network (vRAN) interface and has been…
NXP unveils 2×2 Wi-Fi 6 + Bluetooth solutions for IoT markets
NXP Semiconductors N.V. recently announced its family of 2×2 Wi-Fi 6 (802.11ax) Dual Band + Bluetooth/BLE solutions that are driving a new phase of connectivity innovation for advanced gaming, audio, industrial, and IoT markets. Enabling the world’s first Wi-Fi 6 enabled gaming console, NXP’s optimized IW62X family of products will provide increased capacity, efficiency, and performance for…
NXP offers enhanced security for contactless smart city services
NXP Semiconductors N.V. has launched a new MIFARE DESFire EV3 IC that provides advanced security and seamless integration of mobile services for connectivity in smart city services. As the third evolution of NXP’s proven contactless MIFARE DESFire portfolio, the latest IC is backwards compatible and offers enhanced performance with a greater operating distance and improved…
IAR Systems enhances security compliance for embedded applications
IAR Systems, the future-proof supplier of software tools and services for embedded development, recently announced the addition of support for a number of MCU devices from NXP Semiconductors within its security development tool C-Trust. This enhanced device support helps embedded developers to implement security and meet new compliance standards from recent security legislations for IoT…