Nearly every electronic device today relies on a battery as a power source. The dc-dc converter plays a significant role in maintaining the working time of the battery. A buck-boost dc-dc converter is an ideal choice for the most efficient and reliable battery range. The buck-boost converter provides the regulated voltage in the Lithium (Li-ion)…
Nexperia and KYOCERA AVX to produce silicon-carbide rectifier module
Nexperia, a semiconductor provider, announced it has entered into a partnership with KYOCERA AVX Components, an international supplier of advanced electronic components, to jointly produce a new 650 V, 20 A silicon-carbide (SiC) rectifier module. The new rectifier module will be for high-frequency power applications ranging from 3 to 11 kW power stack designs —…
Renesas develops space-ready reference design for AMD Versal adaptive SoC
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced a complete space-ready reference design for the AMD Versal adaptive system-on-chip (SoC) XQRVC1902. Developed in collaboration with AMD, the ISLVERSALDEMO2Z reference design integrates key radiation-hardened components for power management, including four new and recently released products in an ultra-compact design. These Intersil-brand ICs are specifically…
STMicroelectronics’ octal high-side switches offer protection and diagnostics
STMicroelectronics’ IPS8160HQ and IPS8160HQ-1 new high-side switches provide eight channels in a compact QFN48L package — with the added value of built-in protection and diagnostics. This unique combination of features saves space and enhances reliability in PLC modules used for driving heavy loads and unidirectional motors in vending machines. Additional applications for the new switches include I/O peripherals…
Nexperia introduces in-vehicle network ESD protection portfolio
Nexperia, an expert in essential semiconductors, has introduced an AEC-Q101-qualified portfolio with six ESD protection devices (PESD2CANFD36XX-Q). They’re designed to protect bus lines in automotive in-vehicle networks (IVN) such as LIN, CAN, CAN-FD, FlexRay, and SENT from damage caused by electrostatic discharge (ESD) and other transients. As data rates increase and vehicles feature more electrification,…
Vishay introduces new series of automotive-grade, surface-mount standard rectifiers
Vishay Intertechnology has introduced three new series of automotive-grade, surface-mount standard rectifiers that are the industry’s first devices in the low-profile DFN3820A package with wettable flanks. Providing space-saving, high-efficiency solutions for power line polarity protection and rail-to-rail protection in commercial, industrial, and automotive applications, the 2 A SE20Nx, 3 A SE30Nx, and 4 A SE40Nx are each…
Infineon’s QDPAK and DDPAK cooling packages registered for JEDEC standard
The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies has announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC…
STMicroelectronics launches 32-channel ultrasound transmitter for handheld scanners
STMicroelectronics has expanded its family of advanced ultrasound transmitters by adding a 32-channel variant with high output current for portable applications. The new transmitter, STHVUP32, provides ±800mA aimed at portable systems that demand extra drive capability for a coaxial cable-mounted probe. Joining the portfolio alongside the 64-channel STHVUP64, the new 32-channel version contains similar features to increase performance…
Renesas launches intelligent power device for vehicles
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced a new automotive Intelligent Power Device (IPD) that will safely and flexibly control power distribution within vehicles — addressing the requirements of next-generation E/E (electrical/electronic) architectures. The new RAJ2810024H12HPD is available in the small TO-252-7 package and reduces the mounting area by about 40%…
Infineon offers MOTIX 3-phase gate driver IC with power management
The MOTIX family for automotive and industrial motor-control applications from Infineon Technologies offers a broad product portfolio with various levels of integration. To further expand its offering, Infineon introduces the MOTIX 3-phase gate driver IC 6ED2742S01Q. The 160 V silicon-on-insulator (SOI) gate driver features an integrated power management unit (PMU) and is available in a…
Diodes launches three-level configurable slew-rate controlled power switch
