TSMC recently announced the opening of its Advanced Backend Fab 6, the company’s first all-in-one automated advanced packaging and testing fab to realize 3DFabric integration of front-end to back-end process and testing services. The fab is prepared for mass production of TSMC-SoIC (System on Integrated Chips) process technology. Advanced Backend Fab 6 enables TSMC to…
Samsung’s Neo QLED combines innovation and sustainability
Samsung Electronics is continually striving to incorporate environmental sustainability into everything it does. The company’s products are thoughtfully designed to minimize their impact on the environment throughout their lifecycle – from the planning and manufacturing stages to their use and recycling. This includes using power-efficient semiconductor chips, sustainable packaging, and energy-saving technology. It also means…