Texas Instruments (TI) announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions. TI developed a new device screening specification called space high-grade in plastic (SHP) for radiation-hardened products and introduced new analog-to-digital converters (ADCs) that meet the SHP qualification. TI also introduced…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off on November 16th. Intersil-brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort…

Designers of spaceflight-qualified systems have a great need to reduce development time, cost, and risk in their systems. Microchip Technology has proposed the concept of starting with commercial-off-the-shelf (COTS) devices, then replacing them with space-qualified, radiation-tolerant (RT) equivalent parts. Now, Microchip is announcing that it has extended its family of COTS-based, RT SuperFlash devices for…

Infineon Technologies announced the availability of the space industry’s first radiation-hardened (rad-hard), serial -nterface Ferroelectric RAM (F-RAM) for extreme environments. The new devices deliver unsurpassed reliability and data retention and are more energy efficient than non-volatile EEPROM and serial NOR Flash devices for space applications. The addition of a QML-V qualified F-RAM to Infineon’s memory…