Diodes Incorporated has introduced a new versatile single-channel high-side power switch. The DIODES AP22980 features three different selectable slew rates so that wider capacitance loads can be handled while keeping inrush currents down, ensuring system stability. This power switch is targeted at the solid-state data storage systems used in portable electronic equipment, computer hardware, and…
STMicroelectronics offers new wireless power receiver for fast Qi-compliant charging
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has revealed a wireless power receiver with the industry’s highest available power rating of 100 Watts. Ensuring the fastest wireless charging times in the market today, ST’s new STWLC99 device can recharge high-end smartphones with the largest battery capacity in less than 30…
Broadcom and Tencent to accelerate adoption of co-packaged optics network switches
Broadcom Inc. and Tencent Holdings Ltd. have announced a strategic partnership to accelerate the adoption of high-bandwidth co-packaged optics (CPO) network switches for cloud infrastructure. Under this partnership, Broadcom will provide the 25.6-Tbps Humboldt CPO switch device that features Broadcom’s best-in-class StrataXGS Tomahawk 4 switch chip directly coupled and co-packaged with four 3.2-Tbps Silicon Photonics Chiplets In…
Vishay offers new low-profile, high-current power inductors
Vishay Intertechnology has expanded its IHHP series of low-profile, high-current power inductors with three new devices in compact 0603, 0805, and 0806 case sizes. Combining low DCR and core losses with a low maximum height of 0.8 mm, the Vishay Dale IHHP-0603ZH-01, IHHP-0805ZH-01, and IHHP-0806ZH-01 are designed to save space and increase efficiency in the Internet of…
Broadcom and Tencent partner on commercialization of co-packaged optics network switch
Broadcom Inc. and Tencent Holdings Ltd. have announced a strategic partnership to accelerate the adoption of high bandwidth co-packaged optics (CPO) network switches for cloud infrastructure. Under this partnership, Broadcom will provide the 25.6-Tbps Humboldt CPO switch device that features Broadcom’s best-in-class StrataXGS Tomahawk 4 switch chip directly coupled and co-packaged with four 3.2-Tbps Silicon Photonics Chiplets…
Diodes launches high-efficiency synchronous boost converter
Diodes Incorporated has introduced a high-efficiency synchronous boost converter. The DIODES AP72250 is targeted at step-up conversion in consumer and industrial applications where small form factors are a priority. These include battery-powered devices, USB power-supply units, power banks, supercapacitor charging equipment, and metering systems. The AP72250 supports a 900kHz switching frequency with a 20µA quiescent…
Infineon combines the hybrid flyback controller XDP with CoolGaN IPS
With the rising number of mobile devices, notebooks, and battery-powered equipment, the need for increased charging power and fast charging has emerged. For engineers, this trend poses the challenge of achieving ever-higher power levels in smaller form factors while simultaneously meeting thermal performance requirements. To address these contemporary design needs, Infineon Technologies combines the hybrid…
Vishay offers new bidirectional, transient voltage suppressors
Vishay Intertechnology has introduced a new series of surface-mount TRANSZORB bidirectional, transient voltage suppressors (TVS) in the SMC (DO-214AB) package for automotive, industrial, and telecom applications. Offering a high-surge capability of 3 kW at 10/1000 μs to meet the specifications of ISO 16750-2 Pulse b, SMC3KxxxCAHM3_A series devices provide low leakage current down to 1…
Infineon expands its CoolSiC portfolio
The increasing demand for high-power density is pushing developers to adopt 1500 VDC link in their applications to increase the rated power-per-inverter and reduce system costs. However, 1500 VDC-based systems also pose more challenges on the system design, such as fast switching at high DC voltage, which typically requires a multi-level topology. This leads to…
TI addresses power-management design challenges for EVs and industrial applications
Texas Instruments (TI) demonstrated at the Applied Power Electronics Conference (APEC) last week, focused on how engineers can overcome some of their most pressing power-management design challenges. The company showcased the newest additions to its power-management portfolio and demonstrate system-level solutions for increasing power density, reducing electromagnetic interference (EMI), noise, and quiescent current (IQ), and…